High Cost of SOC Forces Look at system-in-package (SiP)
Electronics Weekly
The increasingly prohibitive cost of SOCs is forcing companies to use the system-in-package (SiP) approach of stacking die.
"Something has to be done to overcome the fundamental problem of SOC, which is its rapidly increasing cost and, compared with SOC, SiP is low-cost and with short time-to-market," said Tsugio Makimoto, corporate adviser at Sony.
Read more ...
Related News
- Sequans Provides Chips to USI to Develop Mobile WiMAX End User Devices and System-in-Package (SIP) Modules
- Fukuoka Intelligent Cluster Laboratory Chooses eASIC’s Nextreme Devices for its Unique System-in-Package (SiP) Development
- Pressures tilt wireless apps toward System-in-Package (SiP)
- Inapac Technology Releases New DRAM IP Designs Optimized for System-in-Package (SiP) Applications
- System-in-package (SIP) may not be that simple
Breaking News
- RISC-V International Promotes Andrea Gallo to CEO
- See the 2025 Best Edge AI Processor IP at the Embedded Vision Summit
- Andes Technology Showcases RISC-V AI Leadership at RISC-V Summit Europe 2025
- RISC-V Royalty-Driven Revenue to Exceed License Revenue by 2027
- Keysom Unveils Keysom Core Explorer V1.0
Most Popular
- RISC-V International Promotes Andrea Gallo to CEO
- See the 2025 Best Edge AI Processor IP at the Embedded Vision Summit
- Andes Technology Showcases RISC-V AI Leadership at RISC-V Summit Europe 2025
- Ceva, Inc. Announces First Quarter 2025 Financial Results
- Cadence Unveils Millennium M2000 Supercomputer with NVIDIA Blackwell Systems to Transform AI-Driven Silicon, Systems and Drug Design
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |