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Deals / Success Stories News

• CEVA's Bluetooth 5 Low Energy IP Powers ON Semiconductor's Ultra-Low-Power Radio SoC for IoT and Connected Health and Wellness Devices (Tuesday Feb. 28, 2017)
  CEVA today announced that ON Semiconductor has licensed and deployed the RivieraWaves Bluetooth 5 low energy technology in its new RSL10 radio System-on-Chip (SoC).
  
  
• Imagination's PowerVR graphics provide huge performance boost and power savings in MediaTek's new Helio X30 chipset (Monday Feb. 27, 2017)
  Imagination Technologies (IMG.L) announces that MediaTek Inc. selected its PowerVR Series7XT Plus GPU to achieve higher performance and lower power graphics in its new flagship – MediaTek Helio™ X30 processor.
  
  
• Sequans Integrates Think Silicon GPU Technology in New LTE for IoT System-on-Chip (Thursday Feb. 23, 2017)
  Today Think SiliconTM announced that Sequans Communications S.A., a 4G chipmaker and leading provider of single-mode LTE chipset solutions to wireless device manufacturers worldwide, has chosen NEMATM|p GPU and NEMATM|dc display controllers as a component of its newest LTE for IoT System-on-Chip (SoC), Monarch SX.
  
  
• Cobham Gaisler LEON3FT Processor Technology Launch Aboard Iridium NEXT (Thursday Feb. 23, 2017)
  Cobham Gaisler’s LEON3 fault-tolerant microprocessor Intellectual Property (IP) core was selected by Thales Alenia Space as the processor in their highly integrated proprietary EPICA-NEXT System-on-Chip (SoC) device that is used in the redundant Platform Computer (PFC) in each one of the Iridium NEXT satellites.
  
  
• Neowine selects Barco Silex public key cryptography IP as most efficient hardware block (Thursday Feb. 23, 2017)
  Barco Silex announces that Neowine, the Korean leader in security solutions for mobile communication and IoT applications, has selected Barco Silex’ IP core for public key cryptography. With an unrivaled ratio between performance and size, the BA414EP core will add asymmetric encryption to Neowine’s product line of ASICs, which are designed to secure communication and data exchanges in e.g. smartphones and IoT devices.
  
  
• Goke Licenses SonicsGN and MemMax Products for STB SoC Platform (Thursday Feb. 23, 2017)
  Sonics today announced that Goke Microelectronics, a leading Chinese provider of IP camera, STB, SSD, and IoT chips, has licensed the flagship SonicsGN® NoC along with the MemMax® memory scheduler IP. Goke will use Sonics’ IP products in development of an SoC platform targeted for STB designs.
  
  
• Anyka Microelectronics Selects Allegro DVT's Multi-format Video Encoder IP (Tuesday Feb. 21, 2017)
  Allegro DVT today announced that Anyka Microelectronics, a leading fabless IC design house in China, has licensed Allegro DVT's multi-format H.264/AVC, H.265/HEVC and JPEG encoder IP for its next-generation System-on-Chips (SoCs).
  
  
• Microsemi Collaborates with Silicon Creations to Enable Industry's Lowest Power FPGA 12.7G Transceivers With PHYs for Microsemi's PolarFire FPGAs (Thursday Feb. 16, 2017)
  Microsemi and Silicon Creations, today announced their collaboration in developing the industry's lowest power field programmable gate array (FPGA) with 12.7 Gbps transceivers, using a Serializer/Deserializer (SerDes) PHY from Silicon Creations.
  
  
• Arteris FlexNoC Interconnect IP is Licensed by Nextchip for Automotive Advanced Driver Assistance Systems (ADAS) (Tuesday Feb. 07, 2017)
  Arteris today announced that Nextchip has licensed Arteris FlexNoC interconnect IP for use in image-based automotive ADAS systems.
  
  
• Crestron Leverages intoPIX Ultra-Low Latency JPEG 2000 Technology in New DigitalMedia NVX Series (Tuesday Feb. 07, 2017)
  Crestron announced that it is leveraging intoPIX ultra-low latency JPEG 2000 technology in its next generation DigitalMedia™ NVX Series architecture, a revolutionary network based AV distribution system.
  
  
• SonicsGN Provides Integration Fabric for Nexell NXP5540 Application Processor (Tuesday Feb. 07, 2017)
  Sonics today announced that Nexell has implemented the flagship SonicsGN® NoC as the integration fabric in its recently introduced NXP5540 application processor.
  
  
• StarChip's Secure IC for Bank Cards Enabled by SST's SuperFlash Technology (Monday Feb. 06, 2017)
  Microchip Technology, through its Silicon Storage Technology (SST) subsidiary, today announced their embedded SuperFlash® technology is enabling secure bank cards through a secure integrated circuit (IC) from StarChip®, a subsidiary of SAFRAN Security & Identity
  
  
• Rambus Selects Synopsys' ARC EM Processors for Embedded Security Platform (Thursday Feb. 02, 2017)
  Synopsys today announced that Rambus selected Synopsys' silicon-proven DesignWare® ARC® EM Processors for its next-generation security platform. Rambus selected Synopsys' ARC EM processors over alternative processor solutions for their extremely small area, superior performance-efficiency and excellent code density.
  
  
• WiLAN Subsidiary Enters into Agreement with Microsemi (Wednesday Feb. 01, 2017)
  WiLAN today announced that the Company's subsidiary, PLL Technologies, Inc., has entered into a patent license agreement with Microsemi. The license covers phase locked loop technology used in a wide range of semiconductor products.
  
  
• Starblaze Achieves First-Pass Silicon Success for Storage SoC with Synopsys ARC Processor and Interface IP (Thursday Jan. 26, 2017)
  Synopsys, Inc. (Nasdaq: SNPS) today announced that Starblaze has achieved first-pass silicon success for its new MB1000 enterprise SSD controller using Synopsys' DesignWare® ARC® HS38 processor as well as DDR4 and PCI Express® controller and PHY IP.
  
  
• Flex Logix Works With DARPA To Develop Flex Logix's Embedded FPGA IP For Government Projects (Monday Jan. 23, 2017)
  DARPA, the Defense Advanced Research Projects Agency, announced today that it has signed an agreement to work with Flex Logix to develop Flex Logix's EFLX embedded FPGA technology for use by any company or government agency designing integrated circuits for the US Government.
  
  
• Arteris announces 9 new licensees, multiple interconnect IP product releases and profitable operation in 2016 (Tuesday Jan. 17, 2017)
  Arteris today announced that it has added nine new licensees of Arteris interconnect IP for use in a variety of SoC applications. New Arteris customers added during 2016 include Kyocera, Movidius (acquired by Intel), Dream Chip Technologies, Istuary Innovation Group, Octasic, and four as-of-yet undisclosed customers. Arteris added nine new licensees in both 2014 and 2015.
  
  
• Rambus Signs Patent License Agreement with Winbond (Tuesday Jan. 17, 2017)
  Rambus today announced it has signed a broad five-year patent license agreement with Winbond Electronics Corporation, a worldwide leading supplier of specialty memory. This agreement covers the use of Rambus patented memory solutions, including server DIMM chipsets, for Winbond products through 2021.
  
  
• Hundreds of Xilinx Space Grade FPGAs Deployed in Launch of Iridium NEXT Satellites (Tuesday Jan. 17, 2017)
  Xilinx announced today that hundreds of its Space Grade FPGAs were deployed in the launch of the Iridium NEXT satellites. Space Grade Virtex®-5QV devices provide scalability and flexibility for new applications and innovations throughout its operational life in space.
  
  
• Mediatek Licenses Sonics' NoC and Memory Scheduler IP (Wednesday Jan. 11, 2017)
  Sonics today announced that MediaTek Inc., a market leader in developing innovative systems-on-chip (SoC) for mobile device, home entertainment, connectivity and IoT products, has licensed multiple copies of SonicsSX® NoC and the MemMax® memory scheduler IP.
  
  
• China Company Receives Working First Silicon for SingMai's Analogue Video Decoder (Wednesday Jan. 11, 2017)
  A Chinese integrated circuit design company, who provide professional chip solutions for intelligent cellphone, tablet computer, phablet, TV box, on-board navigation and IoT, has received first-time working silicon of SingMai’s PT5 broadcast quality analogue video decoder.
  
  
• Fortemedia Licenses Tensilica Fusion F1 DSP for Use in Always-On Smart Microphone Processor (Monday Jan. 09, 2017)
  Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced that Fortemedia, Inc. has licensed the Cadence® Tensilica® Fusion F1 DSP as the engine of their next-generation smart microphone processor to support always-on voice trigger and sensor fusion capabilities for voice wake-up in mobile, internet of things (IoT) and consumer applications.
  
  
• Imagination collaborates with Socionext on advanced video and display technologies (Thursday Jan. 05, 2017)
  Imagination Technologies (IMG.L) announces it is collaborating with Socionext Inc., a leader in advanced system-on-chip (SoC) technology for video and imaging systems, on new video and display technologies for multimedia applications. Socionext is leveraging PowerVR video IP cores in select advanced SoCs that can benefit from the efficiency, performance and advanced features they provide.
  
  
• MIPS I6500 CPU sub-system with NetSpeed's Gemini IP provides highly efficient processing for vision applications (Thursday Jan. 05, 2017)
  Imagination Technologies (IMG.L) and NetSpeed Systems Inc. announce that Mobileye, the global leader in camera-based Advanced Driver Assistance Systems (ADAS), has licensed Imagination’s MIPS Warrior I-class I6500 CPU in a coherent, heterogeneous sub-system incorporating NetSpeed’s Gemini cache coherent interconnect IP.
  
  
• AndesCore Ultra Low-Power, High Performance N705 CPU Core Wins Design Socket In Sino Wealth Electronic's New Bluetooth Low Energy Chip Design (Thursday Jan. 05, 2017)
  Andes Technology Corporation, the leading Asia-based supplier of small, low-power, high performance 32-bit embedded CPU cores, today announced that Sino Wealth Electronic, a Shanghai Informatization Office (SIO) top hi-tech enterprise for 11 years, has designed the AndesCore N705 CPU into their low energy Bluetooth chip.
  
  
• Altek License CEVA Imaging and Vision DSP for Deep Learning in Mobile Devices (Thursday Jan. 05, 2017)
  CEVA, today announced that Altek Corporation, a leading Taiwanese imaging systems provider, has licensed CEVA's imaging and vision DSP to add power-efficient, enhanced imaging and deep learning capabilities to its imaging solutions and dual camera technologies targeting smartphones, ADAS, AR/VR, drones and other smart camera devices.
  
  
• ON Semiconductor License CEVA Imaging and Vision Platform for Automotive ADAS (Wednesday Jan. 04, 2017)
  CEVA today announced that ON Semiconductor has licensed CEVA's imaging and vision platform for its automotive advanced driver assistance (ADAS) product lines.
  
  
• SingMai's aCVi decoder successfully tapes out in China (Wednesday Jan. 04, 2017)
  A major Chinese IP/IC fabless design company has successfully taped out the SingMai PT51 aCVi video decoder.
  
  
• Shenzhen Micro & Nano Institute License CEVA Audio/Voice DSP for 8 Microphone Far-Field Voice Pickup Applications (Tuesday Jan. 03, 2017)
  CEVA today announced that Shenzhen Micro & Nano Institute (MNI) has licensed the CEVA audio/voice DSP for the development of a multi-mic voice processor targeting a range of intelligent hardware systems including robots, smart appliances and the smart home.
  
  
• ASolid Adopts AndesCore N9 for its AS2726 eMMC Controller to Deliver Competitive Market Advantage (Friday Dec. 30, 2016)
  Andes Technology announced that ASolid Technology Co., Ltd., the leading NAND flash controller provider based in Hsinchu, Taiwan, has adopted the AndesCore™ N9 for its AS2726 eMMC chip.