Power & area optimized: 2–3-stage, single-issue pipeline, as small as 13.5k gates
TSMC plans 3-D IC assembly launch early in 2013
Peter Clarke, EETimes
2/2/2012 8:32 AM EST
LONDON – Leading IC foundry Taiwan Semiconductor Manufacturing Co. Ltd. plans to announce 3-D IC assembly service as a general offering at the beginning of 2013, according to Maria Marced, president of TSMC Europe.
The technology is called COWOS internally, standing for chip on wafer on substrate and Marced said the company has one year to get all physical design kits and EDA support in place to allow customers to design with COWOS.
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |
|
Related News
- TSMC goes it alone with 3-D IC process
- TSMC Announces Breakthrough Set to Redefine the Future of 3D IC
- proteanTecs Joins TSMC 3DFabric™ Alliance, Expanding Its Support of the 3D IC Ecosystem
- The Importance of 3D IC Ecosystem Collaboration
- TSMC Certifies Synopsys IC Compiler II for the Most Advanced 7-nm Process Node Enabling Early Tapeouts
Breaking News
- RISC-V International Promotes Andrea Gallo to CEO
- See the 2025 Best Edge AI Processor IP at the Embedded Vision Summit
- Andes Technology Showcases RISC-V AI Leadership at RISC-V Summit Europe 2025
- RISC-V Royalty-Driven Revenue to Exceed License Revenue by 2027
- Keysom Unveils Keysom Core Explorer V1.0
Most Popular
- RISC-V International Promotes Andrea Gallo to CEO
- See the 2025 Best Edge AI Processor IP at the Embedded Vision Summit
- Andes Technology Showcases RISC-V AI Leadership at RISC-V Summit Europe 2025
- Ceva, Inc. Announces First Quarter 2025 Financial Results
- Cadence Unveils Millennium M2000 Supercomputer with NVIDIA Blackwell Systems to Transform AI-Driven Silicon, Systems and Drug Design