GLOBALFOUNDRIES Offers Enhanced 55nm CMOS Logic Process with ARM Next-Generation Memory and Logic IP Support for Low Voltage
55nm LPe 1V is optimized for ultra-low power, reduced cost and improved design flexibility
MILPITAS, Calif., February 19, 2013 – GLOBALFOUNDRIES today announced additional enhancements to the foundry’s 55-nanometer (nm) Low-Power Enhanced (LPe) process technology platform – 55nm LPe 1V – with qualified, next-generation memory and logic IP solutions from ARM. The 55nm LPe 1V is the industry’s first and only enhanced process node to support ARM’s 1.0/1.2V physical IP library, enabling chip designers to use a single process that supports two operating voltages in a single SoC.
“The key advantage of this 55nm LPe 1V offering is that the same design libraries can be used whether you are designing at 1.0 voltage or 1.2 voltage power option,” said Bruce Kleinman, Vice President of Product Marketing at GLOBALFOUNDRIES. “What it means is that same set of design rules and models can be adopted, with no extra mask layer or special process required. This translates into cost saving and design flexibility without compromising on the power and optimization features.”
Based on ARM’s 1.0V/1.2V standard cells and memory compilers, GLOBALFOUNDRIES 55nm LPe 1V enables designers to optimize their design for speed, power and/or area and is especially beneficial for designers who are faced with power constraints in designing System-on-Chip solutions.
ARM offers a comprehensive, silicon-validated platform of 8-track, 9-track and 12-track libraries along with high-speed and high-density memory compilers for GLOBALFOUNDRIES’ advanced 55nm LPe process.
“The combination of 1V and 1.2V operation along with supporting level shifting logic provides the best combination of low power, high performance and reduced chip area,” said Dr. John Heinlein, vice president of marketing, Physical IP Division at ARM. “Dual-voltage domain characterization support coupled with Artisan next-generation memory compiler architecture reduces dynamic and leakage power by more than 35 percent, compared to previously available solutions.”
The 55nm LPe 1V is especially suited for high-volume, battery-operated mobile consumer devices, as well as a broad range of green or energy-saving products. PDK and EDA tools are available now, along with MPW shuttle availability.
Artisan memories offer flexible manufacturing options and are shipping in billions of products worldwide. Part of a broader platform of Artisan physical IP from 65nm to 20nm, these next-generation memories include low voltage and stand-by modes enabling extended battery life, ultra high-speed caches for maximum processor speed, and proprietary design techniques resulting in reduced area for low-cost SoC designs.
ABOUT GLOBALFOUNDRIES
GLOBALFOUNDRIES is the world’s first full-service semiconductor foundry with a truly global footprint. Launched in March 2009, the company has quickly achieved scale as the second largest foundry in the world, providing a unique combination of advanced technology and manufacturing to more than 150 customers. With operations in Singapore, Germany and the United States, GLOBALFOUNDRIES is the only foundry that offers the flexibility and security of manufacturing centers spanning three continents. The company’s three 300mm fabs and five 200mm fabs provide the full range of process technologies from mainstream to the leading edge. This global manufacturing footprint is supported by major facilities for research, development and design enablement located near hubs of semiconductor activity in the United States, Europe and Asia. GLOBALFOUNDRIES is owned by the Advanced Technology Investment Company (ATIC). For more information, visit http://www.globalfoundries.com.
|
Related News
- Cadence Announces Broad Next-Generation Memory Standard Support in Samsung Foundry's Advanced Process Technologies
- ARM and GLOBALFOUNDRIES to Optimize Next-Generation ARM Mobile Processors for 28nm-SLP Process Technology
- ARM and GLOBALFOUNDRIES Collaborate to Enable Next-Generation Devices on 20nm and FinFET Process Technologies
- Synopsys, Arm, and Samsung Foundry Enable Accelerated Development of Next-Generation Arm "Hercules" Processor on 5LPE Process
- Arm, Cadence and Xilinx Introduce First Arm Neoverse System Development Platform for Next-Generation Cloud-to-Edge Infrastructure, Implemented on TSMC 7nm Process Technology
Breaking News
- RISC-V International Promotes Andrea Gallo to CEO
- See the 2025 Best Edge AI Processor IP at the Embedded Vision Summit
- Andes Technology Showcases RISC-V AI Leadership at RISC-V Summit Europe 2025
- RISC-V Royalty-Driven Revenue to Exceed License Revenue by 2027
- Keysom Unveils Keysom Core Explorer V1.0
Most Popular
- RISC-V Royalty-Driven Revenue to Exceed License Revenue by 2027
- SiFive and Kinara Partner to Offer Bare Metal Access to RISC-V Vector Processors
- Imagination Announces E-Series: A New Era of On-Device AI and Graphics
- Siemens to accelerate customer time to market with advanced silicon IP through new Alphawave Semi partnership
- Cadence Unveils Millennium M2000 Supercomputer with NVIDIA Blackwell Systems to Transform AI-Driven Silicon, Systems and Drug Design
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |