TSMC returns fire over 28-nm process issues
Peter Clarke, EETimes
1/26/2012 10:22 AM EST
LONDON – Foundry Taiwan Semiconductor Manufacturing Co. Ltd. has hit back at analysts who have said it has yield problems with its 28-nm CMOS manufacturing processes.
Maria Marced, president of TSMC Europe, repeated what has been said before by herself and other TSMC executives before; that defect density reduction is on track for the 28-nm node and ahead of where TSMC was with 40/45-nm process technology at an equivalent stage in its roll out.
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |
|
Related News
- TSMC's 28-nm process in trouble, says analyst
- Altera Unveils Process Technology Strategy for Its 28-nm Product Portfolio
- M31 Technology Develops SRAM Compiler IP on TSMC's 28nm Embedded Flash Process Technology Providing High Performance and Low Power Solutions
- Silicon Creations Celebrates 100th Tape-Out of Its PLL in TSMC 28nm Process Technology
- Menta Embeds sureCore Low Power SRAM IP on TSMC's 28nm Process
Breaking News
- RISC-V International Promotes Andrea Gallo to CEO
- See the 2025 Best Edge AI Processor IP at the Embedded Vision Summit
- Andes Technology Showcases RISC-V AI Leadership at RISC-V Summit Europe 2025
- RISC-V Royalty-Driven Revenue to Exceed License Revenue by 2027
- Keysom Unveils Keysom Core Explorer V1.0
Most Popular
- RISC-V International Promotes Andrea Gallo to CEO
- See the 2025 Best Edge AI Processor IP at the Embedded Vision Summit
- Andes Technology Showcases RISC-V AI Leadership at RISC-V Summit Europe 2025
- Ceva, Inc. Announces First Quarter 2025 Financial Results
- Cadence Unveils Millennium M2000 Supercomputer with NVIDIA Blackwell Systems to Transform AI-Driven Silicon, Systems and Drug Design