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Tiempo Secure Selects IC'Alps to Accelerate Silicon Implementation of Secure Element IP for IoT Applications (Tuesday Apr. 27, 2021)
Tiempo Secure and IC’Alps today announced a strategic collaboration to widespread silicon implementation of Common Criteria (CC) EAL5+ grade Secure Element cores for IoT applications; specifically, Tiempo Secure is relying on IC’Alps’ expertise in physical design implementation to develop the hard macro of its Secure Element named TESIC, from netlist to GDSII.
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SiPearl launches the recruitment of 10 engineers per month in France & Germany (Tuesday Apr. 27, 2021)
SiPearl, the company that is designing the high-performance, low-power processor for the European exascale supercomputer, is launching its recruitment campaign in France and Germany. It initially aims to recruit 10 engineers every month with a view to reaching 1,000 staff by 2025.
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Hardent Selected as Design Services Provider for New Xilinx Kria SOMs (Wednesday Apr. 21, 2021)
Hardent Inc., a certified member of the Xilinx Alliance Program and Xilinx Authorized Training Provider (ATP), will be a design services provider for the newly-released Xilinx Kria™ System-on-Modules (SOMs) portfolio.
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Renesas and SiFive Partner to Jointly-Develop Next-Generation High-End RISC-V Solutions for Automotive Applications (Wednesday Apr. 21, 2021)
Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, and SiFive, Inc., the industry leader in RISC-V processors and silicon solutions, today announced a strategic partnership to jointly develop next-generation, high-end RISC-V solutions for automotive applications.
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CAES Gaisler Signs Contract with the European Space Agency for New Advanced Space Processor (Wednesday Apr. 21, 2021)
Developed in Sweden and based on the popular LEON5FT Fault Tolerant Processor Core, the GR765 Microprocessor meets market demand for high-performing processors, offering a higher level of integration with more functionality on the chip to reduce weight and keep power consumption low.
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Marvell Completes Acquisition of Inphi (Wednesday Apr. 21, 2021)
Marvell Technology today announced the completion of its acquisition of Inphi Corporation. The combination creates a U.S. semiconductor powerhouse positioned for end-to-end technology leadership in data infrastructure.
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Rambus Joins DARPA Toolbox Initiative with State-of-the-Art Security and Interface IP (Tuesday Apr. 20, 2021)
Rambus Inc. (NASDAQ: RMBS), a provider of industry-leading chips and silicon IP making data faster and safer, today announced a commercial licensing agreement with the U.S. Defense Advanced Research Projects Agency (DARPA) to accelerate technology innovation for the agency’s programs.
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Siemens expands industry-leading IC verification portfolio through acquisition of OneSpin Solutions (Thursday Apr. 15, 2021)
Siemens Digital Industries Software has signed an agreement with London-based Azini Capital to acquire OneSpin Solutions, a leading provider of formal verification software that helps ensure integrated circuit (IC) integrity and enables functionally correct, safe, trustworthy and secure IC designs.
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Nestwave Secures Additional Capital to Accelerate Deployment of Low-Power Geolocation Solutions for the IoT (Thursday Apr. 15, 2021)
Nestwave, a provider of low-power geolocation IP and cloud services for Internet of Things (IoT) applications, today announced that it has secured a €2.4 million round of financing from the European Innovation Council, the European Commission's newly established venture capital fund, and from current investors Sofimac Innovation (Paris, France) and The Faktory Fund (Liege, Belgium).
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Arm and NVIDIA: Fueling Innovation for the Next Era of Compute (Thursday Apr. 15, 2021)
In 2018, Arm had recently announced Arm Neoverse, our first set of platforms and technologies specifically tailored to the needs of cloud-to-edge infrastructure. Shortly after, the first 5G services came online in a few select markets, and NVIDIA announced it was making its full stack of AI and HPC software available to the Arm ecosystem.
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Groq Closes $300 Million Fundraise (Thursday Apr. 15, 2021)
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Synopsys To Expand DesignWare Ethernet IP Portfolio with Acquisition of MorethanIP (Tuesday Apr. 13, 2021)
Acquisition Will Enable Synopsys to Deliver a Complete Ethernet IP Solution, Consisting of MAC, PCS and 112G PHY for 200G/400G and 800G High-Performance Computing SoCs
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SambaNova Systems Raises $676M in Series D, Surpasses $5B Valuation and Becomes World's Best-Funded AI Startup (Tuesday Apr. 13, 2021)
SoftBank Vision Fund 2 leads round backing breakthrough platform that delivers unprecedented AI capability and accessibility to customers worldwide
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Dialog Shareholders Approve Resolutions related to the Acquisition by Renesas Electronics Corporation of Dialog Semiconductor Plc (Monday Apr. 12, 2021)
Renesas is pleased to announce that, at the Dialog General Meeting and at the Court Meeting held on April 9, 2021, all resolutions proposed in connection with the Scheme were duly passed by the requisite majorities and, accordingly, the Scheme has been approved by Dialog Shareholders.
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AMD and Xilinx Stockholders Overwhelmingly Approve AMD's Acquisition of Xilinx (Thursday Apr. 08, 2021)
AMD (NASDAQ:AMD) and Xilinx, Inc. (NASDAQ:XLNX) announced today that stockholders voted to approve their respective proposals relating to the pending acquisition of Xilinx by AMD.
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Intrinsic closes GBP 1.35m seed funding round to prototype next generation memory devices (Wednesday Apr. 07, 2021)
Memory innovator Intrinsic Semiconductor Technologies Ltd (“Intrinsic”) has announced the close of a £1.35m seed funding round led by investors UCL Technology Fund and IP Group plc.
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Aragio Solutions Achieves ISO 9001:2015 Certification (Tuesday Apr. 06, 2021)
Aragio Solutions, an industry leader and full-service provider of semiconductor IO design IP, is pleased to announce today that it has earned ISO 9001 certification.
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SiFive and DARPA collaborate to bring the power of RISC-V to Technology Innovation (Wednesday Mar. 31, 2021)
SiFive, Inc., the leading provider of commercial RISC-V processor IP and silicon solutions, today announced an open licensing agreement with the U.S. Defense Advanced Research Projects Agency (DARPA) to accelerate technology innovation as part of the DARPA Toolbox Initiative
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Magnachip Enters into Definitive Agreement with Wise Road Capital in a Take Private Transaction Valued at $1.4 Billion (Tuesday Mar. 30, 2021)
Magnachip today announced that it has entered into a definitive agreement with South Dearborn Limited, a company incorporated in the Cayman Islands, and Michigan Merger Sub, Inc., a Delaware corporation, which are investment vehicles established by Wise Road Capital LTD and certain of its limited partners ("Wise Road").
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PLDA Joins ETP4HPC to share its expertise in High Speed Interconnect Solution IP with the European High Performance Computing Ecosystem (Thursday Mar. 25, 2021)
PLDA, the leading developer of high-speed interconnect silicon IP, is joining ETP4HPC, an association that gathers leading European players in high performance computing technologies.
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Imagination launches IMG Labs to create breakthrough technologies (Thursday Mar. 25, 2021)
IMG Labs’ mission is to understand and accelerate future trends in the semiconductor industry, translating these into new licensable technologies that will enable world-leading products for Imagination’s partners. Headed up by Tim Mamtora, IMG Labs’ initial focus is on AI, GPU, heterogeneous compute, and ray tracing.
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WISeKey Partners with Cortus to Secure Automated Vehicles Capable of Controlling All Aspects of Driving Without Human Intervention (Wednesday Mar. 24, 2021)
While automated vehicles become more and more connected, they also become increasingly vulnerable to cyberattacks with dramatic consequences on safety. Security specialists, WISeKey and Cortus, join forces to define the future of safety for automated vehicles.
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Flex Logix raises $55M to accelerate market adoption of AI inference and eFPGA solutions (Monday Mar. 22, 2021)
Flex Logix Technologies, Inc., supplier of the fastest and most-efficient AI edge inference accelerator and the leading supplier of eFPGA IP, announced today the close of a $55 million oversubscribed Series D funding round.
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Qualcomm Completes Acquisition of NUVIA (Tuesday Mar. 16, 2021)
Qualcomm Incorporated (NASDAQ: QCOM) today announced that its subsidiary, Qualcomm Technologies, Inc., has completed its acquisition of the world-class CPU and technology design company, NUVIA for $1.4 billion before working capital and other adjustments.
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Secure-IC Announces Partnership With U.S. DARPA To Foster Security Technology Innovation (Tuesday Mar. 16, 2021)
Secure-IC, the rising leader and only global provider of end-toend cybersecurity solutions for embedded systems and connected objects today announced its partnership with the U.S. Defense Advanced Research Projects Agency (DARPA) to accelerate security technology innovation for DARPA programs as part of the DARPA Toolbox initiative.
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Alphawave IP and EnSilica Announce Partnership for Expansion in the United Kingdom and Europe (Tuesday Mar. 16, 2021)
Alphawave IP, a leader in multi-standard connectivity IP solutions, today announced it has entered into a partnership agreement with EnSilica, a leading provider of custom ASIC design and supply services, to expand both companies’ capabilities in the United Kingdom and Europe.
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10 Millionth Achronix Speedcore eFPGA IP Core Shipped (Wednesday Mar. 10, 2021)
Achronix announces today that 10 million Speedcore™ eFPGA IP cores have shipped in customers’ ASICs. Achronix is the only high-performance FPGA supplier to offer both high-performance standalone FPGAs and eFPGA IP.
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proteanTecs Joins the TSMC IP Alliance Program (Thursday Mar. 04, 2021)
proteanTecs, a leading provider of health and performance monitoring solutions for advanced electronics, today announced it has joined the TSMC IP Alliance Program, a key component of TSMC's Open Innovation Platform® (OIP).
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BrainChip's Success in 2020 Advances Fields of On-Chip Learning and Ultra-Low Power Edge AI (Thursday Mar. 04, 2021)
BrainChip ended the 2020 calendar year having made significant strides in the development of its technology backed by the launch of its Early Access Program (EAP), availability of Akida™ evaluation boards, new partnerships, and expansion of its executive leadership and global facilities.
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Flex Logix and DARPA Expand Partnership with the Addition of Silicon Proven EFLX eFPGA in 12 and 16 nm Process Technologies for DARPA's Toolbox Initiative (Monday Mar. 01, 2021)
Flex Logix® Technologies, Inc., the leading supplier of embedded FPGA (eFPGA) IP, architecture and software, announced today that it has expanded its license agreement with the U.S. Defense Advanced Research Projects Agency (DARPA) to allow its research teams to now take advantage of additional Flex Logix EFLX® eFPGA technology.