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Deals / Success Stories News
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S3 Group licenses custom ADC and DAC Solution to Avalent Technologies' SoC Platforms (Tuesday May. 07, 2013)
S3 Group today announced that it has licensed a custom ADC and DAC solution to Avalent Technologies for the development of their latest SoC.
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STMicroelectronics and Quantenna Enter Strategic Licensing Agreement (Tuesday May. 07, 2013)
STMicroelectronics and Quantenna announced today that they have signed a non-exclusive worldwide licensing agreement giving ST the ability to integrate Quantenna IP into its broad array of systems-on-chips and giving Quantenna the ability to leverage the entire ecosystem of ST’s entertainment, networking and security products.
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NASA Selects Ridgetop Group to Develop an Innovative Modular SiGe 130 nm Cell Library (Thursday Apr. 25, 2013)
Ridgetop announced that it has been selected to receive a Small Business Innovation Research (SBIR) Phase 1 contract from NASA. Ridgetop will create a cell library of key “building block” analog cells needed to accelerate the development, improve the reliability, and reduce the cost of a wide range of integrated circuits (ICs) essential for space missions and other demanding applications that must tolerate harsh environments.
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DMP 3D Graphics IP Core "SMAPH-S" is selected by Renesas Electronics (Tuesday Apr. 23, 2013)
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Leadcore Technology License CEVA DSP Technologies for Mobile Devices (Wednesday Apr. 17, 2013)
CEVA today announced that Leadcore Technology Co., Ltd. one of the core members of Datang Telecom Technology and Industry Group, has licensed CEVA DSP technologies and platforms for their next-generation mobile devices.
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Leadcore Adopts Hantro Video IP (Tuesday Apr. 16, 2013)
VeriSilicon announced today that the Hantro G1 Multi-format Decoder and Hantro H1 Multi-format Encoder have been adopted by Leadcore, a leading TD-SCDMA and TDD-LTE telecom technology and solution company in China
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Rockchip Leverages Arteris FlexNoC Interconnect IP for Next Generation SoCs (Tuesday Apr. 16, 2013)
Arteris today announced that Rockchip has again selected Arteris® FlexNoC® interconnect IP as the backbone SoC interconnect for its new SoC platforms.
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Fujitsu Semiconductor ASIC Design for 2G/3G/4G Baseband Processor in Volume Production with Synopsys 28-nm MIPI M-PHY (Tuesday Apr. 09, 2013)
Synopsys today announced that Fujitsu Semiconductor Limited is successfully shipping a 2G/3G/4G baseband processor using Synopsys' DesignWare DigRFv4 M-PHY and DigRF 3G PHY IP.
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Barco Silex FPGA design speeds transactions in award-winning Atos Worldline Hardware Security Module (HSM) (Monday Apr. 08, 2013)
Barco Silex today announced that Atos Worldline uses a Barco Silex FPGA crypto platform in its ADYTON. The ADYTON integrates Barco Silex’s IP to achieve RSA and ECC performance levels of over 7000 op/s in RSA CRT and FIPS 140-2 Security level 4 certification.
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Microsemi Integrates Inicore Enhanced Reliability CAN IP into SmartFusion2 SoC FPGA (Monday Mar. 25, 2013)
Inicore Inc. announced today that its CAN controller IP core CANmodule-IIIx has been incorporated into Microsemi Corporation’s recently released SmartFusion®2 SoC FPGAs.
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MIPS multi-threaded CPUs from Imagination push performance to new levels for Altair's new LTE chipsets (Thursday Mar. 21, 2013)
Imagination Technologies announces that two new baseband processors from Altair Semiconductor, a leading developer of high performance, single-mode LTE chipsets, are powered by MIPS CPU cores from Imagination.
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Beken License CEVA Bluetooth 2.1+EDR and 4.0 IP for Low Power Bluetooth Product Families (Tuesday Mar. 19, 2013)
CEVA today announced that Beken has licensed CEVA's Bluetooth 2.1+EDR and Bluetooth 4.0 Low Energy IP solutions for the development of Bluetooth-enabled ICs.
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CAST's 200th 8051 IP Core License Goes to Ensphere Solutions (Tuesday Mar. 12, 2013)
CAST, Inc. marked its sixteenth year providing 8051-compatible IP cores by announcing its 200th 8051 license. Customer Ensphere Solutions has a reputation for advanced optical and copper communications chips and will use the 8051 microcontroller in an upcoming high-performance computing (HPC) interconnect IC.
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Freescale and ARM Extend Relationship with Cortex-A50 Processor License for Future i.MX and QorIQ Products (Wednesday Feb. 27, 2013)
Freescale Semiconductor is licensing the ARM® Cortex™-A50 series of microprocessors (MPUs) for future versions of its i.MX applications processor and QorIQ communications processor product lines.
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Cryptography Research Signs License Agreement with EchoStar for CryptoFirewall Security Technology to Combat Piracy (Wednesday Feb. 27, 2013)
Cryptography Research today announced a license agreement with EchoStar Technologies to adopt the Cryptography Research CryptoFirewall™ security core for use with EchoStar set-top box technologies to protect against TV signal theft.
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Nextchip selects Cortus APS5 for Automotive and Security Applications (Tuesday Feb. 26, 2013)
Cortus announce that Nextchip has licensed APS5 and other Cortus processor cores. The cores are intended for use in security and automotive applications.
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Socle Technology Now Offers Arteris FlexNoC Platform (Tuesday Feb. 26, 2013)
Arteris today announced that Socle Technology has licensed the Arteris® FlexNoC® interconnect IP for its internal technology platforms and will provide design and implementation services for high-end SoC design customers.
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Marvell Selects Cryptography Research's CryptoFirewall Anti-Counterfeiting Technology for Use in Consumable Security Chip (Monday Feb. 25, 2013)
Cryptography Research (CRI), a division of Rambus, today announced that Marvell has chosen its anti-counterfeiting technology, the CryptoFirewall™ core, for inclusion in the Marvell PA800 Consumable Security chip.
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Global Businesses Select ARM Mali GPU Technology (Monday Feb. 25, 2013)
ARM’s Mali™ GPU Partners report a significant increase in shipments – rising to more than 150 million processors in 2012 – and licenses grow by 30% due to superior graphics performance
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DSP Group License CEVA Audio DSP for HDClear Voice Enhancement Solution (Monday Feb. 25, 2013)
DSP Group's HDClear™ solution leverages high-performance, low-power CEVA-TeakLite-III DSP to deliver a revolutionary noise cancellation technology for mobile devices.
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Silicon Image MHL Technology Featured on New MediaTek Quad-Core Mobile Computing Reference Platform (Monday Feb. 25, 2013)
Silicon Image today announced the availability of a reference design based on MediaTek's Quad-Core MT6589 smartphone platform and Silicon Image's SiI8338 MHL® transmitter with Media Data Tunneling (MDT) technology.
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Tensilica and Huawei Expand Strategic Relationship for Next-Generation Products (Monday Feb. 25, 2013)
HiSilicon, the semiconductor division of Huawei, is expanding its use of Tensilica’s DPUs, including Tensilica’s Xtensa customizable processor technology, HiFi DSPs for audio and voice processing in smartphones and set-top boxes, and ConnX Baseband Engines for LTE base stations, handsets, and other network infrastructure and customer premise equipment.
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MIPS processor cores power Ceragon Networks' next generation multi-core packet radio (Monday Feb. 25, 2013)
Imagination Technologies announces that Ceragon Networks Ltd is leveraging MIPS® microprocessor cores in its latest generation of packet radio solutions.
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CSR Licenses aptX Low Latency Codec to Mad Catz for New Family of Bluetooth Wireless Gaming Headsets (Monday Feb. 25, 2013)
CSR today announced that Mad Catz Interactive has signed a multi-year licensing agreement to use the CSR aptX® Low Latency audio codec, expected to feature in a new family of ‘GameSmart’ headsets that Mad Catz plans to introduce in the coming months.
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HIMA Licenses ColdFire V4 Technology from IPextreme (Thursday Feb. 21, 2013)
IPextreme, Inc. today announced HIMA Paul Hildebrandt GmbH + Co KG has licensed the advanced Freescale Semiconductor ColdFire V4 subsystem for use in its next generation safety automation platform. The CFV4SPPC2 subsystem includes the ColdFire V4 Core and a number of pre-integrated peripherals including various standard I/O functions and dual Ethernet controllers.
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SimpLight Achieves First LTE Modem Silicon Success Using Tensilica's Complete ATLAS Reference Platform (Thursday Feb. 21, 2013)
Tensilica, Inc. today announced that SimpLight Nanoelectronics, Ltd. of China, has achieved first silicon success for their LTE modem chip SL3000 for low-power handsets and tablets. SimpLight used Tensilica’s ATLAS reference platform, which implements a complete, fully programmable modem subsystem for the LTE Layer 1 PHY.
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Rambus and LSI Corporation Sign Patent License Agreement (Wednesday Feb. 20, 2013)
Rambus announced today it has signed a patent license agreement with LSI Corporation. This agreement allows LSI Corporation to include Rambus patented innovations in all its products.
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CEVA and Mindspeed Extend Relationship to Address LTE-Advanced Small Cells (Tuesday Feb. 19, 2013)
CEVA and Mindspeed today announced an extension to their strategic relationship with a Mindspeed license for the CEVA-XC4000 DSP for use in their next-generation LTE-Advanced multi-mode small cell Transcede® SoCs.
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Creonic Announces WiGig (802.11ad) LDPC Decoder IP and Closes License Deal with Blu Wireless Technology (Monday Feb. 18, 2013)
Creonic today announced that it closed a license deal with Blu Wireless Technology Ltd. Creonic has licensed its new forward error correction LDPC decoder IP core designed to address the WiGig 60 GHz standard (IEEE 802.11ad) to Blu Wireless Technology - a System IP company developing configurable, low power and cost 60 GHz technology for the WiGig and Wireless Backhaul markets.
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Elliptic Technologies Secure HDCP 2.2 Content Protection Solutions Selected by ST-Ericsson For Miracast Wi-Fi Display Applications (Thursday Feb. 14, 2013)
Elliptic Technologies today announced that ST-Ericsson has selected the Elliptic hardware-assisted tVault™ HDCP solution to support the Wi-Fi (WFD) Miracast™ wireless technology on the NovaThor™ L8540 platform for smartphones and tablets.








