PHY layer solution for PCIe1.1/PCIe2.0 with a serial interface and PIPE3 compliant digital interface
DTS Headphone:X Optimized for Cadence Tensilica HiFi Audio DSPs
New audio solution enables incredibly realistic multi-channel surround sound on any device, over any set of headphones
SAN JOSE, Calif. -- March 2, 2015 -- Cadence Design Systems, Inc. (NASDAQ: CDNS), today announced that DTS, Inc.’s (NASDAQ: DTSI) Headphone:X™ immersive sound technology has been optimized for the Cadence® Tensilica® HiFi Audio/Voice digital signal processor (DSP) family.
For more information on Tensilica HiFi Audio/Voice DSPs, visit: www.cadence.com/news/dsp/DTS.
Headphone:X is an innovative new sound technology designed to make movies, music and games more immersive by recreating an authentic, spatially accurate 3D audio home theater experience over any set of headphones. The technology supports stereo, 5.1, 7.1, and 11.1 multi-channel audio, and gives consumers the ability to create a personalized profile tailored to their listening preferences and share it across devices.
“Headphone:X redefines the mobile entertainment experience, delivering audio in a way that provides a surround sound experience on a standard stereo device,” said Joanna Skrdlant, vice president of solutions licensing at DTS. “With support on the HiFi architecture, Cadence will attract design teams that want to enhance the user experience with unparalleled capability to accurately reproduce multi-channel sound in an energy efficient DSP implementation.”
“One of the big hits in our booth at the Consumer Electronics Show this year was our demonstration of DTS Headphone:X. The audio experience was outstanding,” said Larry Przywara, group director of audio/voice IP marketing, Cadence. “We expect that many of our mobile semiconductor and OEM customers will incorporate Headphone:X using our proven HiFi DSP cores to provide the full surround sound stage in the lowest power.”
The Tensilica HiFi Audio/Voice DSP, based on the Xtensa® processor platform, is the most widely used and licensable audio/voice DSP family, with support for over 140 proven audio/voice software packages and over 65 software partners. The Headphone:X library for HiFi DSPs is licensed by Cadence, available to direct licensees of DTS.
About Cadence
Cadence enables global electronic design innovation and plays an essential role in the creation of today’s integrated circuits and electronics. Customers use Cadence software, hardware, IP, and services to design and verify advanced semiconductors, consumer electronics, networking and telecommunications equipment, and computer systems. The company is headquartered in San Jose, Calif., with sales offices, design centers, and research facilities around the world to serve the global electronics industry. More information about the company, its products, and services is available at www.cadence.com.
|
||||||
Cadence Hot IP
Related News
- Cadence Tensilica HiFi 5 DSPs Used in NXP's Next-Gen Audio DSP Family
- LC3 for Bluetooth LE Audio Now Available for Cadence Tensilica HiFi DSPs
- Cadence Introduces the Tensilica HiFi 5 DSP, the First DSP Optimized for AI Speech and Audio Processing
- Waves Nx VR Audio Technology Now Available for Cadence Tensilica HiFi Audio DSPs
- Retune DSP Multi-Microphone Beamforming and Echo Cancellation Now Available for Cadence Tensilica HiFi Audio DSPs
Breaking News
- RISC-V International Promotes Andrea Gallo to CEO
- See the 2025 Best Edge AI Processor IP at the Embedded Vision Summit
- Andes Technology Showcases RISC-V AI Leadership at RISC-V Summit Europe 2025
- RISC-V Royalty-Driven Revenue to Exceed License Revenue by 2027
- Keysom Unveils Keysom Core Explorer V1.0
Most Popular
- RISC-V International Promotes Andrea Gallo to CEO
- See the 2025 Best Edge AI Processor IP at the Embedded Vision Summit
- Andes Technology Showcases RISC-V AI Leadership at RISC-V Summit Europe 2025
- Ceva, Inc. Announces First Quarter 2025 Financial Results
- Cadence Unveils Millennium M2000 Supercomputer with NVIDIA Blackwell Systems to Transform AI-Driven Silicon, Systems and Drug Design
|
|
E-mail This Article |
|
Printer-Friendly Page |









