FDSOI Gains Design Wins Amid Fab Partner Mystery

Peter Clarke, Electronics360
28 January 2014

European chip company STMicroelectronics NV is gaining design wins for its 28nm fully depleted silicon-on-insulator (FDSOI) manufacturing process but is being coy about who will be its initial partner for high volume manufacturing. The date for the start of second-source volume manufacturing of FDSOI chips also appears to have slipped.

Jean-Marc Chery, executive vice president and general manager of embedded processing solutions at ST, told Electronics 360 that the number of FDSOI IC designs in development has risen to 15. That number stood at three about eight months ago. But he also declined to discuss progress at Globalfoundries in bringing up high volume manufacturing capacity of FDSOI chips.

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