USB 3.0/ PCIe 2.0/ SATA 3.0 Combo PHY IP cores with Superfast speed and High-power efficiency for lag-less data processing is Silicon Proven and available in 8nm LPP for licensing
29th November 21 – T2MIP, the global independent semiconductor IP Cores provider & Technology experts, is pleased to announce the immediate availability of its partner’s USB 3.0/ PCIe 2.0/ SATA 3.0 Combo PHY IP Cores in 8nm LPP process node which is silicon proven in major Fabs and in mass production with full certification, greatly increased power efficiency and decreased logic area compared to higher nodes.
USB 3.0/ PCIe 2.0/ SATA 3.0 Combo PHY IP Cores consist of Universal Serial Bus (USB) compliant with the USB 3.0 (USB High-speed and Full speed), Peripheral Component Interconnect Express (PCIe) compliant with PCIe 2.0 Base Specification with support of PIPE interface spec, and Serial ATA (SATA) compliant with SATA 3.0 Specification. Due to the architecture of the 8nm LPP process node, lower power consumption is achieved along with support of additional PLL control and reference clock control. The high level of control allowed in the PHY also makes the Combo PHY reliable and effective in different power consumption levels.
Compatible with PCIe2/USB3/SATA3 base Specification and fully compatible with PIPE3.1 interface specification the USB 3.0/ PCIe 2.0/ SATA 3.0 Combo PHY IP Cores can achieve a data rate configurable to 1.25G/1.5G/2.5G/3G/5G/6G for different application. It supports 16-bit or 32-bit parallel interface when encode/decode enabled and 20-bit parallel interface when encode/decode is bypassed. Spread-Spectrum clock (SSC) generation and receiving from -5000ppm to 0ppm makes it flexible along with programmable transmit amplitude.
USB 3.0/ PCIe 3.0/ SATA 3.0 Combo PHY IP cores in 8LPP has PCIe Mode that supports 100MHz differential reference clock input or output (optional with SSC) and Beacon signal generation and detection. USB3.0 Mode supports Low Frequency Periodic Signalling (LFPS) generation and detection. SATA Mode supports COMWAKE, COMINIT and COMRESET (OOB) generation and detection along with RX low latency mode. These with added benefit of process node allows L1 sub-state power management.
USB 3.0/ PCIe 3.0/ SATA 3.0 Combo PHY IP cores have been used in semiconductor industry’s Cellular Electronics, PC, Data storage (SSDs), Multimedia Devices, Servers, Cryptocurrency and other Consumer Electronics …
In addition to USB 3.0/ PCIe 2.0/ SATA 3.0 Combo PHY IP cores, T2M ‘s broad silicon Interface IP Cores Portfolio includes Standalone USB, PCIe, Serial ATA and also HDMI, Display Port, MIPI, DDR, 10/100/1000 Ethernet, V by One, programmable SerDes, and many more Controllers with matching PHYs, available in major Fabs in process geometries as small as 5nm. They can also be ported to other foundries and leading-edge processes nodes on request.
Availability: These Semiconductor Interface IP Cores are available for immediate licensing either stand alone or with pre-integrated Controllers and PHYs. For more information on licensing options and pricing please drop a request / MailTo
About T2M: T2MIP is the global independent semiconductor technology experts, supplying complex semiconductor IP Cores, Software, KGD and disruptive technologies enabling accelerated development of your Wearables, IOT, Communications, Storage, Servers, Networking, TV, STB and Satellite SoCs. For more information, please visit: www.t-2-m.com
|
T2M Hot IP
GNSS Ultra low power (GPS, Galileo, GLONASS, Beidou3, QZSS, IRNSS, SBAS) Digital ...
USB 3.0/ PCIe 2.0/ SATA 3.0 Combo PHY IP, Silicon Proven in TSMC 28HPC+
DVB-S2X WideBand Demodulator & Decoder IP (Silicon Proven)
MIPI D-PHY Tx IP, Silicon Proven in TSMC 22ULP
Wi-Fi 802.11 ax/Wi-Fi 6 /Bluetooth LE v5.4/15.4-2.4GHz RF Transceiver IP for IOT ...
Related News
- Introducing USB 3.0, PCIe 2.0 and SATA 3.0 Combo PHY IP Cores to empower Next Gen Connectivity Chipsets
- USB 4.0, USB 3.2, USB 3.0, USB 2.0 Silicon Proven PHYs in TSMC, UMC & SMIC Foundries available from T2MIP
- USB 3.0/ PCIe 3.0/ SATA 3.0 Combo PHY IP Cores for High Bandwidth, Low Power data communication in PCs, Mobiles, SSDs, and other Multimedia Devices.
- Unveiling Silicon-proven USB 3.0 PHY IP Core in 22nm, Elevating High-Speed Data Transmission with Advanced Transceiver Technology, backward compatible with USB 2.0
- Enhance your High-Density data processing capabilities to new heights with the USB 3.2/ PCIe 3.1/ SATA 3.2 Combo PHY IP Core interface in 28HPC+/HPC process technology
Breaking News
- RISC-V International Promotes Andrea Gallo to CEO
- See the 2025 Best Edge AI Processor IP at the Embedded Vision Summit
- Andes Technology Showcases RISC-V AI Leadership at RISC-V Summit Europe 2025
- RISC-V Royalty-Driven Revenue to Exceed License Revenue by 2027
- Keysom Unveils Keysom Core Explorer V1.0
Most Popular
- RISC-V Royalty-Driven Revenue to Exceed License Revenue by 2027
- SiFive and Kinara Partner to Offer Bare Metal Access to RISC-V Vector Processors
- Imagination Announces E-Series: A New Era of On-Device AI and Graphics
- Siemens to accelerate customer time to market with advanced silicon IP through new Alphawave Semi partnership
- Cadence Unveils Millennium M2000 Supercomputer with NVIDIA Blackwell Systems to Transform AI-Driven Silicon, Systems and Drug Design
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |