RT-140 Compact Root of Trust for IoT, IIoT and cloud-connected devices, sensors, gateways
Cadence TSMC, ARM call for more collaboration
Rick Merritt, EETimes
3/13/2012 4:23 PM EDT
SAN JOSE, Calif. – Electronics companies need to step up their collaboration to deal with growing complexity of the technology, said executives from Cadence, TSMC and ARM at an annual Cadence user event here.
“Silicon integration and complexity will be a real challenge,” said Lip-Bu Tan, chief executive of Cadence, noting 20 nm chips with eight billion transistors in the works.
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