D&R Headline News | Most Popular | SoC News Alerts | |

Deals / Success Stories News

• Open-Silicon Integrates 50 DesignWare Interface and Analog IP Products with 100 Percent Silicon Success (Wednesday Jul. 07, 2010)
  Synopsys today announced that Open-Silicon has licensed and integrated 50 high-speed DesignWare® IP products into customers' chips with 100 percent first-pass silicon success.
  
  
• Faraday Selects Alvand Technologies AFE (Analog Front End) IP to Support Next Generation Wireless Applications (Tuesday Jul. 06, 2010)
  Faraday today announced that it has selected the Analog Front End (AFE) IP in UMC 65nm from Alvand Technologies. The selected AFE IP offers the industry's lowest power consumption and smallest die size, ideally suited for most advanced silicon devices for LTE, CDMA, WIMAX, and 802.11 communication systems.
  
  
• Global Unichip selects TranSwitch for Next-Generation HDMI supporting full-rate 3-D High Definition Television (Tuesday Jun. 29, 2010)
  TranSwitch today announced that Global Unichip adopted TranSwitch’s HD-PXL™-1.4 IP cores supporting the latest HDMI 1.4 specifications.
  
  
• InterDigital Expands Inventec Appliances Corporation Patent License Agreement to Include Inventec Appliances (Jiangning) Corporation (Wednesday Jun. 23, 2010)
  InterDigital today announced that its patent holding subsidiaries have expanded their worldwide, non-transferable, non-exclusive, royalty-bearing patent license agreement with Inventec Appliances Corp. ("IAC") to include IAC's Chinese subsidiary, Inventec Appliances (Jiangning) Corporation.
  
  
• eSilicon Announces Operations Strategy Engagements (Thursday Jun. 17, 2010)
  eSilicon today announced that it will provide turn-key semiconductor production operations and logistics services to Ember and Pixim.
  
  
• Sharp and WiLAN Enter Wireless License Agreement (Thursday Jun. 17, 2010)
  Wi-LAN today announced that Sharp and WiLAN have signed a license agreement related to certain of its wireless patents. The six year agreement covers a range of wireless products sold by Sharp including Wi-Fi-enabled notebooks and handsets.
  
  
• Syabas Chooses Tuxera NTFS for Media Players (Wednesday Jun. 16, 2010)
  Tuxera today announced that Syabas Technology has licensed Tuxera NTFS to bring seamless interoperability to its cutting-edge media players.
  
  
• StarChip announces the successful tape-out of its 32bit-Secure Chip SIM platform based on Cortus APS3 processor (Friday Jun. 11, 2010)
  StarChip announces the tape-out of its 32bit-Secure chip SIM platform. This new technology includes Flash secure 32-bit SIM architecture based on Cortus APS3S core and providing high-level endurance management, fast personalization mode and fully secure lifecycle handling.
  
  
• Denali Software DDR SDRAM Controller IP and PHY Solution Integrated into STMicroelectronics' SPEAr Family of Microprocessors (Wednesday Jun. 09, 2010)
  Denali Software today announced that STMicroelectronics has integrated Denali’s configurable Databahn® DDR3/DDR2 SDRAM multiport memory controller IP and DFI-compliant Synthesizable GHz PHY IP as a baseline solution for the Structured Processor Enhanced Architecture (SPEAr®) embedded microprocessor platform.
  
  
• Hynix Licenses Apical's Imaging Cores for its Next Image Sensor Products (Tuesday Jun. 08, 2010)
  Apical Ltd and Hynix Semiconductor Inc have entered into a licensing agreement for the use of Apical's iridix and sinter image processing IP cores in future Hynix image sensor products.
  
  
• CEVA Partners with Infineon Technologies for Next-Generation Wireless Platforms (Monday Jun. 07, 2010)
  CEVA and Infineon Technologies today announced the Companies have extended their long-term strategic relationship to include the dual MAC, 32-bit CEVA-TeakLite-III DSP core for the future mobile phone and modem platform solutions from Infineon.
  
  
• Laird Technologies licenses apt-X for Bluetooth Stereo wireless audio modules (Monday Jun. 07, 2010)
  APTX today announces that Laird Technologies has licensed apt-X® audio codec technology for use in a new family of high-volume Bluetooth stereo audio multi-chip modules intended for OEM integration into automotive, commercial, and consumer applications.
  
  
• SiS Selects MIPS(R) Processor IP for SoCs Targeting Mobile Internet Devices With Android(TM) Platform (Tuesday Jun. 01, 2010)
  MIPS Technologies announced today that Taiwan's Silicon Integrated Systems Corp. (SiS) licensed IP from MIPS for SoCs targeting a range of next-generation mobile internet device (MID) applications.
  
  
• Android Platform Continues to Gain Momentum on MIPS Architecture for the Connected Home (Tuesday Jun. 01, 2010)
  MIPS Technologies today announced that ViXS Systems Inc. will demonstrate the Android platform running on its MIPS-Based XCode® 4200 family of Integrated Chipsets
  
  
• Chips&Media' HD Video Core Demonstrated in VIA’s new multimedia chipset. (Friday May. 28, 2010)
  Chips&Media today announces that Via Technologies has adopted the BodaHx6R video engine from Chips&Media. They selected the Chips&Media’s one for their low power processor platforms , which ensure the latest Blu-ray titles decoding with VC1 and H.264 codec support and also are bolstered with MPEG-2 and WMV video decoding.
  
  
• Trident Microsystems Licenses CEVA's DSP for Set-Top Box and DTV Product Lines (Thursday May. 27, 2010)
  CEVA today announced that Trident Microsystems has licensed CEVA's DSP technology for demodulation in set-top box and television systems product lines.
  
  
• Richtek Licenses Virage Logic's AEON(R) MTP Family of NVM IP for Its Advanced Analog and Power Management Products (Tuesday May. 25, 2010)
  Virage Logic today announced that Taiwan-based Richtek Technology has taken a license for Virage Logic's AEON MTP (Multi-time Programmable) family of NVM (non-volatile memory) IP.
  
  
• Imagination Technologies licenses communications and graphics processor core to SiS (Tuesday May. 25, 2010)
  Imagination Technologies has signed a license agreement with Silicon Integrated Systems for cores from Imagination's ENSIGMA UCC and POWERVR SGX families.
  
  
• Wolfson Selects SiliconGate to Supply Power Management IP for its Next Generation of High-Performance Products (Monday May. 24, 2010)
  SILICONGATE today announced that Wolfson Microelectronics has selected SiliconGate to provide high-performance power management IP in a four year contract.
  
  
• CSR wireless audio platform chosen by LG Electronics for ultra-slim headset and new car speakerphone design (Thursday May. 20, 2010)
  CSR today announced that LG Electronics's new HBM585 ultra-thin Bluetooth mono headset and HFB320 hands-free car kit both utilise CSR's audio platform incorporating Bluetooth wireless connectivity and fifth-generation CVC noise and echo reduction.
  
  
• First Silicon Success With LPDDR2 SDRAM Controller IP For High-Performance, Low-Power SoC (Wednesday May. 19, 2010)
  Denali today announced that ST-Ericsson has leveraged Denali’s high-performance Databahn Low-Power Double Data Rate 2 (LPDDR2) Synchronous DRAM (SDRAM) controller IP along with STMicroelectronics’ DFI-compliant Physical IP (PHY) in its smartphone platform the U8500 on STMicroelectronics’ advanced low-power 45-nanometer (nm) CMOS manufacturing technology.
  
  
• Ridgetop Group's SJ BIST Solder Joint Fault Monitor to be Flight-Tested by NASA Research Center (Wednesday May. 19, 2010)
  Ridgetop Group announced that the NASA Dryden Flight Research Center in Edwards, Calif., will begin rigorous flight-testing this year of its SJ BIST™ (Solder Joint Built-In Self-Test™) technology. NASA Dryden has built a new Solder Joint Health Monitoring Testbed, incorporating Ridgetop’s technology, that it will operate in flight.
  
  
• InterDigital and Capital Semiconductor Enter into 3G Technology Transfer Agreement (Wednesday May. 19, 2010)
  CapiSemi and InterDigital Communications have entered into a strategic relationship for 3G technology transfer and a mutually beneficial licensing agreement, whereby InterDigital will deliver its SlimChip(TM) modem core for integration into CapiSemi's chips for 3G mobile devices.
  
  
• Imagination Technologies licenses high-performance multi-processor graphics processor core to Texas Instruments (Tuesday May. 18, 2010)
  Imagination Technologies has signed a multi-use license agreement with Texas Instruments for a multi-processor solution from Imagination's new POWERVR SGX Series5XT Graphics Processing Unit (GPU) IP core family.
  
  
• Rohm Licenses ARM Cortex-M0 Processor (Tuesday May. 18, 2010)
  ROHM Co., Ltd. has licensed the ultra low-power ARM® Cortex™-M0 processor in order to accelerate developing products in the growing markets such as digital appliances, automotive, energy saving, and medical healthcare applications.
  
  
• eASIC Nextreme Used for Hardware Validation of Microsoft RemoteFX Technology (Friday May. 14, 2010)
  eASIC today announced that it is working with Microsoft Corp. on using eASIC’s Nextreme NEW ASICs to create a hardware implementation of the Microsoft RemoteFXTM technology, which was announced two months ago.
  
  
• Mixel's SerDes IP Licensed by Viimagic, a Thomson Spin-Off (Thursday May. 13, 2010)
  Mixel® Inc., a leading provider of mixed-signal intellectual property (IP), announced today that Viimagic GmbH, a Thomson spin-off, has licensed Mixel’s LVDS Serializer IP.
  
  
• CAST SpeedView JPEG Encoder Core in Samsung Mobile Imaging Solutions (Thursday May. 13, 2010)
  CAST, Inc. today revealed that Samsung Semiconductor Israel R & D Center Ltd. has licensed CAST’s SpeedView JPEG Encoder Core (SVE-JPEG-E) to develop Image Signal Processor (ISP) blocks to be integrated into image sensors manufactured by Samsung Electronics Co. Ltd.
  
  
• Scanimetrics Now Offering MOSAID HLNAND Flash Memory Chip and Module (Wednesday May. 12, 2010)
  MOSAID has granted Scanimetrics a non-exclusive, royalty bearing license to develop, manufacture and market current and future versions of MOSAID HLNAND(TM) devices, alone or incorporated into Scanimetrics products. MOSAID offers a 64Gb MLC (Multi Level Cell) HLNAND MCP (Multi-Chip Package), and a 64GB HLDIMM (HyperLink Dual In-Line Memory Module).
  
  
• U.S. Air Force Awards Ridgetop Group Contract to Develop Innovative Semiconductor Foundry Qualification System (Wednesday May. 12, 2010)
  U.S. Air Force Research Laboratory (AFRL) has awarded Ridgetop Group, Inc., a leading designer of advanced tools for mission-critical complex electronic systems, a Phase II Small Business Innovation Research (SBIR) contract to develop an effective tool to assess the reliability and quality of nanotechnology semiconductor processes used for mission-critical applications.