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Deals / Success Stories News

• GOWIN Semiconductor Licenses Andes Technology RISC-V CPU Core For Its Arora GW-2A FPGA Family Products (Monday Oct. 01, 2018)
  Andes Technology announces that GOWIN Semiconductor has licensed Andes Technology’s RISC-V CPU core for its Arora® GW-2A FPGA family of products.
  
  
• GreenWaves Technologies Licenses Intrinsic ID Hardware Root of Trust for RISC-V AI Application Processor (Thursday Sep. 27, 2018)
  GreenWaves Technologies and Intrinsic ID today announced GreenWaves has licensed QuiddiKey for the next generation of its IoT application processors.
  
  
• GEO Deploys Mixel's MIPI Solution in the World's First Edge Based Automotive Smart Viewing Camera Processor (Wednesday Sep. 26, 2018)
  Mixel announced today that GEO Semiconductor, Inc. (“GEO”), the market leader in camera video processors (CVP) for automotive viewing cameras, has licensed the Mixel MIPI® IP, incorporated it into the GW5 product family and achieved first-time silicon success.
  
  
• Terasic chooses Enyx to offer ultra-low latency development framework and design services for their latest FPGA platform (Wednesday Sep. 26, 2018)
  Terasic, the premier developer of Intel FPGA platforms today announced a partnership with Enyx, the leading independent provider of FPGA-enabled, ultra-low latency trading technologies, offering integrated Enyx FPGA IPs for an ultra-low latency, customized development framework on Terasic’s DE5a-Net DDR4 accelerator.
  
  
• Floadia G1 eFlash IP has exceeded 30,000 wafers shipment at Powerchip for system LSI customers (Tuesday Sep. 25, 2018)
  Floadia Corporation (Floadia), a leading provider of embedded flash semiconductor intellectual property (IP), and Powerchip Technology Corporation (Powerchip (PTC), TWSE: 5346), a leading global wafer foundry, today announced that Floadia LEE Flash G1 (G1) – embedded flash (eflash) IP has been adopted by 3 SoC and the shipment has exceeded 30,000 wafers on PTC’s 90nm process node (12 inch).
  
  
• Boeing Defense, Space & Security Licenses Flex Logix's Embedded Field-Programmable Gate Array on GlobalFoundries 14nm Process (Monday Sep. 24, 2018)
  Addressing the US aerospace industry’s growing need for embedded field-programmable gate arrays (eFPGAs), Flex Logix Technologies, Inc.,announced today that its EFLX4K Logic and DSP eFPGA IP cores are now in design for the 14nm process on GLOBALFOUNDRIES’ wafer fabrication facility in Malta, New York.
  
  
• ZCAN Licenses SonicsGN NoC and MemMax DRAM Scheduler for new Cryptocurrency Chip Design (Tuesday Sep. 18, 2018)
  Sonics announced that it has licensed both SonicsGN® and MemMax to ZCAN Microelectronics Technology, based in Shanghai, China. ZCAN plans to incorporate Sonics’ NoC and memory scheduling IP into its new cryptocurrency system-on-chip (SoC) design.
  
  
• LG Electronics Selects Synopsys HDMI 2.1 IP with HDCP 2.3 Content Protection to Deliver Immersive Viewing Experiences (Tuesday Sep. 18, 2018)
  Synopsys today announced that LG Electronics (LG) has selected silicon-proven DesignWare® HDMI 2.1 Controller IP with HDCP 2.3 content protection to deliver ultra-high-definition (UHD) video and high-fidelity audio in its latest generation of multimedia system-on-chips (SoCs).
  
  
• Media Links Integrates TICO Lightweight Compression into its MDP Series (Thursday Sep. 13, 2018)
  intoPIX, an innovative technology provider of video compression solutions, welcomes Media Links, manufacturer and pioneer in Media over IP transport technology, among the rapidly increasing list of TICO-enabled equipment manufacturers and solution providers.
  
  
• UltraSoC embedded analytics selected by Kraftway for solid state disk controller products (Wednesday Sep. 05, 2018)
  UltraSoC today announced that its embedded analytics technology has been licensed for use in advanced solid state disk (SSD) controller products by Kraftway, a leading supplier of IT solutions for government, healthcare, education, telecoms and banking.
  
  
• Artosyn Selects Synopsys DesignWare Security IP for Drone SoC (Wednesday Sep. 05, 2018)
  Synopsys today announced that Artosyn Microelectronics, a leading supplier of drone system-on-chips (SoCs) in China, has adopted the DesignWare® tRoot™ Hardware Secure Module (HSM) with Root of Trust, True Random Number Generator (TRNG) and cryptography accelerators for its latest drone SoC.
  
  
• Tiannengbo optimises their latest Mining Chip using Moortec's Embedded Temperature Sensor (Monday Sep. 03, 2018)
  Moortec, providers of complete In-Chip Monitoring PVT Subsystems announced today that Tiannengbo Information Technology have utilised Moortec’s Temperature Sensor IP to optimise performance and increase reliability in their latest mining ASIC.
  
  
• QuickLogic Collaborates with ETH Zurich to Integrate eFPGA into PULP Platform (Wednesday Aug. 08, 2018)
  QuickLogic Corporation today announced that the ETH Zurich, [in German: Eidgenössische Technische Hochschule Zürich (ETH)], a renowned technical university located in Zurich, Switzerland, will collaborate to integrate QuickLogic's ArcticPro embedded FPGA (eFPGA) technology onto the university's PULP platform.
  
  
• PLDA Announces Integration of their PCIe 3.0 Controller IP into Kazan Networks' NVMe Over Fabric Fuji ASIC, Providing a Dramatic Increase in Scalability and Flexibility for Storage Applications (Wednesday Aug. 08, 2018)
  PLDA, the industry leader in PCI Express® IP solutions and Kazan Networks, a leader in advanced storage technology based on the NVMe over Fabric (NVMe-oF™) standard, today announced the integration of PLDA’s XpressRICH3™ PCI Express Controller IP into Kazan’s Fuji NVMe-oF Bridge ASIC
  
  
• FADU Launches Industry Leading SSD Solutions Powered by SiFive RISC-V Core IP (Tuesday Aug. 07, 2018)
  SiFive, the leading provider of commercial RISC-V processor IP, and FADU, a fabless company developing solutions and systems for the memory and storage market, today announced the availability of FADU's Annapurna SSD Controller and FADU Bravo Series Enterprise SSD, powered by SiFive's industry leading 64-bit, E51 multicore RISC-V Core IP.
  
  
• Nurlink and Vidatronic Collaborate to Develop SoC for Internet of Things (IoT) Applications (Wednesday Aug. 01, 2018)
  Vidatronic, Inc., a leading developer of CMOS power management and radio frequency (RF) power intellectual property (IP) cores, today announced a collaboration with RF system-on-a-chip (SoC) design company, Nurlink Technology, to develop an unprecedented SoC solution built to power wireless communication systems for the Internet of Things (IoT).
  
  
• Chips&Media announced new ISP deal to provide 4K UHD (8Mpixel) resolution Image Signal Processing (ISP) IP (Monday Jul. 30, 2018)
  Chips&Media, Inc. a leading video IP company headquartered in Seoul, Korea, announced licensing contract to provide 4K (8Mpixel) resolution Image Signal Processing (ISP) IP with a Taiwanese SoC manufacturer.
  
  
• PLDA and HPE collaborate to develop Gen-Z semiconductor IP (Sunday Jul. 29, 2018)
  Hewlett Packard Enterprise (HPE) and PLDA®, an industry leader in high-speed interconnect IP, today announced a joint collaboration to meet the challenges of next-generation connectivity for advanced workloads.
  
  
• C-SKY selects UltraSoC embedded intelligence for Chinese developed AI SoC (Wednesday Jul. 25, 2018)
  UltraSoC today announced that C-SKY Microsystems Co Ltd (“C-SKY”), a China-based semiconductor company acquired by the Alibaba Group in April, has licensed UltraSoC’s embedded analytics technology for use in C-SKY’s China-developed system-on-chip (SoC) products.
  
  
• NXP and Dover Microsystems Join Forces to Deliver Unprecedented Network Security, Safety, and Privacy for Processors (Tuesday Jul. 24, 2018)
  Dover Microsystems, today announced the company has aligned with NXP Semiconductors™ N.V. (NASDAQ:NXPI), a worldwide leader in secure connectivity solutions. NXP will utilize Dover’s groundbreaking CoreGuard™ technology to create inherently secure processors for embedded devices.
  
  
• Rambus and Socionext Sign Broad Patent License Agreement (Tuesday Jul. 17, 2018)
  Rambus Inc. today announced that Socionext, a leader in state-of-the-art system-on-chip technology, has signed a patent license agreement.
  
  
• DSP Group and Inside Secure Collaborate on Development of Advanced Secured AI Processors (Friday Jul. 13, 2018)
  Inside Secure announced that DSP Group, a global provider of wireless chipset solutions for converged communications, licensed components of Inside Secure’s Root-of-Trust (RoT) technology to secure its personal communication solutions.
  
  
• Arteris IP Ncore and FlexNoC Interconnects and Resilience Packages Licensed by Mobileye for AI-Powered EyeQ Chips (Tuesday Jul. 10, 2018)
  Arteris IP today announced that Mobileye has purchased multiple licenses of Arteris IP Ncore Cache Coherent Interconnect, FlexNoC Interconnect, and the Ncore and FlexNoC Resilience Packages for functional safety and artificial intelligence (AI) hardware acceleration.
  
  
• Inside Secure Technology Chosen to Secure Kalray's Intelligent Processors for Autonomous Vehicles and Next-Generation Data Centers (Tuesday Jul. 10, 2018)
  Inside Secure announced that Kalray, a pioneer in processors for new intelligent systems, licensed the company’s Root of Trust solution and Multi-Protocol Engine for use in its groundbreaking processors.
  
  
• Rafael Micro Licenses Cadence Tensilica Fusion F1 DSP for Low-Power NB-IoT Modem IC (Thursday Jun. 28, 2018)
  Cadence Design Systems today announced that Rafael Micro, a leading global provider of silicon tuners, has licensed the Cadence® Tensilica® Fusion F1 DSP for its RT580 narrowband (NB) internet of things (IoT) modem IC, which integrates RF radio and includes necessary firmware support.
  
  
• BlueX License CEVA Bluetooth Low Energy IP for BX2400 Wearable SoC (Thursday Jun. 28, 2018)
  CEVA today announced that BlueX Microelectronics (Hefei) Co., Ltd. (BlueX) has licensed and deployed CEVA's RivieraWaves Bluetooth low energy technology in its new BX2400 Bluetooth® 5 compliant wireless integrated circuit (IC).
  
  
• Rambus Renews License With IBM (Wednesday Jun. 27, 2018)
  Rambus today announced it has renewed a patent license agreement with IBM. The five-year agreement authorizes IBM to integrate Rambus memory controller and interface technologies.
  
  
• Arteris IP Achieves Major Milestone: 100th Customer (Wednesday Jun. 27, 2018)
  Arteris IP today announced that 100 customers have adopted its on-chip communication technologies in a wide variety of system-on-chip (SoC) designs for automotive, consumer electronics, artificial intelligence (AI) and server markets.
  
  
• Arbe Robotics Selects Synopsys' IP to Enable its High-Resolution Imaging Radar to Achieve the Highest Automotive Safety Level for Autonomous Vehicles (Tuesday Jun. 26, 2018)
  Synopsys today announced that Arbe Robotics selected Synopsys' DesignWare® ARC® EM Safety Island, EV6x Embedded Vision Processor with Safety Enhancement Package (SEP), Ethernet Quality-of-Service (QoS) Controller IP, STAR Memory System®, STAR Hierarchical System and STAR ECC Compiler for its new 4D high-resolution imaging radar system-on-chip (SoC).
  
  
• Silicon Creations' SerDes Technology Helps Power Leading-Edge 8K TV (Tuesday Jun. 26, 2018)
  Silicon Creations announced today that its SerDes (Serializer/Deserializer) receive and transmit PMA (Physical Media Attachment) technology has been deployed in an SoC that powers a leading 8K (UHD) flat-panel television.