DESIGN AND REUSE The Catalyst of Collaborative SoC Design through IP Exchange www.design-reuse.com WELCOME ======= Welcome to issue of December 9, 2003 of D&R SoC News Alert, our email update to provide you with the latest news and information in the System-On-Chip Community. ********************************************************************* * NEW ON D&R WEB SITE !!!! * SOI (Silicon on Insulator) Corner: Visit this new corner * highlighting the benefits of Silicon On Insulator technology at * http://www.us.design-reuse.com/soi/ * In Cooperation with SOISIC (http://www.soisic.com) ********************************************************************* NEW IP / SOC PRODUCTS ===================== # AES Co-processor from Jennic http://www.us.design-reuse.com/go/?i=16774&u=54310 # AMBA 2.0 compliant DMA Controller from Global UniChip http://www.us.design-reuse.com/go/?i=16773&u=54310 # Dual MAC 16-bit fixed point DSP from Ceva, Inc http://www.us.design-reuse.com/go/?i=16772&u=54310 # USB2.0 PHY FS/HS 3.3/1.8/1.8 UTMI on SMIC 0.18um Digital CMOS process from ChipIdea Microelectronics http://www.us.design-reuse.com/go/?i=16771&u=54310 # AHB Hardware Protocol Kit automatically creating properties and environment for AHB from TransEDA http://www.us.design-reuse.com/go/?i=16775&u=54310 # Configurable UART with FIFO functionally identical to the TL16C750 from Digital Core Design http://www.us.design-reuse.com/go/?i=16749&u=54310 WANTED IPs !!! ============== # 1394a and 1394b Analog PHY http://www.us.design-reuse.com/go/?i=26748&u=54310 # Audio IPs (AC97 & IIS) http://www.us.design-reuse.com/go/?i=26747&u=54310 INDUSTRY ARTICLES ================= # A Layered Verification Approach Applied to an AMBA-Based System http://www.us.design-reuse.com/go/?i=36779&u=54310 # Faster serdes links force system view http://www.us.design-reuse.com/go/?i=36770&u=54310 # Breakfast in the Valley: Who Owns the IP? http://www.us.design-reuse.com/go/?i=36776&u=54310 # Implementing IKE Capabilities in FPGA Designs http://www.us.design-reuse.com/go/?i=36769&u=54310 HEADLINE NEWS ============= # Multiband-OFDM Alliance seeks to lift UWB licensing clouds http://www.us.design-reuse.com/go/?i=46768&u=54310 # Analog IP from LTrim Technologies rolls for TSMC processes http://www.us.design-reuse.com/go/?i=46767&u=54310 # Actel Enhances Libero Tool Suite to Boost Performance and Support for ProASICPLUS FPGAs http://www.us.design-reuse.com/go/?i=46765&u=54310 # Altera HardCopy Devices Speed Development of New Motorola Horizon II BTS Portfolio http://www.us.design-reuse.com/go/?i=46764&u=54310 # Faraday adopts Cadence Encounter Platform for Structured ASIC design http://www.us.design-reuse.com/go/?i=46763&u=54310 # Xilinx Unveils Revolutionary FPGA Architecture, Enables Next-Generation Platform FPGAs http://www.us.design-reuse.com/go/?i=46762&u=54310 # Tower Semiconductor standardizes on TriCN's interface IP http://www.us.design-reuse.com/go/?i=46761&u=54310 # AMI Semiconductor Integrates 8051 Core and I3T- based SoC Enabling Reduced Component Count Designs http://www.us.design-reuse.com/go/?i=46760&u=54310 # ParthusCeva Changes Name to CEVA, Inc. http://www.us.design-reuse.com/go/?i=46759&u=54310 # CEVA Announces Launch And Licensing Of Pioneering CEVA-X DSP Architecture http://www.us.design-reuse.com/go/?i=46758&u=54310 # Actel's Advanced Packaging Technology Delivers High-Density, Programmable Alternative to Known Good Die http://www.us.design-reuse.com/go/?i=46750&u=54310 # Fujitsu/Fujitsu VLSI adopts Legend Design Technology's CharFlo-Memory! Toolset for Memory Characterization http://www.us.design-reuse.com/go/?i=46744&u=54310 # Actel's Protocol Design Services Group Selects HelloSoft's Wireless LAN IP http://www.us.design-reuse.com/go/?i=46778&u=54310 # ARC International plc announces the resignation and departure from his position with immediate effect of Mike Gulett, Chief Executive Officer http://www.us.design-reuse.com/go/?i=46752&u=54310 # DCM Technologies announces availability of IEEE802.11 Mulitmode MAC on the Accelerated Technology Nucleus Plus Kernel http://www.us.design-reuse.com/go/?i=46745&u=54310 # HelloSoft Introduces Industry's First Fully Customizable Wireless LAN IP Solution http://www.us.design-reuse.com/go/?i=46777&u=54310 # Townshend Intellectual Property LLC claims legal victory over ADI in modem suit http://www.us.design-reuse.com/go/?i=46766&u=54310 # NewLogic Releases its Embeddable Wireless LAN 802.11g Modem IP Core http://www.us.design-reuse.com/go/?i=46756&u=54310 # New ARM9E Family Core Provides Unrivalled Low-Power Performance http://www.us.design-reuse.com/go/?i=46755&u=54310 # LG Electronics Picks Tensilica's Xtensa Processor For the Digital Multimedia Broadcasting Project of the Korean Government http://www.us.design-reuse.com/go/?i=46754&u=54310 # High-Density Packaging Solution Further Extends Actel's Reach Into Space and Military Markets http://www.us.design-reuse.com/go/?i=46751&u=54310 # StarCore LLC Secures Third Round of Funding http://www.us.design-reuse.com/go/?i=46757&u=54310 # CoWare Advances Design of Ultra Wideband (UWB) Wireless Networking Products With Library Support Through Its Signal Processing Worksystem (SPW) http://www.us.design-reuse.com/go/?i=46753&u=54310 ********************************************************************* * NEW ON D&R WEB SITE !!!! * SOI (Silicon on Insulator) Corner: Visit this new corner * highlighting the benefits of Silicon On Insulator technology at * http://www.us.design-reuse.com/soi/ * In Cooperation with SOISIC (http://www.soisic.com) ********************************************************************* ##################################################################### REGISTER: If this newsletter was forwarded to you by a colleague, you can have it sent directly to you at no cost. 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