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French consortium announces development of a clockless smartcard chip (Monday Apr. 29, 2013)
Tiempo has initiated the collaborative project “ASMART” with several added value partners to develop an innovative smartcard chip prototype. This chip will combine Tiempo secured clockless platform with CEA-Leti innovative contactless interface and Invia best-in-class security sensors. It also embeds a secured operating system developed by Gemalto in order to effectively demonstrate the benefits of Tiempo unique asynchronous technology for secured contactless applications.
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Netronome Secures $19 Million in Series E Financing (Friday Apr. 19, 2013)
Netronome, a fabless semiconductor company and the leading developer of flow processors, announced today that it has raised $19 million in series E and related financing from Sourcefire, Intel Capital and existing investors DFJ Esprit and the Raptor Group.
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ARM Introduces New License Model For Big.Little Technology to Enable Wider Adoption (Wednesday Apr. 17, 2013)
ARM has announced a new licensing model to enable broader access to big.LITTLE™ processing technology for ARM partners. By using multiple processors that are developed for different energy and performance budgets, big.LITTLE provides optimum performance and maximum efficiency.
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Arasan Global Support Program Emphasizes Fastest Possible Problem Resolution (Tuesday Apr. 16, 2013)
Arasan announced today its Support Everywhere! program providing in-depth technical support for its customers, regardless of their location, with the goal of providing the quickest possible solutions.
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Systemcom Ltd. and JVD, Inc. Form Working Relationship (Tuesday Apr. 16, 2013)
JVD Inc., inventor of the iASIC™ and a leader in Analog and Mixed-Signal ASIC Design and Manufacturing announced today that it has agreed to cooperate on several strategic levels with Systemcom, Ltd. of Zagreb, Croatia. Under the terms of the agreement, JVD will have access to Systemcom’s technical design resources, giving JVD a greater range of design skills from which to service its growing demand for Analog ASICs.
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HDL Design House appoints Airics as representative for the Nordic region (Tuesday Apr. 16, 2013)
HDL Design House has announced today the appointment of Airics, headquartered in Sweden, as its representative for the Nordic region.
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Altera Expands OTN Solution Capabilities with Acquisition of TPACK (Monday Apr. 15, 2013)
Altera today announced it has agreed to acquire TPACK, a wholly-owned subsidiary of Applied Micro Circuits Corporation. TPACK delivers complete FPGA-based OTN products targeting packet and optical networking equipment suppliers.
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Kilopass Continues to Grows Despite Legal Setbacks (Monday Apr. 15, 2013)
Kilopass today expressed its disappointment with the U.S. Court of Appeals for the Federal Circuit affirming without opinion the U.S. District Court opinion on Summary Judgment in the patent infringement case against Sidense. Despite the setback, Kilopass continues to grow.
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Analog Bits Surpasses 300 Customers Continuing their growth as the leading provider of mixed-signal IP (Wednesday Apr. 10, 2013)
Analog Bits has recently achieved the remarkable goal of winning their 300th licensee. This result has been fueled by the creation of product portfolio containing over 600 unique IP products spanning 50 different manufacturing process nodes, including TSMC’s 20nm.
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Open-Silicon Extends its TSMC VCA Partnership to Include Israel (Monday Apr. 08, 2013)
Open-Silicon today announced that it has extended its TSMC Value Chain Aggregator (VCA) program membership to include Israel. Open-Silicon has been a TSMC partner in North America since its founding in 2003.
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Cisco Announces Intent to Acquire Ubiquisys (Thursday Apr. 04, 2013)
Cisco today announced its intent to acquire privately held Ubiquisys, headquartered in Swindon, U.K. Ubiquisys is a leading provider of intelligent 3G and long-term evolution (LTE) small-cell technologies that provide seamless connectivity across mobile heterogeneous networks for service providers.
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Exar Corporation Acquires Altior Inc. to Provide Additional Growth in Data Compression (Monday Mar. 25, 2013)
Exar today announced that it will acquire the assets of Altior Inc., a privately held company in Eatontown, New Jersey. The transaction, expected to close on March 22, 2013.
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Imagination and TSMC Strengthen Technology Collaboration (Monday Mar. 25, 2013)
Imagination will work closely with TSMC to develop highly optimised reference design flows and silicon implementations using Imagination’s industry-leading PowerVR Series6 GPUs combined with TSMC’s advanced process technologies, including 16-nanometer (nm) FinFET process technology.
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Truechip Partners with Avant Technology to Market Verification IP Products in Asia (Monday Mar. 25, 2013)
Avant Technology announced today that they have partnered with Truechip Solutions to bring the "Verification IPs", into Asia market.
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DELTA Microelectronics to Expand Global Activities Through New Joint Alliance with ChipStart (Friday Mar. 22, 2013)
Leading semiconductor IP developer, integrator and aggregator to assist in expansion of DELTA’s presence in North America, focusing on system houses looking for wireless sensor, optical, payment system and RFID solutions
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Arasan Chip Systems Announces New Channel Partner in India (Monday Mar. 18, 2013)
Arasan announced today that the company has increased its International support through a partnership with FTD Automation Pvt Ltd in Bangalore, India. FTD Automation will provide Sales support for Arasan in India, while serving as point of contact for all customers in this region.
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ST-Ericsson announces global workforce review (Monday Mar. 18, 2013)
ST-Ericsson, a joint venture (JV) of STMicroelectronics and Ericsson, today announced a plan for a global workforce review, following the announcement made today by Ericsson and STMicroelectronics about the future of the joint venture.
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Ericsson and STMicroelectronics agree on strategic way forward for ST-Ericsson (Monday Mar. 18, 2013)
Ericsson and STMicroelectronics today announced an agreement on the way forward for the joint venture (JV) ST-Ericsson. After months of intensive joint work, the parent companies have selected the strategic option which maximizes their respective future prospects and growth plans.
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SingMai Electronics and Cadeka Microcircuits have announced a partnership to jointly promote aCVi (Monday Mar. 18, 2013)
SingMai Electronics and Cadeka Microcircuits have announced a partnership to jointly promote aCVi. SingMai Electronics of Thailand and Cadeka Microcircuits of the United States have announced a partnership to jointly promote aCVi, the Advanced Composite Video Interface.
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Imagination Technologies Group pl - Interim Management Statement (Tuesday Mar. 12, 2013)
Imagination Technologies is today issuing its Interim Management Statement for the period from 1 November 2012 to 11 March 2013.
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Cadence to Acquire Tensilica (Tuesday Mar. 12, 2013)
Cadence today announced that it has entered into a definitive agreement to acquire Tensilica, Inc., a leader in dataplane processing IP, for approximately $380 million in cash. Tensilica had approximately $30 million of cash as of December 31, 2012.
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Chips&Media Partners Ship Over 120 Million Video Devices To-Date (Wednesday Mar. 06, 2013)
Chips&Media today announced that Chips&Media-powered devices reached the accumulated shipment record of 120 million units in only 6 years after its first shipping in 2006.
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eMemory's eNVM SIPs Reach 5 Million Wafer Production Record (Wednesday Mar. 06, 2013)
eMemory announced today that the accumulated number of customers’ wafers incorporating eMemory’s eNVM SIPs have now surpassed 5 million production mark. eMemory’s eNVM SIPs support a broad range of process platforms including logic, HV, SiGe, RF, and mixed signal throughout 0.5 microns to 40 nanometers technology.
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Kilopass Receives $8 Million Funding to Expand Technology Roadmap (Tuesday Mar. 05, 2013)
Kilopass announced today that it has received an $8 million funding from a major consumer electronics licensee who wishes to remain anonymous until its own product launch.
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MegaChips Completes Design Center Agreement with Tensilica to Enhance R&D and Expand Marketing Collaboration (Monday Mar. 04, 2013)
MegaChips and Tensilica, Inc. completed a design center agreement that will enhance research and development (R&D) and expand marketing collaboration, enabling large-scale integration (LSI) product customers to get advanced functionality with shorter lead times.
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Avant Technology Inc to represent Recore Systems' IP products in Asia (Friday Mar. 01, 2013)
Avant Technology is now a representing partner of Recore Systems. Avant Technology will market and support Recore Systems’ versatile Xentium DSP IP core for their customers in Taiwan, China, Malaysia, Singapore, Japan and Korea.
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CEVA DSPs Continue to Lead the Way at Mobile World Congress (Tuesday Feb. 26, 2013)
CEVA today announced that its customers, partners and CEVA-powered OEMs have come out in full force at Mobile World Congress 2013, debuting a wide range of new products, solutions and end-market devices at the show.
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Adoption of ARM big.Little Technology Accelerates (Tuesday Feb. 26, 2013)
ARM today unveiled that its big.LITTLE processing technology has been adopted by many of the world’s leading mobile chip manufacturers. Samsung and Renesas Mobile have already announced their plans, and subsequent implementations will be revealed during 2013 by five more companies including CSR, Fujitsu Semiconductor and MediaTek.
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videantis Announces Completion of New Financing Round (Tuesday Feb. 26, 2013)
videantis announced today the completion of a new multi-million US-$ round of financing. The round was led by Hannover Beteiligungsfonds (HBF) under participation of a further set of institutional investors.
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ASOCS and CMCC team up to deliver mass market high capacity, commercially viable C-RAN solutions (Monday Feb. 25, 2013)
ASOCS and CMRI, the world’s largest Mobile Operator, announced today the signing of a strategic memorandum of understanding for the joint development, commercialization, testing and deployment of large scale baseband processing units for China Mobile's next generation Cloud-RAN network.