InterDigital and ASOCS Team to Deliver WCDMA/GGE IP Core Solution
WILMINGTON, Del.-- October 3, 2012-- InterDigital, Inc. (NASDAQ: IDCC) and ASOCS Ltd., a provider of many-core embedded processors, today announced a strategic alliance that will see the integration of InterDigital's SlimChip WCDMA modem IP core and ASOCS' ModemX® platform and R4 GSM/GPRS/EDGE solution. The result: a fully-integrated 2G and 3G modem technology with an upgrade path to HSPA+, TD-SCDMA, and LTE.
This combined offering is designed to provide customers with a technology that can be embedded into wireless product platforms or produce a viable chipset solution in less than a year, while significantly reducing development risk and time to market. The solution will be ideal for customers integrating GSM/WCDMA into multi-mode design with LTE or TD-SCDMA, or companies seeking to enter new market areas while reducing development costs and time.
The combined offerings of ASOCS and InterDigital result in the SlimChip modem IP core transfer package, which includes a complete 3GPP Release 6 compliant 3G physical layer (with direct upgrade path to Release 7), Release 4 compliant 2G physical layer and dual mode protocol stack implementation. The offering supports HSPA Category 10 (14.4 Mbps DL) and Category 6 (5.76 Mbps UL) as well as GPRS/EGPRS multi-slot class 12.
"The path to new product introduction in wireless can be very challenging and, given the speed with which new players are emerging, any slowdown or mishap can have significant consequences for market penetration. The combined solution by ASOCS and InterDigital is based on proven market-ready technologies, and should enable customers to roll out products quickly and effectively while building an upgrade path to 4G technologies into their roadmap," said Bill Miller, Executive Vice President of IP Sales and Services at InterDigital.
"The strategic alliance with InterDigital is an important milestone in our new strategy towards proliferation of our ModemX technology in the mobile world," said Gilad Garon, Chief Executive Officer of ASOCS. "ModemX is displacing the traditional DSP approach, with a one stop shop of flexibility and performance needed in today's low power designs. Our softwareprogrammable architecture makes it easy for customers to quickly react to changes in their product roadmaps."
About InterDigital®
InterDigital develops fundamental wireless technologies that are at the core of mobile devices, networks, and services worldwide. We solve many of the industry's most critical and complex technical challenges, inventing solutions for more efficient broadband networks and a richer multimedia experience years ahead of market deployment. InterDigital has licenses and strategic relationships with many of the world's leading wireless companies. For more information, visit: www.interdigital.com. InterDigital is a registered trademark of InterDigital, Inc.
For more information, visit the InterDigital website: www.interdigital.com.
About ASOCS
Founded in 2003, ASOCS develops and markets many-core embedded processors that enable full software programmability of physical layer functions and algorithms. The ModemX® family of cores represents a revolutionary approach to communications and runs multiple, distinctly different communication air-interfaces concurrently on a single platform. ASOCS solutions cover a variety of mobile solutions, both for terminals and mobile network infrastructure, as well as other wireless and broadband standards.
For more information, visit the ASOCS website: www.asocstech.com
|
||||||
Related News
- ASOCS and CMCC team up to deliver mass market high capacity, commercially viable C-RAN solutions
- InterDigital to Deliver SlimChip Modem Core to New Entrant to Mobile Chipset Market in China
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- Orthogone Technologies and Blackcore® Technologies Announce Strategic Partnership to Deliver Ultra-Low Latency Solutions for High-Frequency Trading
- Andes Technology Collaborates with Lauterbach to Deliver RISC-V Trace Solution
Breaking News
- RISC-V International Promotes Andrea Gallo to CEO
- See the 2025 Best Edge AI Processor IP at the Embedded Vision Summit
- Andes Technology Showcases RISC-V AI Leadership at RISC-V Summit Europe 2025
- RISC-V Royalty-Driven Revenue to Exceed License Revenue by 2027
- Keysom Unveils Keysom Core Explorer V1.0
Most Popular
- RISC-V International Promotes Andrea Gallo to CEO
- See the 2025 Best Edge AI Processor IP at the Embedded Vision Summit
- Andes Technology Showcases RISC-V AI Leadership at RISC-V Summit Europe 2025
- Ceva, Inc. Announces First Quarter 2025 Financial Results
- Cadence Unveils Millennium M2000 Supercomputer with NVIDIA Blackwell Systems to Transform AI-Driven Silicon, Systems and Drug Design
|
|
E-mail This Article |
|
Printer-Friendly Page |











