MIPI C-PHY v1.2 D-PHY v2.1 RX 3 trios/4 Lanes in TSMC (16nm, 12nm, N7, N6, N5)
eASIC Demonstrates 10Gbps JEDEC JESD204B
Santa Clara, CA – December 8, 2014 – eASIC Corporation, a fabless semiconductor company delivering a custom IC platform (eASIC Platform) announced today that it has successfully completed JESD204B interoperability at 10 Gbps lane rates. Analog Devices’ AD9234 12-bit, 1.0-GSPS high-speed dual analog-to-digital converter (ADC) can interoperate with the eASIC Nextreme-3 28nm, which greatly simplifies the design and integration of high bandwidth multi-channel radios.
“eASIC’s innovative platform enables OEMs to develop custom silicon solutions with optimal power, price, performance and time-to- market,” said Christian Lanzani, Director for Wireless at eASIC Corporation. “The combination of ADI’s AD9234 high-speed dual ADC and eASIC Nextreme-3 platform allows designers to optimize performance and power in developing next generation of energy-efficient backhaul, fronthaul and remote radio head systems.”
“Growing consumer demand for bandwidth requires radio solutions that deliver increased data throughput and lower power consumption. This trend is driving the adoption of the JESD204B interface standard in cellular back and front haul wireless network equipment”, said Paul Ganci, Strategic Marketing Sanager, Point-to-point Radio Solutions, Analog Devices. “ADI offers a large portfolio of JESD204B supported products that enable customers to reduce their overall time to market.”
An interoperability report is available immediately. To obtain the interoperability report please register. Click to tweet – eASIC offers Analog Devices’ JESD204B Interoperability Report.
About eASIC
eASIC is a fabless semiconductor company offering a custom IC platform (eASIC Platform) that incorporates a versatile base array, customizable single-mask layer and proprietary design tools. The breakthrough eASIC Platform provides the optimal combination of fast time-to-market, high performance, low power consumption, low development cost and low unit cost. The innovative eASIC Platform is enabled through a patented technology utilizing a single via mask layer for customizable and avoids the painful tradeoffs associated with ASICs, ASSPs and FPGAs.
Privately held eASIC Corporation is headquartered in Santa Clara, California. Investors include Khosla Ventures, Kleiner Perkins Caufield and Byers (KPCB), Crescendo Ventures, Seagate Technology and Evergreen Partners. For more information on eASIC please visit www.easic.com
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