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Deals / Success Stories News

• Sencore adopts intoPIX JPEG2000 Ultra Low Latency technology (Thursday Sep. 14, 2017)
  intoPIX, a leading provider of innovative compression technology, today announces that Sencore has adopted intoPIX JPEG2000 Ultra Low Latency technology for their new line of SDI2X products.
  
  
• ArterisIP FlexNoC Interconnect Licensed by Renesas (Tuesday Sep. 12, 2017)
  ArterisIP, the innovative supplier of silicon-proven commercial system-on-chip (SoC) interconnect IP, today announced that Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, has licensed Arteris FlexNoC interconnect IP for use in state-of-the-art semiconductor devices.
  
  
• Nextchip License CEVA Imaging and Vision Platform for ADAS Vision System (Tuesday Sep. 12, 2017)
  CEVA today announced that Nextchip Co. Ltd., a fabless company specializing in embedded vision applications for ADAS systems, has licensed the CEVA-XM4 imaging and vision platform for its APACHE4 vision-based pre-processor targeted at real-time ADAS vision systems.
  
  
• Silicon Creations Celebrates 100th Tape-Out of Its PLL in TSMC 28nm Process Technology (Monday Sep. 11, 2017)
  Silicon Creations today announced its general-purpose fractional phase-locked loop (PLL) IP has surpassed 100 mass production tape-outs on TSMC’s 28nm process node.
  
  
• Shanghai Zhaoxin Semiconductor Co., Ltd. licenses Dolphin Integration ultra dense audio DAC for its next generation of Set Top Box (Monday Sep. 11, 2017)
  Fabless providers must offer SoC which combine high performances with cost-effectiveness. To meet these challenges, Zhaoxin has licensed from Dolphin Integration a high quality audio DAC with the smallest silicon footprint for its new generation of STB SoC at 28 nm.
  
  
• Image Matters Delivers Disruptive Innovation with PathPartner (Monday Sep. 11, 2017)
  Image Matters is proud to announce that video machine learning specialists PathPartner and member of the origami™ Ecosystem, will be integrating their high performance universal H.265/HEVC Decoder with facial detection into the origami™ B20 Module.
  
  
• Kilopass Ultra-Low Power OTP NVM Provides Storage for Northrop Grumman Advanced Silicon Processor That Prevents Counterfeit Electronic Parts Entering DoD Supply Chains (Wednesday Sep. 06, 2017)
  Kilopass Technology today announced that a tiny 0.01-mm2 advanced silicon processor, developed by Northrop Grumman, contains a patented ultra-low power Kilopass OTP NVM for encryption key storage.
  
  
• Kilopass Anti-Fuse NVM OTP IP Designed into Tire Pressure Sensor SoC Manufactured on TSMC 55LP Process Node Now Shipping in High Volume (Tuesday Aug. 29, 2017)
  The chip is being manufactured on the TSMC 55LP (low power) nm process node. Meeting the standards defined by Automotive Electronic Council AEC-Q100, the Kilopass OTP NVM provides program code storage for the TPS that is expected to increase demand as new applications beyond automotive adopt the technology.
  
  
• Shanghai Zhaoxin Semiconductor Co., Ltd. licenses Dolphin Integration ultra dense audio DAC for its next generation of Set Top Box (Monday Aug. 28, 2017)
  Fabless providers must offer SoC which combine high performances with cost-effectiveness. To meet these challenges, Zhaoxin has licensed from Dolphin Integration a high quality audio DAC with the smallest silicon footprint for its new generation of STB SoC at 28 nm.
  
  
• Cambricon employs Moortec's embedded PVT Monitoring Subsystem IP to their Artificial Intelligence (AI) and Machine Learning Chips (Thursday Aug. 24, 2017)
  Moortec, providers of complete In-Chip Monitoring PVT Subsystems today announced that Cambricon have used Moortec’s 16FFC In-Chip Monitoring Subsystem IP in their artificial intelligence (AI) and machine learning chips.
  
  
• MediaTek selects MIPS for LTE modems (Monday Aug. 21, 2017)
  Imagination Technologies (IMG.L) announces that MediaTek has adopted multi-threaded MIPS I-class CPUs for smartphone LTE modems.
  
  
• EnSilica and Solomon Systech in multi-year eSi-RISC licensing deal (Thursday Aug. 10, 2017)
  EnSilica, a leading independent provider of semiconductor solutions and IP, and Solomon Systech, a leading provider of touch and display ICs and system solutions, have entered into a multi-year licensing agreement for EnSilica’s range of highly-configurable, high-performance, and low-power eSi-RISC processor IP.
  
  
• Mie Fujitsu and SST Announce Automotive Platform Development on 40 nm Technology (Wednesday Aug. 09, 2017)
  Mie Fujitsu Semiconductor Limited (MIFS), a Japanese pure-play foundry company, and Microchip Technology Inc. (NASDAQ: MCHP), a leading provider of microcontroller, mixed-signal, analog and Flash-IP solutions, through its Silicon Storage Technology (SST) subsidiary, today announced their plans to develop an automotive platform on 40 nm technology using SuperFlash® memory technology licensed by SST
  
  
• DENSO licenses Imagination's newest MIPS CPU and PowerVR GPU to drive enhanced in-vehicle electronic processing (Wednesday Aug. 09, 2017)
  DENSO has licensed the MIPS I6500 CPU and PowerVR Series8XT GT8525 GPU from Imagination to create a test chip to exploit the capabilities of technologies such as hardware multi-threading and virtualization for automotive electronic systems including advanced driver assistance systems (ADAS) and autonomous driving.
  
  
• Epostar Chooses PLDA's PCIe Controller for their Next-Generation NVMe-based SSD Controller (Wednesday Aug. 02, 2017)
  PLDA®, the industry leader in PCI Express® interface IP solutions today announced that EpoStar®, the industry expert in NVMe applications, has created a platform combining PLDA’s PCIe XpressRICH3-AXI™ IP controller with EpoStar’s leading NVMe IP into a high-performance SSD controller designed for enterprise and client SSD applications.
  
  
• Vidatronic Contributes Expertise to AMD's Latest High-Performance Processors (Wednesday Aug. 02, 2017)
  Vidatronic, Inc., a leader in deep submicron power-management solutions and services, provided valuable power management and other analog and mixed-signal solutions to AMD for use in their latest processor products, including the award-winning AMD Ryzen and EPYC families of processors.
  
  
• VeriSilicon's Vivante Vision Processor IP Enables ADAS for Mass Market (Thursday Jul. 13, 2017)
  VeriSilicon today announced that Shenzhen Goke Semiconductor Co., Ltd (SGKS) has selected VeriSilicon Vivante GC7000UL-VX for the SGKS6802X Advanced Driver-Assistance Systems (ADAS) chip, part of SGKS’s ADAS product line used by automotive electronic components partners.
  
  
• STMicroelectronics Partners with Kilopass For One-Time Programmable Anti-Fuse NVM Memory (Tuesday Jul. 11, 2017)
  Kilopass today announced that STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, designed the Kilopass XPM IP one-time programmable (OTP), anti-fuse, NVM memory into an ADAS (Advanced Driver Assistance Systems) IC .
  
  
• Cista Design Inc. Selects Kilopass OTP NVM for Next Generation CMOS Image Sensor on SMIC Independently Developed 130nm Back Side Illumination Technology Platform (Thursday Jul. 06, 2017)
  Cista Design will include the Kilopass IP in a new CMOS Image Sensor (CIS) being fabbed on the Semiconductor Manufacturing International Corporation ("SMIC") (NYSE:SMI) (SEHK:981) independently developed 130nm back-side illumination (BSI) technology platform. Kilopass OTP IP will store trimming data for the analog and mixed signal circuits in addition to pixel mapping data for the new Cista Design CIS chip.
  
  
• AppoTech Ltd. Selects Andes Technology Corporation N968A CPU For Its Next Generation Audio Codec (Thursday Jul. 06, 2017)
  Andes N968A’s superior performance, compact code size resulting from the ability of the CPU to intermix both 32-bit and 16-bit instructions contributed to AppoTech’s choice of Andes over competitive alternatives. Also attractive to AppoTech was the N968A’s Audio extensions and data local memory feature that speeds memory accessed.
  
  
• PiSoft Partners with Rockchip and CEVA to Develop 360 Degree Panoramic Camera Solution (Wednesday Jun. 28, 2017)
  CEVA together with Pisoftware today announced that PiSoft has developed a complete 360 degree panoramic camera solution for ODMs and OEMs. The solution utilizes the Rockchip RV1108 visual processor which leverages the CEVA-XM4 imaging and vision DSP to run advanced imaging and computer vision algorithms, including real-time distortion correction and panoramic stitching.
  
  
• Sanechips (ZTE Microelectronics) Licenses CEVA-X1 IoT Processor for NB-IoT Connected Devices (Monday Jun. 26, 2017)
  CEVA, the leading licensor of signal processing IP for smarter, connected devices, today announced that Sanechips Technology Co., Ltd. (previously named ZTE Microelectronics Technology Co., Ltd.) has licensed the CEVA-X1 IoT Processor for its Narrowband-Internet of Things (NB-IoT) product, the RoseFinch7100.
  
  
• Imagination announces extension of MIPS collaboration agreement with Sequans (Wednesday Jun. 21, 2017)
  Imagination Technologies (IMG.L) announced it has extended its agreement with Sequans Communications S.A. (NYSE: SQNS) for MIPS processor IP. Sequans has chosen MIPS CPUs to be at the heart of some of its LTE chip platforms that power a growing number of products shipping around the world including tablets, mobile routers, CPEs and more.
  
  
• CEVA Computer Vision DSP Powers Evomotion ROD-1 360° Video Camera (Wednesday Jun. 21, 2017)
  CEVA and Evomotion Technology today announced that the companies have collaborated to enable advanced imaging and computer vision features for Evomotion's ROD-1/360°/720° dual-lens spherical camera.
  
  
• Andes Technology Provides System Control Processor IP for Wave Computing's Revolutionary Dataflow Processing Unit Design (Tuesday Jun. 20, 2017)
  Andes Technology today announced that Wave Computing's revolutionary Dataflow Processor Unit (DPU) chip leverages Andes system control processor IP in its current generation design.
  
  
• Shanghai Frequen Licenses and Deploys CEVA Bluetooth Low Energy IP in New IoT Product Line (Monday Jun. 19, 2017)
  CEVA today announced that Shanghai Frequen Microelectronics Co., Ltd. (Freqchip) has licensed and deployed CEVA's RivieraWaves Bluetooth low energy technology in its new FR801x family of wireless integrated circuits (ICs).
  
  
• VeriSilicon's Artificial Intelligence Engine Powers Multi-Sensory Experiences in NXP's i.MX 8 Flagship Applications Processor (Wednesday Jun. 07, 2017)
  VeriSilicon Holdings Co., Ltd. (VeriSilicon) today announced that NXP Semiconductors N.V. (NASDAQ:NXPI) has selected its Vivante GC7000XS/VX Vision GPUs for use withNXP’s latest flagship i.MX 8 applications processor.
  
  
• Harvard Researchers Select Flex Logix's Embedded FPGA Technology To Design Deep Learning SoCs (Monday Jun. 05, 2017)
  Flex Logix™ Technologies, Inc., announced today that its embedded FPGA will be integrated into a next-generation deep learning chip in TSMC 16FFC that is being developed by the research group of Professors David Brooks and Gu-Yeon Wei at Harvard’s John A. Paulson School of Engineering and Applied Sciences.
  
  
• Altair Semiconductor Employs Sonics' NoC to Integrate Baseband IC of ALT1250 IoT LTE Chipset (Wednesday May. 31, 2017)
  today announced that Altair Semiconductor, a Sony company, used Sonics’ NoC as the integration fabric for the baseband IC of its new ALT1250, which is the most integrated LTE CAT-M1 and NB1 chipset available.
  
  
• Israel's Vayyar Imaging Licenses Sonics NoC For Use in 3D Sensor Chips (Wednesday May. 24, 2017)
  Sonics, Inc., the world’s foremost supplier of on-chip network (NoC) and power management technologies and services, today announced that Vayyar Imaging (Tel Aviv, Israel) has licensed SonicsSX® and SonicsExpress™ for use in its 3D sensor chips.