Analog Front End: 16x 12-bit 200 MSPS ADCs, 14x Voltage DACs, 4x 250 MSPS DACs, 4x TVM, LDO
TriCN Premieres Multi-Function Memory Interface Product
Support for Multiple Memory I/O Standards Will Broaden Market and Cut Costs for End Users
SAN FRANCISCO, CA - March 1, 2004 - TriCN, a leading developer of intellectual property (IP) for high-speed semiconductor interface technology, today announced the immediate availability of the latest member of its Multi-Function I/O (MFI/O) product family, the MFI/O-Memory. Targeted specifically for customers seeking a broadly compatible memory interface solution that frees them from being locked into a single design strategy, the MFI/O-Memory auto-configures to one of the following I/O technologies: SSTL-2, SSTL-18, HSTL-15, and HSTL-18. As a result, the product supports a wide spectrum of interface protocols, specifically: DDR/DDR II SDRAM, DDR FCRAM I & II, QDR SRAM I & II, DDR SRAM, and RL DRAM I & II. The MFI/O Memory is available now in the TSMC 130nm process.
Increasing market demand for high-performance memory interfaces spans the gamut from high-bandwidth communications to PC and consumer products. The wide variety of memory interface standards, along with fluctuation in memory product pricing and availability is forcing chip designers to seek dramatically improved flexibility in interface design that will allow for compatibility across multiple protocols. TriCN's MFI/O-Memory is specifically and uniquely designed to satisfy this major shift in market demand.
"The MFI/O-Memory product represents a real breakthrough for our customers and the end users of their products," said Ron Nikel, co-founder and Chief Technology Officer of TriCN. "Chip designers using our MFI/O-Memory interface can develop ICs that are compatible with a broad range of memory interfaces, thereby expanding their market opportunities. Furthermore, system designers can choose the most efficient memory product to interface with the MFI/O-Memory based on current price and availability, creating cost savings for their end product."
Availability
TriCN's MFI/O-Memory is immediately available in the TSMC 130nm process.
About TriCN
Founded in 1997, San Francisco, California-based TriCN is a leading developer of high- performance semiconductor interface intellectual property (IP). The company provides a complete portfolio of IP for maximizing data throughput on and off the chip. All products are designed using rigorous signal integrity and timing analysis to ensure first time power-up success. Products include Base I/O libraries for pad-ring creation, high-performance memory and networking interfaces, multi-function I/O's compatible with multiple interface protocols, and multi-gigabit SerDes products. TriCN's customers range from fabless semiconductor to systems companies and independent design manufacturers.
All trademarks mentioned herein are the property of their respective owners.
|
||||||
Related News
- TriCN introduces breakthrough multi-function I/O solution
- Xilinx Programmable Solutions Enable New Multi-Function Digital Video Broadcast Mobile Product From Screen Service
- Xilinx Targets Fast-Moving, Multi-Function Smart Handset Market With Industry's First Programmable Demonstration Platform
- MIPS-Based TX99/H4 RISC Microprocessor from Toshiba to Power New Canon Multi-function Digital Copier
- Condor Engineering Introduces the World's First Multi-function RT Validated Intellectual Property Core for MIL-STD-1553 COTS Applications
Most Popular
- RISC-V International Promotes Andrea Gallo to CEO
- See the 2025 Best Edge AI Processor IP at the Embedded Vision Summit
- Andes Technology Showcases RISC-V AI Leadership at RISC-V Summit Europe 2025
- Ceva, Inc. Announces First Quarter 2025 Financial Results
- Cadence Unveils Millennium M2000 Supercomputer with NVIDIA Blackwell Systems to Transform AI-Driven Silicon, Systems and Drug Design
|
|
E-mail This Article |
|
Printer-Friendly Page |






