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• Rockchip Licenses a Wide Range of ARM IP for Turnkey Solution Targeting Mass Market, Cost-Effective Android Tablets (Monday Feb. 27, 2012)
  Rockchip today announced its next generation RK30xx platform, targeting the mass market, cost-effective Android tablets. The new platform is based on wide range of ARM(R) Intellectual Property (IP) that Rockchip has licensed, including dual-core ARM Cortex(TM)-A9 MPCore(TM) processors, ARM quad-core Mali(TM)-400 MP Graphics Processing Units (GPUs) and an ARM Artisan(R) Physical IP Process Optimization Pack (POP) for the Cortex-A9 processor.
  
  
• Spreadtrum Licenses CEVA-XC DSP for LTE Baseband (Monday Feb. 27, 2012)
  CEVA announced today that Spreadtrum Communications has licensed the CEVA-XC DSP processor for its LTE baseband processor designs.
  
  
• Tensilica Baseband DSPs and Dataplane Processors (DPUs) Power LTE/HSPA/3G Multimode Modem IC from NTT DOCOMO, Fujitsu, NEC, and Panasonic Consortium (Monday Feb. 27, 2012)
  Tensilica®, Inc. today announced that the second-generation multi-mode LTE/HSPA/3G (Long Term Evolution) baseband chip design announced last week by NTT DOCOMO features multiple Tensilica dataplane processors (DPUs), including the HiFi Audio DSP (digital signal processor) and the ConnX BBE16 Baseband DSP.
  
  
• MediaTek and ARM Extend Relationship with Access Agreement for a Broad Range of the Latest ARM IP (Thursday Feb. 23, 2012)
  ARM and MediaTek Inc. today announced an extension to their long-standing relationship with a new MediaTek license for a broad range of market leading, high-performance ARM Intellectual Property (IP).
  
  
• Sidense 1T-OTP Helps Calibrate Aptina's Advanced Imaging Products (Tuesday Feb. 21, 2012)
  Sidense announced that Aptina is using Sidense's field-programmable 1T-OTP memory macros for several image sensor and camera module products.
  
  
• Cyclos Semiconductor Announces First Commercial Implementation of Resonant Clock Mesh Technology (Tuesday Feb. 21, 2012)
  Cyclos Semiconductor today announced that AMD has successfully implemented Cyclos’ low-power semiconductor intellectual property (IP) in the AMD x86 core destined for inclusion in Opteron server processors and client Accelerated Processing Units (APUs).
  
  
• VIA Chooses Tensilica for Solid State Drive (SSD) Chip Design (Wednesday Feb. 15, 2012)
  Tensilica, Inc. today announced that VIA has selected Tensilica's Xtensa dataplane processors (DPUs) for a system-on-chip (SOC) design for solid state drives (SSDs).
  
  
• VeriSilicon Licenses ZSP G3 Cores to Marvell (Monday Feb. 13, 2012)
  VeriSilicon announced a licensing agreement for ZSP G3 cores with Marvell . The agreement includes the Dual-MAC ZSP800M and ZSP880M synthesizable DSP cores which are area and power optimized for efficient mobile application and digital entertainment platform solutions.
  
  
• Icom License CEVA DSP for Wireless Baseband Applications (Monday Feb. 13, 2012)
  CEVA today announced that Icom, Inc. has licensed CEVA DSP core technology to power its digital wireless communication products.
  
  
• Chips&Media Partners with Solomon Systech to Build Leadership Position in Projector Market (Thursday Feb. 09, 2012)
  Solomon Systech ramps up MagusCore™ SSD1938 multimedia processor based on Chips&Media’s multi-standards HD video processing engine, CODA7 Series.
  
  
• Rambus and NVIDIA Sign Patent License Agreement (Wednesday Feb. 08, 2012)
  Rambus announced today it has signed a patent license agreement with NVIDIA. The agreement covers the use of Rambus patented innovations in a broad range of IC products offered by NVIDIA.
  
  
• Ingenic Licenses Arteris Chip-to-Chip (C2C) IP Solution for Mobile Application Processors (Tuesday Feb. 07, 2012)
  Arteris today announced that Ingenic Semiconductor has selected Arteris' Chip-to-Chip (C2C) interconnect solutions for Ingenic's mobile phone and tablet application processor systems-on-chip (SoCs).
  
  
• Ultra High-Performance MIPS64 Architecture Powers Cavium's New Multi-Core Processors (Tuesday Feb. 07, 2012)
  MIPS Technologies announced that its MIPS64® architecture is powering the new 28nm OCTEON® III MIPS64 family of multicore processors from Cavium.
  
  
• Zaltys ISDB-T Demodulator Core brings Digital Broadcast BER Testing Capability to Anritsu Spectrum Master and Cell Master Handheld Analyzers (Tuesday Feb. 07, 2012)
  The Zaltys™ 3-Layer ISDB-T High Performance Demodulator core from Silicon Infusion has been used by Anritsu to enhance its latest digital broadcast analyser products
  
  
• Sequans Communications Selects S3 Group's Power Management Solution for WiMAX / LTE System on Chip (Monday Feb. 06, 2012)
  S3 Group today announced that 4G chipmaker Sequans Communications S.A. has licensed its Power Management IP. S3 Group designed a customized Power Management Solution for its client using IP from its extensive portfolio.
  
  
• INSIDE Secure chosen by leading Smartphone manufacturer To Power NFC Services with a major open operating system platform (Monday Feb. 06, 2012)
  INSIDE Secure today revealed that it is integrating its near field communications (NFC) solutions into a next-generation smartphone from a leading mobile phone manufacturer scheduled to be introduced by mid-year. The new smartphone will run on one of the most widely used mobile operating systems under license, and will utilize the INSIDE MicroRead® NFC controller chip and INSIDE Open NFC™ protocol stack software to deliver a rich set of NFC capabilities to support a broad range of NFC applications.
  
  
• MStar Licenses ARM Mali GPU Technology for Smart-TV Applications (Monday Jan. 30, 2012)
  ARM today announced that MStar has licensed ARM Mali Graphics Processing Unit (GPU) technology for use in smart-TV applications.
  
  
• Shanghai HDIC Picks Tensilica's HiFi Audio DSP For Digital Television System-on-Chip (Tuesday Jan. 24, 2012)
  Tensilica, Inc. today announced that Shanghai High Definition Digital Technology Industrial Corporation (HDIC) has selected Tensilica's HiFi Audio DSP for its audio requirements for a digital television (DTV) SOC (system-on-chip) for the Chinese DTV market.
  
  
• Silicon Harmony licenses PLL from Cosmic Circuits (Monday Jan. 16, 2012)
  Cosmic Circuits today announced that Silicon Harmony, a leading supplier of ASIC solutions & services for the Korean market has licensed a clocking solution from Cosmic Circuits in 65nm technology.
  
  
• Tensilica's ConnX Baseband Engine DSP Core Successfully Deployed by NXP Semiconductors (Monday Jan. 16, 2012)
  Tensilica today announced that NXP Semiconductors was the lead partner for Tensilica's first ConnX Baseband Engine (BBE), announced on June 22, 2009.
  
  
• Beijing Nufront Selects Arteris FlexNoC Interconnect IP and C2C for Mobile Phone Systems on Chip (SoC) (Wednesday Jan. 11, 2012)
  Arteris today announced that its FlexNoC(R) interconnect IP has been licensed by Beijing Nufront, one of China's fastest growing and most innovative systems and silicon providers.
  
  
• Vivante GPU Powers Leading Smart TV Platforms (Wednesday Jan. 11, 2012)
  Vivante Corporation announced that it has been selected to power the Marvell® ARMADA® 1500 Media SoC. The Vivante GC Cores inside the ARMADA 1500 perform complex visual processing using the latest 3D graphics APIs and GUI composition interfaces.
  
  
• Kawasaki Microelectronics Licenses CAST 8051 IP Core for New Design Platform (Wednesday Jan. 11, 2012)
  Kawasaki Microelectronics, Inc. (K-micro) in Japan has selected an 8051-compatible microcontroller core from CAST, Inc. for its new digital and mixed-signal control platform.
  
  
• Cryptography Research and CPU Tech Sign Patent License Agreement for DPA Countermeasures (Monday Jan. 09, 2012)
  Cryptography Research and CPU Tech today announced they have signed a patent license agreement regarding the use of CRI's patented innovations in CPU Tech products.
  
  
• SENSIO licenses its SENSIO Hi-Fi 3D decoding technology for 3DTV chips (Monday Jan. 09, 2012)
  SENSIO today announced that it has signed a licence agreement for the integration of SENSIO® Hi-Fi 3D into SoCs destined for 3DTVs with an important semiconductor manufacturer, that asked to remain anonymous for competitive reasons.
  
  
• Enverv uses Cosmic Circuits ultra low-jitter PLL (Monday Jan. 09, 2012)
  Cosmic Circuits today announced that its PLL solutions are being used by Enverv, a provider of advanced SoC solutions for smart grid, metering and control applications.
  
  
• Invensas Purchases 73 MoSys Patents (Friday Dec. 30, 2011)
  MoSys and Invensas, a wholly owned subsidiary of Tessera, announced today that they entered into a patent purchase agreement. Under the agreement, Invensas purchased 43 United States and 30 foreign memory technology patents from MoSys for $35 million in cash.
  
  
• Rambus and Broadcom Sign Patent License Agreement (Friday Dec. 23, 2011)
  Rambus announced today it has signed a patent license agreement with Broadcom. This agreement covers the use of Rambus patented innovations in a broad range of integrated circuit (IC) products offered by Broadcom. In addition, the two companies have settled all outstanding claims, including resolution of past use of Rambus' patented innovations.
  
  
• SP Devices announces latest collaboration with LeCroy (Monday Dec. 19, 2011)
  SP Devices today announced its next collaboration with LeCroy Corporation.
  
  
• Qualcomm becomes Imagination Technologies licensee (Thursday Dec. 15, 2011)
  Qualcomm Inc. has become a new Imagination Technologies licensee, along with MStar, Ricoh and Rockchip, joining existing partners like Sony, Intel, Mediatek, Renesas, Samsung, Sigma and Realtek.