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Fabless / IDM News

• SiliconBlue launches "Los Angeles", Custom Mobile Device platform for high-speed sensor management, custom connectivity and video and image solutions (Monday Jul. 11, 2011)
  SiliconBlue today announced availability and fully functioning samples of the new iCE40™ “Los Angeles” mobileFPGA™ family including the LP–Series (Low-Power) and the HX–Series (High-Speed) families targeting smartphones and tablets, respectively.
  
  
• LSI Now Shipping in Volume Second-Generation 40nm LDPC Read Channel for Hard Disk Drives (Monday Jul. 11, 2011)
  Low-density parity check (LDPC) iterative decoding read channel enables areal densities of 500GB per platter for 2.5-inch drives and 1TB per platter for 3.5-inch drives
  
  
• Link_A_Media Devices Announces the Availability of its Customizable Controller Platform for Enterprise, Client, Hybrid and Consumer SSD Applications (Monday Jun. 27, 2011)
  Link_A_Media Devices announces the availability of its 6G SATA and PCIe, FlashLINK™2 SSD controller technology platform.
  
  
• Touchstone Semiconductor Announces Immediate Availability of Second-Source Maxim Analog Comparators (Thursday Jun. 23, 2011)
  Touchstone Semiconductor today introduced its TSM9117-TSM9120 and TSM917 family of analog comparators plus reference.
  
  
• PLX and Avago Technologies Team-Up to Prove PCI Express over Fiber Optics at 64Gbps (Tuesday Jun. 21, 2011)
  PLX Technology and Avago Technologies today announced a collaboration using optics to demonstrate PCI Express® (PCIe®) extending beyond its dominant role within the box to a cabled box-to-box solution.
  
  
• Dialog Semiconductor adds ARM multicore support in next generation of system level power management ICs (Thursday Jun. 16, 2011)
  Dialog has launched two third generation advanced system level power management ICs (PMICs) for tablet PCs, smartphones, embedded computers and multimedia players.
  
  
• STMicroelectronics Makes 28nm CMOS Process Available Through CMP (Thursday Jun. 16, 2011)
  STMicroelectronics and CMP today announced that the CMOS 28nm process from STMicroelectronics is now available for prototyping to universities, research labs and companies through the silicon brokerage services provided by CMP.
  
  
• ICube Technology Unveils Its Groundbreaking Harmony Unified Processor Technology (Thursday Jun. 09, 2011)
  High Performance, Cost-Effective and Power-Efficient Processor, Featuring a Unified CPU and GPU in One Parallel Computing Multi-Processing Core Architecture, Tapping Flourishing Tablet Computer Market
  
  
• Accent Announces Availability of Advanced Metrology Solution for Smart Grid Market (Wednesday Jun. 08, 2011)
  Accent announced today the availability of its metrology solution to meet the demanding energy measurement needs of smart meter devices. The full-featured solution achieves 0.1% accuracy over a dynamic range of 2000 to 1 and when integrated with Accent’s ASMgrid™ SoC Platform provides meter manufacturers leading-class system capabilities for smart energy applications while significantly reducing their electronic BOM.
  
  
• TowerJazz Announces Availability of Wireless Antenna Switch SOI Process Technology (Tuesday May. 31, 2011)
  TowerJazz today announced availability of its wireless antenna switch SOI process technology applicable to multiple wireless standards. SOI based solutions cost substantially less than legacy solutions based on GaAs pHEMPT or silicon-on-sapphire (SOS) technologies.
  
  
• Silicon Image Unveils Third-Generation WirelessHD 60GHz Chipsets (Tuesday May. 31, 2011)
  Silicon Image today announced its upcoming third-generation WirelessHD® 60GHz chipsets, the SiI6300 family consisting of the SiI6320 HRTX Network Processor, SiI6321 HRRX Network Processor and SiI6310 HRTR RF Transceiver.
  
  
• DSP Group Releases Groundbreaking XpandR III Wireless Multimedia Chip (Tuesday May. 31, 2011)
  DSP Group announced today the release and availability of XpandR™ III, the next generation in the company’s XpandR family of multimedia chipset solutions.
  
  
• Open-Silicon Introduces "On Time, or On Us" Program (Friday May. 27, 2011)
  Open-Silicon today introduced the semiconductor industry’s first money-backed design engineering schedules. Open-Silicon will meet the schedule, delivering a prototype on time, or the company will refund the cost of the design engineering, up to $500K.
  
  
• eASIC Announces easicopy ASIC (Wednesday May. 25, 2011)
  eASIC today announced the immediate availability of “easicopy”, an ASIC migration product that provides custom chip designers with a simple, low-risk migration path from eASIC Nextreme and Nextreme-2 NEW ASICs to cell-based ASIC devices.
  
  
• Silicon Image Introduces 300MHz Port Processors and Transmitter Supporting HDMI 1.4a (Wednesday May. 25, 2011)
  Silicon Image today announced two port processors, the SiI9587-3 and SiI9589-3, and the SiI9136-3 HDMI transmitter—all supporting HDMI® 1.4a with 300MHz speeds.
  
  
• Realtek Introduces a Quad GbE PHY for Customers Designing with BroadLight’s Third Generation Processors (Monday May. 23, 2011)
  Realtek Semiconductor announced today the introduction of the RTL8214B, a true quad-port Gigabit Ethernet PHY transceiver solution for customers designing with BroadLight’s 3rd Gen Processors.
  
  
• Fujitsu Expands FM3 Family of 32-bit MCUs with ARM Cortex-M3 Core (Wednesday May. 11, 2011)
  Fujitsu Semiconductor Europe has extended its comprehensive portfolio of general-purpose, 32-bit microcontrollers (MCUs), introducing 52 new products designed for home appliances, factory & office automation, medical devices and digital consumer products.
  
  
• Tabula, MorethanIP and NetLogic Microsystems Collaborate to Develop a Complete Sub-$500 Programmable 100Gb Ethernet Solution (Monday May. 09, 2011)
  Tabula, MorethanIP and NetLogic announce the industry’s first complete programmable 100Gb Ethernet solution that can be deployed cost effectively in production with price points below $500. The complete, ready-to-use solution from Tabula consists of Tabula’s I-100 100Gb Ethernet-to-Interlaken bridging device embedding MorethanIP’s silicon-proven Interlaken and 100G Ethernet MAC and PCS IP cores, and NetLogic Microsystems’ NLP15142-T 100GE PHY devices.
  
  
• Elpida Develops Industry's First 25nm Process DRAM (Monday May. 02, 2011)
  Elpida Memory today announced it had developed a 2-gigabit DDR3 SDRAM using an industry-leading 25nm process for memory manufacturing. Using the most advanced process technology available Elpida has achieved the industry's smallest chip size for a 2-gigabit SDRAM.
  
  
• Cypress and Redpine Signals Collaborate to Provide Low-Power 802.11n Wi-Fi® I/O Connectivity for PSoC® 3 and PSoC 5 Platforms (Monday May. 02, 2011)
  Designers building revolutionary products with Cypress’s PSoC platforms can easily implement wireless connectivity with Redpine’s Connect-io-n™ series of Wi-Fi modules
  
  
• Accent Introduces Industry First Advanced Transceiver Supporting Future Smart Utility Network Standard (Tuesday Apr. 26, 2011)
  Accent announced today the immediate availability of its Sub-GHz RF transceiver supporting the advanced performance needs defined by the standardization efforts of the IEEE 802.15 TG4g task group.
  
  
• Toshiba launches 19nm process NAND flash memory (Friday Apr. 22, 2011)
  Toshiba today announced that it has fabricated NAND flash memories with 19nm process technology, the finest level yet achieved. This latest technology advance has already been applied to 2-bit-per-cell 64-gigabit (Gb) chips that are the world's smallest and offer the highest density on a single chip (8 gigabytes (GB)).
  
  
• K-micro announces availability of burst-mode CDR for XGPON1 OLT applications (Tuesday Apr. 19, 2011)
  K-micro announced a new burst-mode CDR SerDes PHY for XGPON1 OLT applications. Available now in 65nm and 40nm process technologies for ASIC integration, this chip can lock to upstream data burst at 2.488 Gb/s in less than 16 bits. The new SerDes is also available as a standalone chip for supporting reference designs.
  
  
• Intel, Micron Extend NAND Flash Technology Leadership, Introduce Industry's Smallest, Most Advanced 20-Nanometer Process (Tuesday Apr. 19, 2011)
  Intel Corporation and Micron Technology Inc. today introduced a new, finer 20-nanometer (nm) process technology for manufacturing NAND flash memory. The new 20nm process produces an 8-gigabyte (GB) multi-level cell (MLC) NAND flash device, providing a high-capacity, small form factor storage option for saving music, video, books and other data on smartphones, tablets and computing solutions such as solid-state drives (SSDs).
  
  
• NetLogic Microsystems Announces the Industry's Widest Bandwidth Digital Front End Processors for 3G and 4G/LTE Base Stations (Monday Apr. 18, 2011)
  NetLogic Microsystems' OP6100 family of Digital Front End (DFE) processors delivers 65MHz of occupied bandwidth, 145MHz of total bandwidth and 325MHz of pre-distortion bandwidth
  
  
• Gennum and NuMedia Drive Next-Generation Industrial Connectivity with New Aviia HD Visually Lossless CODEC and Reference Design (Wednesday Apr. 13, 2011)
  Gennum and NuMedia today announced the availability of a new Aviia™ HD Visually Lossless CODEC (HD-VLC™) and reference design, which provides a turnkey solution for the transmission of high definition (HD) video over long runs of coaxial cable greater than 300 meters.
  
  
• Fresco Logic Announces USB-IF Certification for its 2nd Generation SuperSpeed USB Host Controller FL1009 (Tuesday Apr. 12, 2011)
  Fresco Logic is demonstrating its SuperSpeed USB 1080p camera controller prototype for broad range consumer applications in the SuperSpeed USB community and Intel’s Advanced Technology Zone at the Intel Developer Forum (IDF) Beijing
  
  
• NXP Extends Fully Scalable USB Portfolio With LPC11U00 Cortex-M0 Series (Monday Apr. 11, 2011)
  NXP Semiconductors today announced its LPC11U00 series – a low-cost ARM ® Cortex™-M0 based microcontroller featuring a new, highly flexible USB architecture, as well as a smart card interface.
  
  
• Cypress Introduces EZ-USB FX3 Controller, The Industry's Only Flexible SuperSpeed USB 3.0 Solution (Monday Apr. 11, 2011)
  Cypress today introduced its first USB 3.0 controller, the EZ-USB® FX3. The new EZ-USB FX3 device is a flexible peripheral controller with a General Programmable Interface (GPIF II) that delivers a 5-Gbps USB 3.0 data pipeline, a fully configurable ARM9™ processor core and backwards compatibility with USB 2.0.
  
  
• Toshiba Debuts SmartNAND, Latest Addition to NAND Flash Portfolio (Wednesday Apr. 06, 2011)
  Toshiba America Electronic Components, Inc. (TAEC) today announced that it has enhanced its NAND flash portfolio with the introduction of SmartNAND™, its next-generation 24-nanometer (nm) NAND flash product family.