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GreenWaves Technologies Announces 7M Euros Series A Funding (Monday Feb. 25, 2019)
GreenWaves Technologies (GreenWaves), a fabless semiconductor start-up designing disruptive ultra-low-power AI embedded processors for battery-operated edge devices, announced today that it has raised 7 million euro in its Series A. The round was co-led by Huami, with the participation of Soitec, its seed round lead investor, and other investors.
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Arm and Vodafone Commit to Work Together to Simplify Internet of Things (IoT) Deployment (Monday Feb. 25, 2019)
Arm and Vodafone today announced a strategic agreement that will significantly reduce complexity and costs faced by organisations when implementing Internet of Things (IoT) solutions.
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Intel Buys Indian SoC Designer Ineda Systems (Tuesday Feb. 19, 2019)
Intel, which has been aggressively scouting around in India and Asia for new technologies, has acquired Ineda Systems, a fabless chip company based in Hyderabad, India.
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Soitec Becomes Strategic Partner of Silicon Catalyst Start-up Incubator (Thursday Feb. 14, 2019)
Silicon Catalyst, the world’s only incubator focused exclusively on accelerating solutions in silicon, today announced Soitec (Euronext Paris), a world leader in designing and manufacturing innovative semiconductor materials, as its first European Strategic Partner.
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eSilicon builds momentum as a strong tier one FinFET ASIC supplier (Thursday Feb. 14, 2019)
eSilicon announced today the achievement of multiple milestones related to the company’s growth in the tier one FinFET ASIC market, serving high-bandwidth networking, high-performance computing, AI and 5G infrastructure.
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AccelerComm Lands Funding for 5G New Radio and 4G LTE Networks IP (Tuesday Feb. 12, 2019)
AccelerComm has today announced the completion of a £2.5 million funding round led by Bloc Ventures and IP Group. The investment will fund and scale the further development and commercialisation of low delay LDPC, Polar and Turbo channel coding products.
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Achronix Announces Partner Program for Speedster, Speedchip, and Speedcore Ecosystem (Tuesday Feb. 12, 2019)
Achronix today announced the launch of its Partner Program for EDA tools, software, and IP vendors with solutions and services directly applicable to Achronix’s versatile Speedster FPGAs, Speedchip chiplet technology, and Speedcore eFPGA custom IP-block technology.
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Pliops Raises $30 Million in Series B Funding Led by SoftBank Ventures Asia to Transform Data Center Infrastructure for Cloud, AI and ML (Tuesday Feb. 12, 2019)
Pliops, an innovator in cloud storage solutions, today announced that it has received a $30 million Series B funding led by Softbank Ventures Asia, with participation from all Series A investors including Intel Capital, State of Mind Ventures (SOMV) and Viola Ventures, along with strategic investors Western Digital Capital and Xilinx Inc.
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AIStorm Raises $13.2M to Bring Real-Time AI-in-Sensor Technology to the Edge at a Fraction of the Cost (Monday Feb. 11, 2019)
Team of experienced semiconductor executives, backed by leading sensor and equipment manufacturers, aims to equip the next generation of handsets, IoT devices, wearables, and vehicles with a new approach to AI processing at the edge; compared with edge GPU solutions, AIStorm’s technology boosts performance while lowering power requirements and system cost
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Arteris IP Adds 20 New Licensees and Releases Three New Products in 2018 (Tuesday Jan. 29, 2019)
Publicly announced Arteris customers added during 2018 include Baidu, Arbe Robotics, AutoChips, AutoTalks, Canaan Creative, Enflame Technology, Iluvatar CoreX, and thirteen as yet undisclosed licensees. This is the highest number of new licensees added in one year in Arteris IP history.
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MosChip announces acquisitions to strengthen Semiconductor Business Unit & CEO appointment (Monday Jan. 28, 2019)
MosChip Semiconductor Technology, a Hyderabad-based leading Semiconductor & IoT technology company, has approved definitive agreements/arrangements for the acquisition of four companies, namely, Gigacom Semiconductor LLC, California, USA, Gigacom Semiconductor Pvt. Ltd, Visakhapatnam, FirstPass Semiconductors Pvt. Ltd, Hyderabad, and Institute of Silicon Systems Pvt. Ltd, Hyderabad.
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Hailo Expands Series A Round to $21M and Launches Hailo-8 Fast Track Program for Select Customers (Wednesday Jan. 23, 2019)
Israeli startup Hailo, developers of a proprietary processing architecture for deep learning on edge devices, has expanded its Series A funding round to $21 million.
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Rambus Acquires Memory Technology Assets of Diablo Technologies (Thursday Jan. 17, 2019)
Rambus Inc. (NASDAQ: RMBS), today announced it has acquired the assets of Diablo Technologies to broaden its portfolio in the hybrid DRAM and Flash memory markets, further establishing its position as an industry leader.
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CEVA Opens New Research and Development Center in Bristol, U.K. (Monday Jan. 14, 2019)
The new R&D center enables CEVA to access the world-class engineering talent the city has to offer, strengthening its R&D capabilities and expediting the development of new digital signal processing and AI products.
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Imagination Technologies delivers new AI, graphics and connectivity technology for 2019 (Wednesday Jan. 09, 2019)
The company, which creates and licenses technologies used in many leading consumer electronics products, will highlight at CES three new IP families which target key consumer technology product categories: automotive, drones, DTV, mobile devices, and other IoT edge devices.
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OPENEDGES and TAKUMI partner to promote ORBIT Memory Subsystem IP in Japan (Wednesday Jan. 09, 2019)
OPENEDGES Technology, Inc. and TAKUMI Corporation reached an agreement that TAKUMI provides technical and sales support of OPENEDGES' ORBITTM memory subsystem IP cores throughout Japan.
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QuickLogic Acquires SensiML SaaS AI Company (Monday Jan. 07, 2019)
QuickLogic Corporation (NASDAQ: QUIK), a developer of ultra-low power multi-core voice-enabled SoCs, embedded FPGA IP, and Endpoint AI solutions, announced today that it has acquired SensiML Corporation.
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CEVA Reaches New Milestone with 10th Design Win for its SIG Qualified Bluetooth Mesh IP (Thursday Dec. 27, 2018)
CEVA today announced that its Bluetooth® SIG qualified RivieraWaves Bluetooth Low Energy (BLE) Mesh IP has achieved a significant milestone, having already been licensed to ten customers who are targeting a wide range of use cases and applications leveraging the Mesh Profile Specification.
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Graphcore secures lead in global AI chip race with $200 million in new capital from BMW, Microsoft and leading financial investors (Thursday Dec. 20, 2018)
Graphcore reaches $1.7Bn valuation with new funding from leading venture capital, financial and strategic investors including Atomico, BMW i Ventures, Merian Chrysalis Investment Company Limited, Microsoft, Sequoia and Sofina.
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Cisco Announces Intent to Acquire Silicon Photonics Leader, Luxtera (Tuesday Dec. 18, 2018)
Cisco today announced the intent to acquire privately-held Luxtera, Inc, a semiconductor company based in Carlsbad, Calif. that uses silicon photonics to build integrated optics capabilities for webscale and enterprise data centers, service provider market segments, and other customers.
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Wave Computing Launches the MIPS Open Initiative To Accelerate Innovation for the Renowned MIPS Architecture (Tuesday Dec. 18, 2018)
Wave Computing®, the Silicon Valley company that is accelerating artificial intelligence (AI) from the edge to the data center, announced it will open source its MIPS instruction set architecture (ISA) to accelerate the ability for semiconductor companies, developers and universities to adopt and innovate using MIPS for next-generation system-on-chip (SoC) designs.
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Movellus Closes Second Round of Intel Capital Funding (Wednesday Dec. 12, 2018)
Movellus, Inc., today announced it has closed a second round of funding from Intel Capital. The company’s technology automatically generates analog IPs using digital implementation tools and standard cells.
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Menta Selected as Sole Provider of Embedded FPGAs for European Processor Initiative (Tuesday Dec. 11, 2018)
Menta SAS, a provider of embedded FPGA (eFPGA) Intellectual Property (IP), today announced that it has been selected as the sole provider of embedded FPGA intellectual property for the European Processor Initiative (EPI).
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Kandou Announces 100th Patent Grant by U.S. Patent Office (Tuesday Dec. 11, 2018)
Kandou Bus S.A., the global pioneer in multi-wire SerDes technology, today announced that the United States Patent and Trademark Office has awarded to Kandou Bus its 100th patent relating to Kandou’s multi-wire signaling. The patent, entitled, “Skew-Resistant Multi-Wire Channel”, patent number 10,153,591, was issued December 11, 2018.
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Gowin Semiconductor Opens European Office and Commences Sales Operations Serving the EMEA Region (Tuesday Dec. 11, 2018)
GOWIN Semiconductor announces the expansion of its global sales operations into the EMEA region. Based in the UK, the operation is managed by recently appointed Mike Furnival, Director of Sales, EMEA and General Manager of GOWIN Semiconductor (Europe).
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Inside Secure Enters into an Exclusive Agreement to Acquire Verimatrix, Inc. Creating a Software-based Security Powerhouse (Friday Dec. 07, 2018)
Inside Secure today announced it has entered into an exclusivity agreement to acquire Verimatrix, a privately-held company headquartered in San Diego, California, USA.
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Codasip Secures $10M in Series A Financing to Expand RISC-V Processor Technology Offerings (Tuesday Dec. 04, 2018)
Codasip GmbH, the leading supplier of RISC-V® embedded processor IP, announced today that it has raised $10M in a Series A investment round led by private equity firms Ventech Capital of Paris, France, Shenzhen Capital Group Co., Ltd. of Shenzhen, China, Paua Ventures of Berlin, Germany, and strategic investor Western Digital, following the initial investment led by Credo Ventures of Prague, Czech Republic.
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Wave Computing Raises $86M in Oversubscribed Series E Round To Fuel Global Expansion and Further Accelerate Wave's Cloud-to-Edge Strategy (Thursday Nov. 29, 2018)
Wave Computing®, the Silicon Valley company that is accelerating artificial intelligence (AI) from the cloud to the edge, today announced the successful close of its Series E funding round at $86 million, bringing total investment in Wave to over $200 million.
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GUC Announces ShenZhen Office Opening (Wednesday Nov. 28, 2018)
Custom ASIC Leader Global Unichip Corporation (GUC) Announces Official Opening of ShenZhen Office. GUC requires new space to enhance both technical and business support to South China customers. The GUC office is located at No. 1305 Building 9A ShenZhen Bay Echo Hi-tech Park, Shahe Western Road, Nanshan District, ShenZhen City
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PLDA Offers XpressRICH PCIe and CCIX Controller IP Through SiFive DesignShare Program (Monday Nov. 26, 2018)
SiFive, the leading provider of commercial RISC-V processor IP, today announced that PLDA, the leader in PCIe and CCIX Controller IP solutions has joined the DesignShare™ ecosystem.