Transmeta to use TSMC for 0.18- and 0.13-micron processors
![]() |
Transmeta to use TSMC for 0.18- and 0.13-micron processors
By Mark Hachman, TechWeb News
November 14, 2000 (1:56 p.m. EST)
URL: http://www.eetimes.com/story/OEG20001114S0045
LAS VEGAS -- During the Comdex trade show here, Transmeta Corp.'s chief executive officer confirmed that the microprocessor startup has entered into a foundry deal with Taiwan Semiconductor Manufacturing Co. Ltd., which will process chips with 0.18- and 0.13-micron technology. Until now, IBM Corp. has been Transmeta's sole foundry for processed wafers. Transmeta CEO David Ditzel said TSMC will help his company reach 700-MHz clock speeds with a 0.18-micron process in the first half of 2001. In the second half of next year, TSMC will produce 800- or 900-MHz chips for Transmeta, using the foundry company's new 0.13-micron process technology, Ditzel said. Currently, Transmeta's 5600 PC chip runs only at 600 MHz, leaving some analysts to wonder if supply issues had surfaced. Ditzel denied that his company was having trouble securing processed wafers. "IBM is a wonderful partner," he said, referring to Transmeta's current foundry source. But the S anta Clara, Calif., company is turning to the world's largest silicon foundry supplier, TSMC, to boost performance of its processors in 2001, and it's planning major enhancements to its chip architecture. In 2002, Transmeta will move to a new, unnamed architecture. The "new Crusoe" will, according to Ditzel, double performance by moving to a 256-bit interface and executing eight instructions per cycle and five on a typical basis. The current TM 5600 is a 128-bit chip that executes four instructions per cycle maximum and a statistical average of 2.7. The new Crusoe will lower power under 0.5 W through a new CMS revision, although the die shrink to 0.13 micron should keep the die size about the same, approximately 90 square mm.
Related News
- Grace Semiconductor Expands Access to 0.18- and 0.13-Micron Processes With Adoption of ARM Physical IP
- Tower Semiconductor Debuts In-house 0.18- and 0.13-Micron Libraries
- Synopsys to Distribute Tower Semiconductor's 0.18- and 0.13-Micron Silicon Libraries within DesignWare Library
- TSMC Starts Production of 0.13-micron Embedded Flash Process
- Kilopass Announces Collaboration with TSMC in Embedded Non-volatile Memory Technology and Qualification of 0.13-micron Process Technology
Breaking News
- RISC-V International Promotes Andrea Gallo to CEO
- See the 2025 Best Edge AI Processor IP at the Embedded Vision Summit
- Andes Technology Showcases RISC-V AI Leadership at RISC-V Summit Europe 2025
- RISC-V Royalty-Driven Revenue to Exceed License Revenue by 2027
- Keysom Unveils Keysom Core Explorer V1.0
Most Popular
- RISC-V Royalty-Driven Revenue to Exceed License Revenue by 2027
- SiFive and Kinara Partner to Offer Bare Metal Access to RISC-V Vector Processors
- Imagination Announces E-Series: A New Era of On-Device AI and Graphics
- Siemens to accelerate customer time to market with advanced silicon IP through new Alphawave Semi partnership
- Cadence Unveils Millennium M2000 Supercomputer with NVIDIA Blackwell Systems to Transform AI-Driven Silicon, Systems and Drug Design
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |