Synopsys Advances Designs on TSMC N3E Process with Production-Proven EDA Flows and Broadest IP Portfolio for AI, Mobile and HPC Applications
Multiple Successful Tapeouts from Leading Companies Demonstrate Robustness of Synopsys Solutions for a Faster Path to Silicon Success
MOUNTAIN VIEW, Calif., Oct. 24, 2022 -- Building on a long-standing collaboration with TSMC to drive continued innovation on advanced process nodes, Synopsys, Inc. (Nasdaq: SNPS) today announced several key achievements on the TSMC N3E process technology. The Synopsys production-proven digital and custom design flows have achieved certification on the TSMC N3E process. In addition, the flows and Synopsys' broad Foundation and Interface IP portfolio have achieved multiple successful tapeouts on the TSMC N3E process, helping customers accelerate silicon success. The collaborative efforts on the advanced process technology also extend to analog design migration, AI-driven designs and physical verification scaling in the cloud.
"TSMC's and Synopsys' long history of collaboration to advance semiconductor innovation addresses the increasingly complex challenges of emerging applications," said Dan Kochpatcharin, Head of Design Infrastructure Management Division at TSMC. "Synopsys' latest achievements in EDA and IP on the TSMC N3E process technology provide our mutual customers with robust solutions that help them meet the stringent power, performance and area targets for their innovative designs."
"These recent achievements mark another significant milestone of the continuous, successful collaboration between Synopsys and TSMC," said Sanjay Bali, vice president of Marketing and Strategy for the EDA Group at Synopsys. "Our substantial investment in providing certified EDA solutions and a silicon-proven IP portfolio for TSMC's most advanced processes gives designers a low-risk path to achieving their critical design requirements."
TSMC's N3E process extends its 3nm family with enhanced power, performance and yield, meeting the demands of workload-intensive applications like high-performance computing, AI and mobile. A joint effort on AI-driven design enablement with Synopsys DSO.ai™ technology and Synopsys Fusion Compiler has resulted in multiple validated N3E test cases with better PPA and faster design closure. Aside from the IP readiness and certified flows, Synopsys is working closely with TSMC to scale physical verification in the cloud, using the Synopsys IC Validator product for N3E on the Synopsys Cloud software-as-a-service offering. The effort highlights how access to unlimited CPU capacity in the cloud delivers faster physical verification iterations. The two companies are also enabling customers to seamlessly transition existing designs on earlier process nodes to the TSMC N3E process.
Learn more by visiting these pages:
- Synopsys Digital Design Family: https://www.synopsys.com/implementation-and-signoff/fusion-design-platform.html
- Synopsys Custom Design Family: https://www.synopsys.com/implementation-and-signoff/custom-design-platform.html
- Synopsys Foundation IP: https://www.synopsys.com/designware-ip/memories-logic-libraries.html
- Synopsys Interface IP: https://www.synopsys.com/designware-ip/interface-ip.html
About Synopsys
Synopsys, Inc. (Nasdaq: SNPS) is the Silicon to Software™ partner for innovative companies developing the electronic products and software applications we rely on every day. As an S&P 500 company, Synopsys has a long history of being a global leader in electronic design automation (EDA) and semiconductor IP and offers the industry's broadest portfolio of application security testing tools and services. Whether you're a system-on-chip (SoC) designer creating advanced semiconductors, or a software developer writing more secure, high-quality code, Synopsys has the solutions needed to deliver innovative products. Learn more at www.synopsys.com.
|
Synopsys, Inc. Hot IP
Synopsys, Inc. Hot Verification IP
Related News
- Synopsys and TSMC Collaborate to Jumpstart Designs on TSMC's N2 Process with Optimized EDA Flows
- Synopsys and Samsung Foundry Enable 3nm Process Technology for Power- and Performance-Demanding Mobile, HPC and AI Designs
- Synopsys Drives Chip Innovation for Next-Generation Mobile and HPC Designs on TSMC N3E and N4P Processes
- Synopsys and TSMC Collaborate to Enable Designs of HPC, Mobile, 5G, and AI SoCs with Certified Solutions on TSMC N5 and N6 Processes
- Synopsys Accelerates High-Performance Computing SoC Designs with Industry's Broadest IP Portfolio for TSMC's 5nm Process Technology
Breaking News
- RISC-V International Promotes Andrea Gallo to CEO
- See the 2025 Best Edge AI Processor IP at the Embedded Vision Summit
- Andes Technology Showcases RISC-V AI Leadership at RISC-V Summit Europe 2025
- RISC-V Royalty-Driven Revenue to Exceed License Revenue by 2027
- Keysom Unveils Keysom Core Explorer V1.0
Most Popular
- RISC-V Royalty-Driven Revenue to Exceed License Revenue by 2027
- SiFive and Kinara Partner to Offer Bare Metal Access to RISC-V Vector Processors
- Imagination Announces E-Series: A New Era of On-Device AI and Graphics
- Siemens to accelerate customer time to market with advanced silicon IP through new Alphawave Semi partnership
- Cadence Unveils Millennium M2000 Supercomputer with NVIDIA Blackwell Systems to Transform AI-Driven Silicon, Systems and Drug Design
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |