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Fabless / IDM News

• STARCHIP Announces the Sampling of its SCF670H SIM Controller to tackle the 4G/LTE market (Friday Feb. 15, 2013)
  StarChip today announced that it is currently sampling the SCF670H product, its latest SIM controller designed to tackle the booming 4G/LTE market.
  
  
• Renesas Mobile Introduces Ground-Breaking Quad Core ARM Cortex-A15/Cortex-A7 CPU-based Communication Processor with Integrated LTE Cat-4 Modem (Friday Feb. 15, 2013)
  Based on ARM® big.LITTLE™ technology, the processor combines high performance, to deliver exciting multimedia use cases, and extreme power efficiency to extend device battery life. Samples of the MP6530 platform will be available to Tier 1 OEMs in early 2013.
  
  
• Nujira releases new 16-band ET RF front-end for global LTE handsets (Monday Feb. 11, 2013)
  Nujira has today released its new “Woodstock” 16-band Multi-Mode, Multi-Band (MMMB) ET reference design for 4G smartphone RF Front Ends.
  
  
• MoSys Unveils New Bandwidth Engine IC with On-Board Macro Functions for 400G Network Equipment (Thursday Feb. 07, 2013)
  The Bandwidth Engine 2 - Macro delivers the highest access rate and throughput of any single device today coupled with offload accelerators for single rate and two rate three color marker (srTCM, trTCM) metering, statistics, and accounting applications.
  
  
• TI power management front-end chip increases battery run-time in ARM Cortex A15-based designs (Monday Feb. 04, 2013)
  TI today introduced the industry's first single-chip, front-end power management unit (PMU) for battery-powered applications based on ARM Cortex A9 and A15 processors.
  
  
• TOSHIBA Develops High Speed NANO FLASH-100 Flash Memory for ARM Core Based Microcontrollers (Monday Feb. 04, 2013)
  Toshiba today announced that it has developed NANO FLASH™-100 much faster access for embedded microcontrollers, based on Toshiba's original NANO FLASH™.
  
  
• Atmel Introduces New Family of Cortex-A5 Processor-Based MPUs For Embedded Industrial and Consumer Applications (Monday Feb. 04, 2013)
  Atmel today announced it is shipping production quantities of the Atmel® SAMA5D3 series, its highest performance, low-power microprocessor units (MPUs) based on the ARM® Cortex™-A5 core.
  
  
• Accent Extends Its Market Leading Position In ZigBee Solutions With ZigBee IP and SEP 2.0 (Wednesday Jan. 30, 2013)
  Accent announced today that it will incorporate the ZigBee®Alliance’s IPv6-based software stack developed by Grid2Home, developer of Smart Energy Profile 2.0 (SEP 2.0) communication technologies, as a part of its innovative ASMgrid2 silicon and software system solutions.
  
  
• MoSys Announces Renesas Electronics Support of GigaChip Interface for Chip-to-Chip Communications (Tuesday Jan. 22, 2013)
  MoSys today announced that Renesas Electronics will support the GigaChip™ Interface in its Networking ASIC business.
  
  
• Cortina's New 15g CDR and Backplane PHY Leads Industry in Performance, Density and Low Power (Tuesday Jan. 22, 2013)
  Cortina today announced the industry leading CS4224, a 16-port backplane PHY, and CS4221, a 10-port CDR, both supporting data rates up to 15Gbps.
  
  
• Infineon's New XMC1000 Industrial Microcontroller Family Delivers 32-Bit Performance at 8-Bit Prices (Thursday Jan. 17, 2013)
  Infineon today presented its new 32-bit microcontroller family XMC1000, which uses the ARM® Cortex™-M0 processor. With the XMC1000, Infineon is the first semiconductor provider to offer 32-bit microcontrollers at 8-bit prices that are supported with an advanced, 32-bit peripheral set.
  
  
• Atmel Expands ARM Cortex-M4 based Flash Microcontroller Family With New Advanced Connectivity Peripherals and Floating Point Unit (Monday Jan. 14, 2013)
  Atmel today announced it has expanded its ARM® Cortex™-M4 based Flash family to include the SAM4E series, which features advanced connectivity peripherals, a floating point unit (FPU), advanced analog capabilities, and higher processing power.
  
  
• SAMSUNG Highlights Innovations in Mobile Experiences Driven by Components, in CES Keynote (Wednesday Jan. 09, 2013)
  The first of Samsung’s new products announced at the keynote was the Exynos 5 Octa, the world’s first mobile application processor to implement the ARM® big.LITTLE™ processing technology based on the Cortex™-A15 CPU.
  
  
• Silicon Image Looks to Expand MHL 2.0 Ecosystem with Reference Design Platforms for MHL Accessories (Wednesday Jan. 09, 2013)
  Silicon Image today announced three turnkey reference platforms designed to quickly bring to market new accessories supporting the latest MHL® 2.0 mobile connectivity standard.
  
  
• Mindspeed to Showcase the Industry's First ARM Cortex A9-based Communications Processor with Integrated DPI at 2013 CES (Tuesday Jan. 08, 2013)
  Mindspeed today announced that it has fully integrated DPI technology from Lionic Corporation in its latest Comcerto 2000 communication processor family.
  
  
• Silicon Image Announces Reference Design for UltraGig 6400 Ultra-Low Power, 60GHz WirelessHD Mobile Transmitter (Tuesday Jan. 08, 2013)
  Silicon Image today announced the availability of its ‘Archer' reference design for the UltraGig™ 6400, a complete 60GHz WirelessHD® transmitter for mobile devices.
  
  
• Silicon Image Brings Latest HD Connectivity Technology Into Mainstream Home Theater Market With New Port Processors (Tuesday Jan. 08, 2013)
  The new SiI9533 and SiI9535 port processors − targeted for sound bars, A/V receivers and Home-Theater-in-a-Box (HTiB) systems − support the latest MHL® and HDMI® standards with resolutions up to 4K UltraHD as well as innovative technologies such as InstaPrevue™ and InstaPort™ S.
  
  
• ST-Ericsson opens the way for a new era of smartphones and announces the world's fastest, coolest integrated LTE Modem and Application Processor platform based on FD-SOI (Tuesday Jan. 08, 2013)
  ST-Ericsson announced the world’s fastest and lowest-power integrated LTE smartphone platform. The NovaThor™ L8580 ModAp is a multimode LTE-enabled integrated smartphone platform that includes a full connectivity suite and features an eQuad™-powered application processor running at up to 2.5Ghz.
  
  
• Ambarella Introduces 4K Ultra HD Video for Next Generation Mirrorless, Sports, and Digital Still Cameras (Tuesday Jan. 08, 2013)
  Ambarella today introduced the A9 camera System on Chip (SoC) with support for the new 4K Ultra HD video standard.
  
  
• NVIDIA Introduces World's Fastest Mobile Processor (Monday Jan. 07, 2013)
  NVIDIA today introduced NVIDIA® Tegra® 4, the world's fastest mobile processor, with record-setting performance and battery life to flawlessly power smartphones and tablets, gaming devices, auto infotainment and navigation systems, and PCs.
  
  
• Sequans Communications' LTE Chip Certified by Verizon Wireless (Monday Jan. 07, 2013)
  Sequans Communications announced that one of its LTE chips has been certified to operate on the Verizon Wireless 4G LTE network. The chip certified is the SQN3120 Mont Blanc platform LTE semiconductor solution, one of Sequans’ StreamrichLTE products for high performance LTE devices.
  
  
• Broadcom Boosts Content Protection for Set-top Box Platforms (Friday Jan. 04, 2013)
  Broadcom today announced it is first to enable Cryptography Research (CRI) differential power analysis (DPA) countermeasures across its line of set-top box (STB) platforms.
  
  
• Microsemi and Intrinsic-ID Deliver Integrated Security Solutions for Government Applications (Friday Jan. 04, 2013)
  Microsemi today announced a product demonstration through its continued relationship with Intrinsic-ID offering top-level security solutions for government applications.
  
  
• Qualchip Passed the Acceptance Inspection of CEC Specialist Group under Teledyne LeCroy's Test Platform's Verification (Friday Dec. 28, 2012)
  The USB3.0/2.0 Combo PHY IP Core Self-developed by Qualchip Qualchip passed the Acceptance of CEC Specialist Group by Teledyne LeCroy's Test Platform's Verification, the performance of which were totally satisfied with USB 3.0 Physical Test Specification and USB IF(USB Implementers Forum) compliance test requirements.
  
  
• MediaTek Strengthens Global Position with World's First Quad-Core Cortex-A7 System on a Chip - MT6589 (Thursday Dec. 20, 2012)
  The new quad-core SoC integrates MediaTek’s advanced multi-mode UMTS Rel. 8/HSPA+/TD-SCDMA modem, a power-efficient quad-core Cortex™-A7 CPU subsystem from ARM, PowerVR™ Series5XT GPU from Imagination Technologies, and is delivered in 28nm process technology.
  
  
• eASIC and Proton Digital Systems Announce LDPC NAND FLASH Read Channel For Enterprise Storage (Monday Dec. 17, 2012)
  eASIC and Proton Digital Systems today announced the immediate availability of a LDPC (Low Density Parity Check) NAND FLASH read channel for enterprise storage applications.
  
  
• Silicon Image Introduces the Industry's First Single-Chip, Ultra-Low Power, 60GHz WirelessHD Mobile Transmitter for Smartphones and Tablets (Tuesday Dec. 11, 2012)
  Silicon Image announced the UltraGig™ 6400, a complete WirelessHD transmitter for mobile devices that integrates a 60GHz RF transceiver, baseband processor, and embedded antenna array into a single IC package.
  
  
• Cortina Delivers Industry's First 28nm EDC PHY Architecture (Monday Dec. 03, 2012)
  Cortina today announced the industry’s first 28nm EDC PHY architecture. This next generation architecture becomes the technological foundation for future Cortina 25G and multi-level PAM products.
  
  
• Broadcom Introduces World's First 28nm Heterogeneous Knowledge-Based Processors (Monday Dec. 03, 2012)
  Broadcom today announced it has started sampling the NLA12000 Series, the industry's first heterogeneous KBPs manufactured in 28 nanometer (nm).
  
  
• Everspin debuts first Spin-Torque MRAM for high performance storage systems (Monday Nov. 12, 2012)
  Everspin Technologies leads the industry in commercializing the first Spin-Torque Magnetoresistive RAM (ST-MRAM), a new type of high performance and ultra-low latency memory that is expected to transform storage architecture and help drive the continuous evolution of Moore’s Law.