New Version of SonicsMX Improves SoC Performance and Power Management

SMART Interconnect Eases Video Cell Phone Design

MOUNTAIN VIEW, Calif.--Aug. 8, 2005--Sonics, Inc.®, the premier supplier of system-on-chip (SoC) SMART Interconnects(TM), today announced availability of the newest version of its popular SonicsMX SMART Interconnect which contains power management features that address wireless handheld applications such as cell phones.

As cell phone developers begin to incorporate streaming video applications into their product lines, power management becomes paramount in order to preserve reasonable battery life while increasing processing power and memory utilization. The new version of SonicsMX adds voltage domain isolation and "wake-up on activity" features designed to ease the power management challenge. Additionally, the availability of a complete implementation fabric for activity reporting, clock and voltage mode transitions, and power mode-dependent error management also enables SoC developers to control power at multiple levels, from subsystems to specific cores.

"In the distributed heterogeneous processing environment frequently employed in today's SoCs, the internal interconnect uniquely knows the transactional state of the system and is thus the only rational place to measure activity and manage power transitions," says Drew Wingard, chief technology officer at Sonics. "By employing SonicsMX, SoC developers can now efficiently manage performance and power all within the interconnect."

SonicsMX is currently being used by Texas Instruments and Toshiba, among others, to produce a wide range of semiconductor devices for wireless handheld applications, including cell phones.

Availability

SonicsMX, with new power management features, is currently available. For further information contact 1.650.938.2500 or visit www.sonicsinc.com.

About Sonics

Sonics, Inc. is the premier supplier of SMART Interconnects that deliver high SoC design predictability and increased design efficiency. Major semiconductor and systems companies including Broadcom, Samsung, Texas Instruments and Toshiba have applied Sonics' SMART Interconnects in leading products in the wireless, digital multimedia and communications markets. Sonics is a privately held company funded by Investar Capital, Smart Technology Ventures, TL Ventures, Easton Hunt Capital, JAFCO Ventures, and H&Q Asia-Pacific. For more information, see www.sonicsinc.com

Sonics is a registered trademark and SMART Interconnects is a trademark of Sonics, Inc. All other trademarks are the property of their respective owners.

Source: Sonics, Inc.