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MIPI D-PHY/LVDS Combo TX (Transmitter) for Automotive in Samsung 28FDSOI
Sonics files for IPO
Peter Clarke, EE Times
(08/27/2007 10:42 AM EDT)
LONDON -- Sonics Inc. (Mountain View, Calif.) has filed forms with the Securities & Exchange Commission for an initial public offering of common stock.
Sonics provides interconnect intellectual property and EDA tools to configure it for use joining blocks together on system chips. According to one report Sonics is looking to raise $80 million in the IPO.
(08/27/2007 10:42 AM EDT)
LONDON -- Sonics Inc. (Mountain View, Calif.) has filed forms with the Securities & Exchange Commission for an initial public offering of common stock.
Sonics provides interconnect intellectual property and EDA tools to configure it for use joining blocks together on system chips. According to one report Sonics is looking to raise $80 million in the IPO.
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