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Codasip Expands its Global Reach by Signing Channel Partnerships throughout Asia (Monday Sep. 10, 2018)
Codasip, the leading supplier of RISC-V® embedded processor IP, today announced that it has signed new reseller representative agreements with leading firms in China, Taiwan, Japan, and India.
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Impressive World-Wide Syndicate Invests $65 Million In AI Platform Venture ThinCI's Oversubscribed Series C Funding Round (Thursday Sep. 06, 2018)
ThinCI Inc., an AI hardware startup developing computing platforms for the expanding AI/Machine Learning market has announced the successful close of its $65 Million Series C round.
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NXP Acquires OmniPHY to Accelerate Autonomous Driving and Vehicle Networks (Tuesday Sep. 04, 2018)
NXP Semiconductors has acquired OmniPHY, a provider of automotive Ethernet subsystem technology. The company’s expertise includes automotive Ethernet, a technology that enables the rapid data transfer required for autonomous driving.
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RoodMicrotec selected as key partner for EnSilica automotive ASIC project (Tuesday Aug. 28, 2018)
RoodMicrotec N.V., the leading independent company for semiconductors supply and quality services, has been selected by EnSilica as a key partner to support a major automotive ASIC design win.
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Flex Logix Partners with Quantum Leap Technical Sales To Meet Strong Demand for EFLX Embedded FPGA Throughout North America (Wednesday Aug. 22, 2018)
Flex Logix Technologies, Inc.the leading supplier of embedded FPGA (eFPGA) IP, architecture and software, announced today that it has hired Quantum Leap Sales in response to growing demand for its leading eFPGA platform in North America.
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Soitec and MBDA to Acquire Dolphin Integration Assets (Tuesday Aug. 21, 2018)
Soitec (Euronext Paris), a world leader in designing and manufacturing innovative semiconductor materials, and MBDA, announce the joint acquisition of Dolphin Integration.
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Skyworks Closes Acquisition of Smart Interface Innovator Avnera Corporation (Friday Aug. 17, 2018)
Skyworks Solutions, Inc. (NASDAQ: SWKS), an innovator of highperformance analog semiconductors connecting people, places and things,today closed its acquisition of Avnera Corporation, a leading developerof Analog System on Chips (ASoCs). The companies entered into adefinitive agreement on August 3, 2018.
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OPENEDGES Joins SiFive's DesignShare (Tuesday Aug. 14, 2018)
SiFive, the leading provider of commercial RISC-V processor IP, today announced a new member to its growing DesignShare economy: OPENEDGES, a provider of IPs for smart computing.
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UltraSoC selects MosChip to support its growth in India (Tuesday Aug. 14, 2018)
UltraSoC today announced that it has appointed MosChip as its technical sales representative in India, as part of a program to support the rapidly developing global market for its embedded analytics technology.
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Andes Technology forms a Multinational Alliance with ASIC Design Service Companies to Provide RISC-V Total Solutions (Thursday Aug. 09, 2018)
Andes Technology has created a RISC-V core licensing project and has signed joint promotion agreements to form a multinational design service alliance with several top ASIC/SoC design service companies. The alliance is expected to continue expanding eventually reaching 20 or more companies globally in the following several months.
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Skyworks to Acquire Smart Interface Innovator Avnera Corporation (Thursday Aug. 09, 2018)
Skyworks Solutions, Inc. (NASDAQ: SWKS), an innovator of high performance analog semiconductors connecting people, places and things, today announced it signed a definitive agreement to purchase Avnera Corporation, a leading developer of Analog System on Chips (ASoCs).
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Mobiveil Inc. and SiFive, Inc. partner to develop RISC-V based configurable SSD Platform For Data Center and Enterprise storage Applications (Wednesday Aug. 08, 2018)
Mobiveil has selected SiFive's multicore E51 and U54 Core IPs to power Mobiveil's new advanced configurable Gen4 PCIe-NVMe SSD platform offering a high performance and low power SSD solution for data center storage applications
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eSilicon Licenses Industry-Leading SiFive E2 Core IP for Next-Generation SerDes IP (Tuesday Aug. 07, 2018)
SiFive and eSilicon today announced that, after extensive review and testing of available options in the market, eSilicon has selected the SiFive E2 Core IP Series as the best solution for its next-generation SerDes IP at 7nm.
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Lekha Wireless appoints T2M for global marketing, representation and business development (Tuesday Aug. 07, 2018)
Lekha Wireless, the leading wireless communications and embedded systems technology company, has signed an agreement with T2M, the world’s largest independent global semiconductor IP provider, to act as a global representative and business development partner of Lekha Wireless’ IP and technology solutions.
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Arm acquires Treasure Data to set the stage for IoT transformation (Monday Aug. 06, 2018)
The Internet of Things (IoT) will give businesses superpowers. Whether it’s an energy provider drawing data from its infrastructure to sense failures; a sensor-equipped building anticipating and then proactively dealing with occupants’ needs; or a retailer using data streams from its stores and warehouses to streamline operations – IoT systems can be transformational.
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Wave Computing Announces Strategic Collaboration with Broadcom For Next-Generation AI DPU ASIC (Thursday Aug. 02, 2018)
Wave Computing today announced a strategic collaboration with Broadcom Inc.. The companies will collaborate to bring Wave’s next-generation dataflow processing unit (DPU) to market at the leading-edge 7nm process node.
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Chinese chipmaker Tsinghua Unigroup to buy France's Linxens for $2.6 billion: sources (Thursday Jul. 26, 2018)
China’s top state chip manufacturer Tsinghua Unigroup Ltd has signed a deal to acquire French smart chip components maker Linxens for about 2.2 billion euros ($2.6 billion), five people with direct knowledge of the matter said.
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Kandou Bus Closes Series B Investment Round (Wednesday Jul. 25, 2018)
Kandou Bus, S.A., a world leader in development of SerDes IP and chip solutions, has completed its Series B investment round with a $15M investment from Bessemer Venture Partners and Walden Investment. The close of the Series B signifies Kandou’s accomplishment of critical research and development milestones and key design wins.
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Samsung Foundry and Arm Expand Collaboration to Drive High-Performance Computing Solutions (Tuesday Jul. 24, 2018)
Samsung Electronics, a world leader in advanced semiconductor technology, today announced that its strategic foundry collaboration with Arm will be expanded to 7/5-nanometer (nm) FinFET process technology to remain a step ahead in the era of high-performance computing.
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Ferroelectric Memory Company receives growth financing from eCAPITAL and HTGF (Thursday Jul. 19, 2018)
Ferroelectric Memory Company (FMC), an enterprise that commercializes technology for disruptive non-volatile memory solutions for microcontrollers, announced today the successful closing of a € 4.6 million growth financing led by eCAPITAL entrepreneurial Partners AG under participation of High-Tech Gründerfonds.
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Lattice Semiconductor Takes Additional Action to Reduce Operating Expenses; Company to Discontinue Millimeter Wave Business to Focus on Core Business Opportunities (Thursday Jul. 19, 2018)
Lattice Semiconductor announced the Company will discontinue its millimeter wave business, which is expected to result in approximately $25 million of primarily non-cash restructuring and impairment charges in the second quarter of 2018, and an annualized reduction in operating expenses of approximately $13 million.
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SWIM.AI Secures $10M in Series B Funding (Thursday Jul. 19, 2018)
Funding led by Cambridge Innovation Capital with a strategic investment from Arm will fuel SWIM.AI’s growth to address new markets, launch an AI R&D center in Cambridge, UK and accelerate development to meet growing demand for SWIM EDX software
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Xilinx Announces the Acquisition of DeePhi Tech (Wednesday Jul. 18, 2018)
Xilinx, Inc. (NASDAQ: XLNX) the leader in adaptive and intelligent computing, announced today that it has acquired DeePhi Technology Co., Ltd (DeePhi Tech), a Beijing-based privately held start-up with industry-leading capabilities in machine learning, specializing in deep compression, pruning, and system-level optimization for neural networks.
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Arm joins industry leaders in commitment to fair enforcement of open source licenses (Monday Jul. 16, 2018)
Today, Red Hat announced that several leading technology companies, including Arm, are joining a diverse coalition of organizations that have come together to promote greater predictability in open source license enforcement.
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Intel to Acquire eASIC (Friday Jul. 13, 2018)
Intel Plans to Expand Its Portfolio to Include Structured ASICs, which are Well Suited for High-Performance and Power-Constrained Applications
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Terminus Circuits Brings Complete ASIC Solutions to DesignShare (Tuesday Jul. 10, 2018)
SiFive adds Terminus Circuits to include interconnect solutions, speeding time-to-market for leading RISC-V platform ecosystem
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Synopsys and Siemens Team Up to Expand and Extend Electronic Design Automation Collaboration (Wednesday Jul. 04, 2018)
Synopsys, Inc. (NASDAQ: SNPS) and Siemens PLM Software today announced that they have agreed to collaborate on a wide range of electronic design automation (EDA) product interoperability projects for the benefit of their mutual customers. The collaboration spans a number of EDA domains from design to verification.
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Sonics Partners With SiFive To Support Agile RISC-V SoC Design Platform With IP Industry's Most Widely Used NoCs (Monday Jul. 02, 2018)
Sonics, Inc., the world's foremost supplier of on-chip network (NoC) and power management technologies and services, announced a partnership with SiFive, the leading provider of market-ready processor core IP based on the RISC-V instruction set architecture.
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UMC Acquires 100% Ownership of Mie Fujitsu Semiconductor (Monday Jul. 02, 2018)
Fujitsu Semiconductor Limited (Fujitsu Semiconductor) and United Microelectronics Corporation (NYSE: UMC; TWSE: 2303) ("UMC"), a leading global semiconductor foundry, today announced that UMC will acquire all of the shares of Mie Fujitsu Semiconductor Limited (MIFS), a 300mm wafer foundry joint venture between both companies.
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Inside Secure and Andes join forces to deliver secure IoT solutions to chipmakers for greater China and Asia markets (Thursday Jun. 28, 2018)
Inside Secure and Andes Technology are announcing a strategic partnership to bring the most advanced security capabilities to chipmakers for IoT applications and cloud connectivity.