2-stage Power Amplifier 28GHz ultra-efficient Dual-Drive™ PA
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ArterisIP and ResilTech Announce Strategic Partnership to Facilitate ISO 26262 Compliance for Complex Autonomous Automotive Systems (Tuesday Jun. 20, 2017)
ArterisIP and ResilTech S.R.L. today announced a strategic partnership to help semiconductor design teams efficiently validate ISO26262 functional safety levels for automotive systems-on-chip.
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Truechip Collaborates with OmniPhy for Verification of PCIe Gen4 IP solution (Monday Jun. 19, 2017)
Truechip Solutions, the Verification IP specialist and OmniPhy, a leading mixed-signal semiconductor IP company, today announced association for collaborative verification of PCIe Gen 4. The two companies enter into a partnership to provide the customers a solution that is comprehensively tested and bug free.
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Silvaco to Acquire SoC Solutions (Monday Jun. 19, 2017)
Silvaco, Inc. today announced it has entered into a letter of intent to acquire SoC Solutions. Founded in 2000, SoC Solutions is a privately held company providing semiconductor IP and services located in the greater Atlanta, Georgia area.
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Achronix Revenues to Grow 700% YoY and Exceed $100M in 2017 (Wednesday Jun. 14, 2017)
Achronix announced today that its revenues will grow over 700% year-over-year and will exceed $100M in 2017. Achronix’s exceptional growth is driven primarily by sales of its Speedster22i FPGA family and licensing of its Speedcore embedded FPGA (eFPGA) IP products.
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The European Commission opens in-depth investigation into Qualcomm's proposed acquisition of NXP (Monday Jun. 12, 2017)
The European Commission has opened an in-depth investigation to assess the proposed acquisition of NXP by Qualcomm under the EU Merger Regulation. The Commission has concerns that the transaction could lead to higher prices, less choice and reduced innovation in the semiconductor industry.
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QuickLogic Establishes eFPGA Support Center to Accelerate IP Licensing Model (Wednesday May. 31, 2017)
QuickLogic today announced that it has established a new support center in Taiwan to accelerate the adoption of the company's ArcticPro™ embedded FPGA (eFPGA) IP.
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Synopsys Initiates $100 Million Accelerated Share Repurchase Agreement (Friday May. 26, 2017)
Synopsys, Inc. (Nasdaq: SNPS) today announced that it has entered into an accelerated share repurchase agreement (ASR) with JPMorgan Chase Bank, National Association, to repurchase an aggregate of $100 million of Synopsys stock.
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UltraSoC attracts fresh investment as technology industry recognizes huge potential for embedded intelligence (Friday May. 26, 2017)
UltraSoC today announces the completion of a £5m ($6.4m) funding round to drive continued deployment of its technology and realize its vision of embedding intelligent analytics capabilities into every chip.
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Perceptia Joins GlobalFoundries FDXcelerator Program to Bring PLL Technology to Portable Devices (Thursday May. 25, 2017)
Perceptia Devices, Inc., a developer of innovative phase-locked loop (PLL) and timing technology, today announced that it has joined GLOBALFOUNDRIES’ FDXcelerator™ Partner Program, an expanding FD-SOI ecosystem to enable faster, broader deployment of the foundry’s 22FDX® and 12 FDX™ FD-SOI processes that support IoT, mobile, and wireless applications.
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Unprecedented growth at EnSilica sees a major recruitment drive to fuel its continued expansion (Monday May. 22, 2017)
Unprecedented growth of over 80% this year at EnSilica, a leading independent provider of semiconductor solutions and IP, has created a further requirement within the company for a major recruitment drive to fuel its continued expansion in the next 12 months and beyond.
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TDK Completes Acquisition of InvenSense (Friday May. 19, 2017)
TDK Corporation and InvenSense, Inc. announce that TDK has completed the all-cash acquisition of InvenSense. The acquisition price was $13.00 USD per InvenSense share, and the total acquisition price was approximately $1.3 billion USD.
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Xilinx Invests in Machine Learning Pioneer DeePhi Tech (Thursday May. 18, 2017)
Xilinx, Inc. (XLNX) today announced that it has invested in DeePhi Tech, a recognized leader in machine learning specializing in deep compression, compiling toolchain, and system-level optimization.
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ARM and CSNE from the University of Washington partner to develop brain-implantable chips (Tuesday May. 16, 2017)
ARM and the Center for Sensorimotor Neural Engineering (CSNE) have signed an agreement whereby the CSNE will develop a unique ‘brain-implantable’ system-on-a-chip (SoC) for bi-directional brain-computer interfaces (BBCI) aimed at solving neurodegenerative disorders.
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Sondrel Agrees to Acquire IMG Works Division of Imagination Technologies (Monday May. 15, 2017)
Sondrel announced today that it has signed an agreement to acquire the IMGworks division of Imagination Technologies. The IMGworks engineering team will join with Sondrel’s existing engineering consultancy to create a combined IC design capability comprising more than 250 highly skilled employees.
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Logic Fruit and Accelize Announce Strategic Partnership to deliver Next Gen IP cores (Wednesday May. 10, 2017)
Logic Fruit and Accelize have announced a new strategic partnership. The partnership will combine Logic Fruit’s expertise in Design Services, Video & Security IPs Cores with Accelize’s market leading Cloud workload FPGA acceleration technologies to deliver solutions for today’s increasingly data rich world.
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Flex Logix Raises $5 Million In Series B Funding (Monday May. 08, 2017)
Flex Logix™ Technologies, Inc., the leading supplier of embedded FPGA IP and software, today announced it has secured $5 million in Series B equity financing.
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SiFive Secures $8.5 Million Series B Funding to Advance RISC-V Based Semiconductors (Monday May. 08, 2017)
SiFive, the first fabless provider of customized, open-source-enabled semiconductors, today announced it has raised $8.5 million in a Series B round led by Spark Capital with participation from Osage University Partners and existing investor Sutter Hill Ventures.
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China Mobile, ARM, Cavium and Enea Sign Agreement for Cooperation in China Mobile Open NFV Testlab (Thursday May. 04, 2017)
China Mobile, ARM, Cavium and Enea® (NASDAQ OMX Nordic:ENEA) today announced an agreement on collaboration in the China Mobile Open NFV Testlab. The collaboration will use Enea’s OPNFV-based commercial, Enea® NFV Core platform, and Cavium’s ARM®-based ThunderX® workload-optimized datacenter server processors.
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Imagination: Year end trading update, Apple dispute resolution procedure and planned sale of MIPS and Ensigma (Thursday May. 04, 2017)
Imagination Technologies Group plc (LSE: IMG, “Imagination”, “the Group”), a leading multimedia, processor and communications technology company, publishes a trading update for the year to 30 April 2017, has commenced a dispute resolution procedure with Apple Inc. (“Apple”) and announces that it intends to sell its MIPS and Ensigma businesses.
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IAR Systems invests in IoT security by acquiring equity stake in Secure Thingz (Thursday Apr. 27, 2017)
IAR Systems, a future-proof supplier of software tools and services for embedded development, today announced an alliance with Secure Thingz, a provider of advanced security solutions focused on the Internet of Things (IoT), to enable more secure, connected devices across their lifecycle.
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AMD Expands Technology Portfolio to Drive Immersive Computing Vision with Acquisition of Wireless Virtual Reality IP from Nitero (Tuesday Apr. 25, 2017)
AMD (NASDAQ: AMD) today announced it has acquired intellectual property (IP) and key engineering talent from Nitero, a pioneer in millimeter wave solutions capable of enabling future generations of wireless Virtual Reality (VR) and Augmented Reality (AR) headsets.
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Barco Silex and Intrinsic ID to Integrate Security Technology (Tuesday Apr. 25, 2017)
Intrinsic ID and Barco Silex today announced the companies are partnering to offer their customers the benefit of integrated security technologies by enabling the use of Intrinsic ID’s BROADKEY or QUIDDIKEY in combination with Barco Silex’s ESECURE.
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Mentor collaborates with Microsoft to accelerate Internet of Things solutions (Monday Apr. 24, 2017)
Mentor, a Siemens business, today announced it has joined Microsoft Azure Certified for Internet of Things (IoT), ensuring customers get IoT solutions up and running quickly with hardware and software that has been pre-tested and verified to work with Microsoft Azure IoT services.
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Rambus Expands Cryogenic Memory Collaboration with Microsoft (Tuesday Apr. 18, 2017)
Rambus today announced an expanded collaboration with Microsoft researchers to develop prototype systems that optimize memory performance in cryogenic temperatures.
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Synapse Design Acquires Asilicon to Address Customer Demand and Provide Increased Access to Off-Shore Design Centers (Thursday Apr. 13, 2017)
Synapse Design today announced that the Company has acquired Asilicon. Through this acquisition, Synapse Design adds a second design center in India and gains an additional 80 engineers which will grow to 200 within one year.
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Xilinx Announces Multi-Year Succession Plan and New COO (Thursday Apr. 13, 2017)
Xilinx today announced a multi-year CEO succession plan, including two senior level promotions. Victor Peng will become Chief Operating Officer (COO) of Xilinx, effective immediately.
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Moortec and UltraSoC collaborate to enable next-generation "smart" PVT sensors (Wednesday Apr. 12, 2017)
By integrating UltraSoC’s digital monitoring and optimization capabilities, with Moortec’s industry-leading PVT products this enables powerful, chip-wide infrastructure to improve SoC performance and reliability.
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Shanhai Capital Completes Acquisition of Analogix Semiconductor (Friday Apr. 07, 2017)
Analogix Semiconductor, Inc. and Beijing Shanhai Capital Management Co, Ltd. (Shanhai Capital), today jointly announced the completion of the approximately $500 million acquisition of Analogix Semiconductor. China Integrated Circuit Industry Investment Fund Co., Ltd. (China IC Fund) joined Shanhai Capital’s fund as one of the limited partners.
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Valens Raises $60M to Boost Growth, Innovation in Automotive Industry (Friday Apr. 07, 2017)
Valens, the developer of HDBaseT and co-founder of the HDBaseT Alliance, announced it has secured an additional $60 million in capital, to fuel the company’s inroads into the automotive industry with its ground-breaking HDBaseT technology.
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China's Tsinghua Secures $22 Billion in State Backing (Thursday Apr. 06, 2017)
China's Tsinghua Unigroup Ltd. announced it secured deals that would provide it with an additional 150 billion yuan (about $21.8 billion) in financing from two government-backed sources.