Intel's 450-mm wafer spend starts in 2013

Peter Clarke, EETimes
1/24/2013 6:55 AM EST

LONDON – Leading chip company Intel Corp. is planning to spend $2-billion preparing for transition to 450-mm diameter wafers in 2013.

The company has forecast a total capital expenditure for 2013 of $13 billion and the company's chief financial officer Stacy Smith broke the number for 450-mm developments out during a conference call with analysts to discuss the company's 4Q12 financial results.

"Capital spending for our core business is expected to be roughly flat to 2012. Additionally, we will spend roughly $2 billion to start building our first 450-millimeter development facility," Smith said.

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