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IP-Maker Expands Global Sales Reach, Adds Silicon Valley Representation for its Memory Products (Monday Apr. 28, 2014)
IP-Maker, the expert in intellectual property (IP) for high performance storage applications, is expanding its worldwide sales channel in the United-States. The company has signed an agreement with Fides Sales, a sales representation and business development firm focused on the electronics design sector, located in Silicon Valley.
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Many-core processor IP company Recore Systems secures $2 million Series B investment for go-to-market (Friday Apr. 25, 2014)
Recore Systems, a many-core processor IP company, today announced that it has closed $2 million in Series B financing, bringing its total raise to date to $5 million. Initial Series A investors Point One Innovation Fund, Participatiemaatschappij Oost Nederland and Twente Technology Fund led this Series B financing round.
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Panasonic and Fujitsu Form Fabless Chip Company (Thursday Apr. 24, 2014)
Fujitsu Limited, Panasonic Corporation, and Development Bank of Japan, Inc. (DBJ) have signed a memorandum of understanding in which DBJ will make an investment and provide a line of credit for a new fabless company specializing in system LSI design and development which Fujitsu and Panasonic will jointly establish.
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Codasip Secures $2.8 Million First Round of Funding, Led by Credo Ventures (Wednesday Apr. 23, 2014)
Application specific processor design tool and IP provider Codasip, today announced that it has closed its first round of public funding totaling $2.8 million. This new investment will be used to further develop Codasip’s unique technology that enables ASIP’s to be programed using the same standard flows as existing processors.
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Sonics Expands Market Lead in Network-On-Chip (Tuesday Apr. 22, 2014)
In the latest release of its Market Share: Semiconductor Design Intellectual Property, Worldwide, 2013 which was release on March 27, 2014, Gartner, Inc.’s report showed that Sonics, Inc. had not only retained its lead over the other network-on-chip suppliers, but that its lead had significantly expanded. In addition, the report data confirms that Sonics is the leading private Semiconductor IP vendor.
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Cadence to Expand Verification Solution with Acquisition of Jasper Design Automation (Tuesday Apr. 22, 2014)
Cadence today announced that it has entered into a definitive agreement to acquire Jasper Design Automation, Inc., a leading provider of formal analysis solutions, for approximately $170 million in cash. Jasper had approximately $24 million of cash, cash equivalents and short-term investments as of December 31, 2013.
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Altera and TSMC Collaborate to Bring Advanced Packaging Technology to Arria 10 FPGAs and SoCs (Monday Apr. 21, 2014)
Altera and TSMC today announced the two companies have worked together to bring TSMC’s patented, fine-pitch copper bump-based packaging technology to Altera’s 20 nm Arria®10 FPGAs and SoCs. Altera is the first company to adopt this technology in commercial production to deliver improved quality, reliability and performance to Altera’s 20 nm device family.
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MIPI UniPort-M Selected by Google for Modular Smartphone "Project Ara" (Tuesday Apr. 15, 2014)
The MIPI®Alliance, an international organization that develops interface specifications for mobile and mobile-influenced industries, is proud to announce that Google, Inc. has chosen the MIPI UniPort-M protocol for its smartphone Project AraModule Developers Kit (MDK).
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Sunrise Micro Devices partners with Wicentric to offer a complete Bluetooth® Smart software solution for its first sub-volt IoT product (Thursday Apr. 10, 2014)
Wireless intellectual property (IP) company Sunrise Micro Devices Inc. (SMD), has partnered with Wicentric, a leader in Bluetooth software solutions, to develop powerful and efficient protocol stack software optimized for CORDIO™ BT4 radio core, SMD’s first radio core offering from the CORDIO family of sub-volt wireless products.
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Ineda Systems Secures $17M in Series B Funding From Key Partners (Tuesday Apr. 08, 2014)
Ineda Systems, a developer of low-power SoCs (system on a chip) for use in the fast-growing wearables and Internet of Things (IoT) market segment, today announced that it has raised $17M in Series B funding.
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Ineda Systems Delivers Breakthrough Power Consumption for Wearable Devices and the Internet of Things (Tuesday Apr. 08, 2014)
Ineda Systems, a leader of low-power SoCs (system on a chip) for use in both consumer and enterprise applications, today announced its Dhanush family of Wearable Processing Units (WPU™). The Dhanush WPU family supports a large range of wearable devices including fitness bands, smart watches, glasses, athletic video recorders and the Internet of Things.
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Freescale enters into definitive agreement to purchase Mindspeed ARM processor business from MACOM (Tuesday Apr. 08, 2014)
Freescale Semiconductor has entered into a definitive agreement to purchase the Comcerto® CPE communications processor business of Mindspeed Technologies, Inc. This business includes a series of multicore, ARM®-based embedded processors and associated software, a talented team, and Tier One customers spanning the globe.
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HDL Design House Signs Representative Agreement with Laflin Limited for Japan Market (Tuesday Apr. 08, 2014)
HDL Design House, provider of high performance digital and analog IP cores and SoC design and verification services, has announced that it has signed a representative agreement with Laflin Limited. Laflin is a sales rep firm targeting the Asia-Pacific market with focus on Japan, promoting semiconductor IP and EDA products from leading 3rd-party providers.
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DMP Expands Image Cognition Processor IP "APEX ICP" Sales to Taiwan Market (Monday Apr. 07, 2014)
DMP, a provider of 3D/2D graphics and Computing IP (Intellectual Property) cores, announced today that DMP acquired the sole rights to sell CogniVue’s embedded computer vision IP “APEX Image Cognition Processor (ICP)” cores to the Taiwan market in addition to the Japan market.
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INSIDE Secure acquires Metaforic, gaining access to key technologies for enabling cloud-based mobile payments security with Host Card Emulation (HCE) (Monday Apr. 07, 2014)
INSIDE Secure today announced that it has acquired Metaforic, a leader in the development of software obfuscation [1] technologies and encryption-related security software for a variety of industries, including the mobile payment and mobile banking markets.
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New leadership in place at KALRAY along with $8 million funding (Monday Apr. 07, 2014)
KALRAY, designer and provider of low-power, high-performance Manycore processors, today announced that Eric Baissus has been appointed CEO of the company. Concurrently, KALRAY has secured $8 million in funding, led by ACE Management, CEA Investissement and private investors including Eurekap! to further develop its international market presence and prepare its next generation chip.
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INSIDE Secure to sign a new NFC technology and IP license agreement with Intel (Tuesday Apr. 01, 2014)
INSIDE Secure today announced it intends to enter into a new agreement with Intel Corporation, building on the relationship initiated with their NFC technology license agreement in 2011.
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TowerJazz Announces Completion and Kick-off of its Joint Venture with Panasonic Corporation (Tuesday Apr. 01, 2014)
Within the scope of the JV, Panasonic transferred its semiconductor manufacturing process and capacity tools of 8 inch and 12 inch wafers at its Hokuriku factories (Uozu, Tonami and Arai) to the JV, committing to acquire its products from the JV for a long-term period of at least five years of volume production.
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Crossbar Closes Series C Funding of $25M; Oversubscribed Round Validates Company's Readiness to Scale (Tuesday Apr. 01, 2014)
Crossbar, Inc., a start-up company pioneering Resistive RAM (RRAM) technology, today announced it has completed a $25 million Series C funding in an oversubscribed round. Participating in the round were Crossbar’s existing investors Artiman Ventures, Kleiner Perkins Caufield & Byers, Northern Light Venture Capital and the University of Michigan.
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S3 preps DAC product with a twist (Wednesday Mar. 26, 2014)
S3 Group Ltd. (Dublin, Ireland), best known as a supplier of design services and intellectual property to the semiconductor, TV and telehealth sectors, is preparing to sell complete ICs – but not under its own name.
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EnVerv Announces Closing of $15.4M Series C Investment Round (Tuesday Mar. 25, 2014)
EnVerv Inc., a fabless semiconductor company and a provider of high performance communications and metering System on Chip (SoC) solutions for the Advanced Metering Infrastructure (AMI), smart grid, solar and other grid connectivity markets, announced today the closing of its $15.4M round of series C financing with participation from Cassiopeia Capital Partners, Cisco, UMC Capital and existing investors Benchmark Capital, NEA and Walden International.
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Synopsys Completes Coverity Acquisition (Tuesday Mar. 25, 2014)
Synopsys has completed its acquisition of Coverity, the leading provider of software quality, testing and security tools. The value of the transaction is approximately $334 million net of cash acquired, which Synopsys is funding using a combination of cash and approximately $200 million in debt.
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Sonics Partners With Maojet Technology Corp. (Tuesday Mar. 25, 2014)
Sonics today signed a new representation agreement with Maojet Technology. to deliver and distribute Sonics' full line of on-chip network products and services for the growing Taiwanese market.
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Mentor Graphics Acquires Berkeley Design Automation to Advance Nanometer Analog/Mixed-Signal Verification (Friday Mar. 21, 2014)
Mentor Graphics Corp. (NASDAQ: MENT) today announced that it has acquired Berkeley Design Automation, Inc. (BDA), a recognized leader in nanometer analog, mixed-signal, and RF circuit verification
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Cortus and Secure-IC Team up to Secure Smart Cards (Wednesday Mar. 19, 2014)
Secure-IC and Cortus combine threat protection and low power processor IP cores to enable the creation of silicon efficient card designs which maximize digital trust
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Aquantia Completes $16M Series G Financing (Monday Mar. 17, 2014)
Aquantia, the market leader of high-speed Ethernet connectivity solutions for data centers, mobile and Enterprise infrastructure, today announced the completion of series G financing for $16 million. Xilinx led the round and existing investors provided additional capital.
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Imagination Technologies Group plc - Interim Management Statement (Thursday Mar. 06, 2014)
Imagination Technologies is today issuing its Interim Management Statement for the period from 1 November 2013 to 5 March 2014. The Group has continued to develop and make good progress in its strategy of providing the key processor IP cores needed for the broadest range of System-on-Chips (SoC) and the markets they target.
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Altera and Intilop sign an agreement to offer intilop's UDP/TCP & EMAC IP cores embedded with OpenCL development Kit for end users and developers (Thursday Mar. 06, 2014)
The industry leader with 77 nanosecond latency and highest throughput, Network Hardened, most mature and most widely adapted over the last 5 years, Intilop’s UDP/TCP Accelerators, pre-integrated with OpenCL host kit provide an out-of-box working subsystem.
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InterDigital and imec Target Small Cell Backhaul With Phased Array Technology Agreement (Monday Feb. 24, 2014)
InterDigital and imec today announced an agreement to develop 60 GHz millimeter wave (mmW) radio and phased array technology for small cell backhaul and 5G wireless communications. The technology will enable easier deployments for small cell mobile backhaul resulting in lower cost solutions for high-speed data delivery.
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Truechip Partners with WWAGO to Market Verification IP Products in China (Monday Feb. 24, 2014)
Truechip Solutions, the verification IP specialist, announced today that they have appointed WWAGO as their authorized sales representative for the China market.