TSMC to Build 3nm Fab in Tainan Science Park
Hsinchu, Taiwan, R.O.C. – Sept. 29, 2017 – TSMC today announced that, following careful evaluation, the Company’s planned advanced 3nm fab will be located in the Tainan Science Park to fully leverage the company’s existing cluster advantage and the benefit of a comprehensive supply chain. TSMC recognizes and is grateful for the government’s clear commitments to resolve any issues, including land, water, electricity and environmental protection.
|
Related News
- TSMC in talks to build fab in Dresden
- TSMC to Build Specialty Technology Fab in Japan with Sony Semiconductor Solutions as Minority Shareholder
- TSMC Announces Intention to Build and Operate an Advanced Semiconductor Fab in the United States
- Report: TSMC's 3nm Fab Could Cost $20 Billion
- TSMC Plans New Fab for 3nm
Breaking News
- RISC-V International Promotes Andrea Gallo to CEO
- See the 2025 Best Edge AI Processor IP at the Embedded Vision Summit
- Andes Technology Showcases RISC-V AI Leadership at RISC-V Summit Europe 2025
- RISC-V Royalty-Driven Revenue to Exceed License Revenue by 2027
- Keysom Unveils Keysom Core Explorer V1.0
Most Popular
- RISC-V Royalty-Driven Revenue to Exceed License Revenue by 2027
- SiFive and Kinara Partner to Offer Bare Metal Access to RISC-V Vector Processors
- Imagination Announces E-Series: A New Era of On-Device AI and Graphics
- Siemens to accelerate customer time to market with advanced silicon IP through new Alphawave Semi partnership
- Cadence Unveils Millennium M2000 Supercomputer with NVIDIA Blackwell Systems to Transform AI-Driven Silicon, Systems and Drug Design
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |