Dolphin Integration launches new microcontroller configurations

Grenoble, France -- April 10, 2009 -- Dolphin Integration, the Enabler of mixed signal Systems-on-Chip, launches new microcontroller configurations and bundles of the i80251 legacy for best density and lowest power consumption.

Best-in-class libraries and power management units now complement the extensive set of expected peripherals such as UART, I2C, SPI, In-Circuit Emulator... to help SoC integrators achieve the best performance in a configuration around its 16-bit cores which are meeting a growing demand.

On the one hand, the combination of SESAME uHD, the ultra High Density library of standard cells, with the 16-bit Flip80251 Typhoon, provides ultimate area optimization. With a mere 0.15 mm2 at 0.18 µm, it provides high performance and i8051 upward compatibility. Moreover, the high code density of this microcontroller permits area savings on embedded program memory (RAM). As a result, it is the preferred solution for new SoCs targeting ultra low cost.

On the other hand, the combination of SESAME uLC, the ultra Low Consumption library of standard cells with the same 16-bit Flip80251 Typhoon, together with the inductorless DC-DC converter, provides ultimate means for lowering SoC power consumption. These inductorless DC-DC converters benefit from a regulation loop being patented, which provides a linear efficiency whatever the load variation.
 
With a consumption as low as 209 µA/DMIPS at 0.18 µm, this 16-bit core permits consumption savings up to 90% compared to the 80C51 and up to 66% compared to an accelerated 8051.

“Such a consistent set of Silicon IP products succeeds at crushing SoC area”, confides Jean-Francois Pollet, Vice President for product development. “Major foundries and SoC integrators acknowledge it enables to star outstanding performances, even in mature processes...”

The uHD and uLC stems of standard cell library SESAME benefit from a stringent qualification process and are approved and referenced by leading foundries. Now various fabrication processes from 0.18 µm down to 65 nm, including shrunk nodes such as 0.16 µm, 0.152 µm, 0.11 µm, are supported at most popular foundries.
 
For more information about i80251, click here