English
Intel, rivals gird for IC manufacturing showdown
Peter Clarke, EETimes
9/24/2012 1:00 PM EDT
LONDON – Chip giant Intel and the research partnership clustered around IBM and STMicroelectronics are each set to report progress on their approaches to leading-edge IC manufacturing during the International Electron Devices Meeting (IEDM) in San Francisco in December.
Research teams are set to present on the FinFET approach--called tri-gate by Intel--on fully-depleted silicon-on-insulator (FDSOI) and on bulk planar processes at around 20 nm and beyond.
|
E-mail This Article | 
|
|
Printer-Friendly Page |
Related News
- Intel Custom Foundry Certifies Cadence Implementation and Signoff Tools for 10nm Tri-Gate Process
- Intel Custom Foundry Certifies Mentor Graphics Physical Verification and Circuit Simulation Tools for 10nm Tri-Gate Process
- Intel Custom Foundry Certifies Synopsys Implementation and Signoff Tools for 10-nm Tri-Gate Process
- Cadence and Intel Collaborate to Enable a 14nm Tri-gate design Platform for Customers of Intel Custom Foundry
- Synopsys and Intel Collaborate to Enable 14-nm Tri-Gate Design Platform for Use by Customers of Intel Custom Foundry
Breaking News
- RISC-V International Promotes Andrea Gallo to CEO
- See the 2025 Best Edge AI Processor IP at the Embedded Vision Summit
- Andes Technology Showcases RISC-V AI Leadership at RISC-V Summit Europe 2025
- RISC-V Royalty-Driven Revenue to Exceed License Revenue by 2027
- Keysom Unveils Keysom Core Explorer V1.0
Most Popular
- RISC-V International Promotes Andrea Gallo to CEO
- See the 2025 Best Edge AI Processor IP at the Embedded Vision Summit
- Andes Technology Showcases RISC-V AI Leadership at RISC-V Summit Europe 2025
- Ceva, Inc. Announces First Quarter 2025 Financial Results
- Cadence Unveils Millennium M2000 Supercomputer with NVIDIA Blackwell Systems to Transform AI-Driven Silicon, Systems and Drug Design