TSMC GF Intel Low Phase Noise, High-performance Digital LC PLL
|
| |
Deals / Success Stories News
-
ARC's Patented Configurable Processor Technology Adopted by UPEK for Next-Generation Biometric Security Applications (Tuesday Sep. 06, 2005)
UPEK Licenses ARC™ 625D Configurable Processor for Use in TouchStrip Fingerprint Authentication Solutions
-
QSound Labs' microQ'TM' Technology Licensed by UTStarcom for Mobile Devices (Tuesday Sep. 06, 2005)
QSound's MicroQ Technology Provides Unique Custom Implementation for UTStarcom's Baseband Processors and Mobile Phones
-
eRide Selects NewLogic to Provide IC Design Services (Monday Aug. 29, 2005)
eRide Selects NewLogic to Provide IC Design Services
-
Aplus to Provide Low-Power, Low Voltage (1.8V) Operation EEPROM Macro Solution at UMC (Monday Aug. 29, 2005)
Aplus Flash Technology today announced that it has signed an agreement whereby it will develop EEPROM Semiconductor Intellectual Property (IP) for UMC's 0.35um EEPROM process technology
-
Agere Systems Adopts LogicVision Technology to Improve Quality and Speed Time-to-Market for Agere's Gigabit Ethernet Chips (Monday Aug. 29, 2005)
LogicVision’s Unique Performance Defect Screening Capabilities Help Provide
-
Virtutech Simics Selected for Use in Iridium Satellite Software Development and Testing (Monday Aug. 29, 2005)
By choosing Simics to develop virtual models for testing its on-orbit satellite applications, Iridium will accelerate the software development and test process
-
OKI Implements Sarnoff's Takecharge On-Chip ESD Protection In High-Voltage ICs (Friday Aug. 26, 2005)
Design Approach for On-Chip ESD Protection Successfully Implemented in High-Voltage Chips
-
Teradici Selects Rambus XDR Memory Interface (Monday Aug. 22, 2005)
Advanced XDR Memory to Enable Disruptive Enterprise and Consumer Computing Models
-
TTPCom Signs Agreement with Motorola Mobile Devices (Wednesday Aug. 17, 2005)
TPCom today announced an agreement to license the AJAR cellular applications platform to Motorola for the development of select low cost mass market mobile devices
-
Digital Fountain Signs A License Agreement To Digital Fountain's FEC Technology with Nokia (Monday Aug. 08, 2005)
The agreement will allow Nokia to incorporate Digital Fountain's advanced FEC technology in future Nokia products
-
Silicon Hive Licenses Avispa Processor to Agere Systems (Thursday Aug. 04, 2005)
Silicon Hive’s technology will be instrumental in enabling Agere to accelerate its product deliveries, offer more flexible and diverse product features, and adhere more easily and economically to changing industry standards.
-
Samsung Teams With Denali for OneNand(TM) Flash Controller IP (Wednesday Aug. 03, 2005)
Databahn(TM) OneNAND Controller IP Takes System Performance to New Heights
-
Falanx Microsystems and Zoran Deliver Advanced Graphics and 3D Gaming to Multimedia Mobile Phones (Wednesday Aug. 03, 2005)
Falanx Microsystems, Inc., the developer of complete graphics intellectual property (IP) cores for system- on-chip (SoC) semiconductor manufacturers, today announced that it is working with Zoran Corporation to deliver technology that will be featured in
-
LaCie Selects Silicon Image's SteelVine Storage Processor for eSATA Products (Monday Aug. 01, 2005)
Silicon Image, Inc. (Nasdaq: SIMG), a leader in multi-gigabit semiconductor solutions for the secure transmission and storage of rich digital media, today announced that LaCie has selected Silicon Image's SteelVine(™) storage processor for its external SA
-
Opulan Licenses MIPS Technologies MIPS32 4KEc Core (Monday Aug. 01, 2005)
Broadband Access Solutions Provider to Integrate MIPS-Based™ SoCs into xDSL Access Equipment Designs
-
SMIC Licenses SAIFUN NROM Technology to Expand its Semiconductor Business (Thursday Jul. 28, 2005)
World-Leading Semiconductor Foundry to offer NROM Two and Four Bit-Per-Cell Technology
-
BroadLight's Newly Released BL2000 GPON System-on-Chip Incorporates MIPS Processor (Tuesday Jul. 26, 2005)
BroadLight Delivers Industry’s First GPON SoC Designed for Cost-Sensitive ONT Applications with the MIPS32® 4KEc® Processor Core
-
Skymedi Selects ARCsound Audio Subsystem for Multimedia Flash Memory Controller Applications (Tuesday Jul. 26, 2005)
Skymedi, a leader in multimedia flash memory controllers, selected ARC’s audio subsystem because of the significant benefits its small size and low power consumption offer in the development of the company’s next-generation controllers
-
Philips Licenses MIPS TechnologiesMIPS32 4KEc Core (Monday Jul. 25, 2005)
MIPS-Based™ SoCs to Enable Next Generation Set-Top Boxes and PC TV Cards at Lower System Cost
-
Altek International to Use ARC's Configurable CPU in Digital Still Camera Chips (Monday Jul. 25, 2005)
ARC’s Patented Configurable Technology Ideally Suited for Low Power, Consumer Applications
-
NextIO Selects Denali PureSpec for PCI Express Design Verification (Friday Jul. 22, 2005)
Signs Denali as Exclusive Verification IP Provider
-
Freescale Selects Virage Logic's IPrima Mobile(TM) Ultra-Low-Power Memories and STAR Memory System(TM) for 65nm Chips Targeting Cell Phone Market (Thursday Jul. 21, 2005)
The increasing demand for wireless consumer products and the need to produce them as cost effectively as possible, is driving the move to 65nm process technology
-
Actions Semiconductor Licenses MIPS32 Cores for Portable Multimedia Applications (Wednesday Jul. 20, 2005)
One of Top Ten IC Design Firms in China to Develop Next-Generation Products Based on MIPS32® 4KEc® Pro and MIPS32 M4K™ Pro Cores
-
STMicroelectronics licenses ARM's Sandcat core (Tuesday Jul. 19, 2005)
European chip maker STMicroelectronics NV has become the second licensee for the Cortex-M3, a low-cost 32-bit microcontroller otherwise known as “Sandcat” from ARM Holdings plc
-
Aware Announces Adoption of Its StratiPHY-Bonded ADSL2+ Technology (Tuesday Jul. 19, 2005)
New standards-based technology in Comtrend and Netopia gateways enables delivery of multiple channel HDTV-over-DSL with speeds up to 48 Mbps
-
Samsung and Staktek Sign Expanded IP License Agreement (Tuesday Jul. 19, 2005)
Under the terms of the expanded agreement, Samsung will be able to use Staktek's leaded package stacking technology for any Samsung leaded device, such as DRAMs, SRAMs and Flash memory, until 2010
-
Renesas Technology Selects ARM Processors For 3G Mobile Phone and Consumer Devices (Tuesday Jul. 19, 2005)
By licensing these proven, high-performance ARM® processors, Renesas Technology will be able to reduce time-to-market while providing its customers with value-added solutions that support rigorous device security, media acceleration and portability requir
-
Aplus and Flextronics Semiconductor Sign Licensing Agreement for Embedded EEPROM (Thursday Jul. 14, 2005)
Flextronics Semiconductor to embed Aplus' EEPROM IP into its ASIC design
-
Alacritech, Microsoft and Broadcom Announce Cross-Licensing Agreements to Advance Scalable Networking Technologies (Wednesday Jul. 13, 2005)
Alacritech, Microsoft and Broadcom Announce Cross-Licensing Agreements to Advance Scalable Networking Technologies
-
TransDimension Licenses High-Speed USB Intellectual Property and Software Solution to Chipidea (Wednesday Jul. 13, 2005)
Chipidea to Offer the Only Complete High-Speed SoC Solution






