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Fabless / IDM News

• Qualcomm Introduces Single-Chip 802.11n Wireless LAN Solution for Handsets and Mobile Devices (Tuesday Jun. 02, 2009)
  Qualcomm today introduced the WCN1312(TM) - a single-chip, high-performance 802.11n-compliant wireless local-area networking (WLAN) solution for handsets and mobile devices.
  
  
• Innovasic Semiconductor Announces the Availability of Pin-Compatible 80C186XL and 80C188XL Embedded Processors (Tuesday Jun. 02, 2009)
  Innovasic Semiconductor today announced engineering samples are shipping for the IA186XL and IA188XL. The IA186XL and IA188XL are form, fit, and function compatible with the original Intel® 80C186XL and 80C188XL 16-bit high-integration embedded processors, and also serve as replacements for the Intel® base 80C186 and 80C188 devices.
  
  
• Silicon Image Launches SteelVine(R) Series 3 Core Storage Processor and SATA Port Multiplier (Monday Jun. 01, 2009)
  Silicon Image today announced the introduction of the SiI5923 SteelVine(R) Series 3 Core storage processor and the SiI3723 SteelVine Series 3 Core SATA 1:2 port multiplier--further expanding the company's proven SteelVine storage product portfolio
  
  
• NXP Unveils Industry's Lowest Power Cortex-M3 based Microcontrollers (Tuesday May. 26, 2009)
  NXP today introduced the industry’s lowest power 32-bit Cortex™-M3 based microcontrollers, maintaining its commitment to innovation in energy-efficiency and further extending the world’s broadest range of ARM-based processors.
  
  
• Scaleo chip introduces easyBCU, new highly-integrated and powerful 32-bit Flash microcontroller family for next-generation car body electronics (Monday May. 25, 2009)
  Scaleo chip, a leading automotive System-on-Chip (SoC) company launches easyBCU™, a highly-integrated 32-bit Flash microcontrollers family for automotive Body Control Unit (BCU). This highly featured family of products complements the successful Scaleo chip car interior electronic solution, easyCAN®, delivered in millions units each year.
  
  
• Fresco Logic showcases World's First Working PCI Express to SuperSpeed USB xHCI Host Single-Chip Solution (Wednesday May. 20, 2009)
  Fresco Logic unveils the world’s first working PCI Express (PCIe) to SuperSpeed USB (aka USB 3.0) Extensible Host Controller Interface (xHCI) single chip solution with a fully integrated PCIe and a USB 3.0 physical layer device (PHY).
  
  
• NEC Electronics Introduces World's First USB 3.0 Host Controller (Monday May. 18, 2009)
  NEC Electronics today introduced the world’s first Universal Serial Bus (USB) host controller (part number µPD720200) for the new SuperSpeed USB 3.0 standard.
  
  
• XMOS starts shipment of XS1-G2 devices (Friday May. 15, 2009)
  XMOS today announced silicon availability of its XS1-G2 programmable device. Integrating two XCores™, each containing a 32-bit processor, the XS1-G2, which is code-compatible with the XS1-G4 device, provides 800MIPs and allows complete systems to be implemented in software using interface, DSP and control code.
  
  
• Texas Instruments introduces first SuperSpeed USB-compliant transceiver test chip (Friday May. 15, 2009)
  Texas Instruments today introduced a new 5-Gbps transceiver test chip designed to the USB 3.0 specification version 1.0. The new transceiver is capable of driving and receiving signals over 4-m USB 3.0 cables to ensure data integrity.
  
  
• SafeNet Unveils the Industry's Highest Security SoCs and Next Generation of Security Co-processors (Thursday May. 14, 2009)
  SafeNet today announced the availability of the SafeXcel-1742 and SafeXcel-1746, the next generation of the company’s proven security co-processors, and the SafeXcel-3120 and SafeXcel-3141 high-performance system on a chip (SoC) processors.
  
  
• Open-Silicon, Inc. Executes NXP Product Development in Record Time (Tuesday May. 12, 2009)
  Open-Silicon today announced successful completion of the software development phase of a custom ASIC device developed for NXP Semiconductors. Open-Silicon took the design from specification through production, including software, within 13 months.
  
  
• Jennic Achieves ZigBee Compliant Platform (ZCP) Certification (Tuesday May. 12, 2009)
  Jennic has gained ZigBee Compliant Platform (ZCP) certification on its recently announced JN5148 wireless microcontroller. The certification covers the JN5148 32-bit wireless microcontroller plus all of its module variants. Jennic’s in-house ZigBee stack development supports the ZigBee PRO feature set.
  
  
• eASIC Announces Low-Cost, Single-Chip High Definition H.264 Codec (Monday May. 11, 2009)
  eASIC Corporation, a provider of NEW ASIC devices, today announced the eDV9200, a low cost single chip high-definition H.264 CODEC. At the heart of the eDV9200 is fully programmable ITU-T compliant high definition baseline H.264 CODEC that supports all resolutions including 1080p, 720p, VGA, HVGA, QVGA, CIF and QCIF and variable bit rate (VBR) or constant bit rate (CBR) capabilities.
  
  
• SiliconBlue iCE65 mobileFPGA Family Strengthens Consumer Handheld Leadership with World's First Wafer Level Chip Scale Package SRAM FPGAs (Monday May. 11, 2009)
  SiliconBlue® Technologies today announced availability of two industry-first Wafer Level Chip Scale Package (WLCSP) options for its iCE65 mobileFPGA family. The ultra-low power, low cost features of iCE FPGAs combined with the die-sized packages in 0.5mm and 0.4mm ball pitch, provides solutions that meet the stringent size and space requirements of today’s real-world consumer mobile designs.
  
  
• Aquantia to Deliver World's First Quad 10GBASE-T Solution (Monday May. 11, 2009)
  Aquantia, the leading developer of energy efficient 10GBASE-T solutions, today announced the validation of the world's first 40nm Quad 10GBASE-T PHY.
  
  
• NXP ships industry's highest performance Cortex-M3 based microcontrollers (Tuesday May. 05, 2009)
  NXP today confirmed that the LPC1700 series is the industry’s highest performance Cortex-M3 microcontroller, based on results from the Embedded Microprocessor Benchmark Consortium (EEMBC). The EEMBC results show that the LPC1700 executes application code on average 35% faster than the leading Cortex-M3 competitors when running at the same clock speeds.
  
  
• PLX Technology Unveils Industry's First PCI Express-to-USB 2.0 Host Controller Bridge (Monday May. 04, 2009)
  PLX Technology today unveiled the breakthrough OXPCIe200, a high-performance PCIe-to-USB 2.0 host controller bridge.
  
  
• Open-Silicon Ships More Than 40 Million Units to Customers (Monday May. 04, 2009)
  Open-Silicon today announced that the Company has achieved a milestone by shipping more than 40 million units. This accomplishment was achieved in only the company’s sixth year of business, and fourth year of production shipments.
  
  
• Silicon Line extends its ultra-low power technology with world-record setting SerDes IC (Tuesday Apr. 28, 2009)
  Silicon Line introduces a 2.3 Gbps SerDes-IC for video or arbitrary data transport in mobile electronic devices, consuming less than 4 mW at maximum clock rate.
  
  
• Toshiba to Launch World's First 32nm Process NAND Flash Memory (Tuesday Apr. 28, 2009)
  Toshiba today announced that it will start shipping NAND flash memory products fabricated with 32nm* process technology.
  
  
• Cypress Unveils Market's First SRAM on 65-nm Process Technology (Monday Apr. 27, 2009)
  Cypress today announced it is sampling the industry’s first Quad Data Rate™ (QDR™) and Double Data Rate (DDR) SRAM devices on 65-nm linewidth. The new 72-Mbit QDRII, QDRII+, DDRII and DDRII+ memories leverage process technology developed with foundry partner UMC.
  
  
• ChipWrights Solves Video and Power Performance Issues for Netbook Developers (Tuesday Apr. 21, 2009)
  ChipWrights touts its multi-core CW5631 SoC as the optimal solution for netbook developers struggling to implement successful web video and Linux® support without driving costs sky-high. The CW5631 is an ARM processor-based SoC that achieves excellent video performance at cost-effective price and power points; it also combines a CWv16 ViSP (SIMD processor with sixteen 32-bit parallel processor datapaths) and a RISC Serial Application Processor.
  
  
• AmbaCast 6000 Platform from Ambarella Ushers in a New Era of Broadcast Video Processing (Tuesday Apr. 21, 2009)
  Ambarella today introduced its latest offering, the AmbaCast 6000 universal broadcast video processor. The AmbaCast 6000 is the world’s first single chip encode/decode/transcode/transrate platform for H.264 and MPEG-2, up to 1920x1080P60.
  
  
• Cavium Networks Announces Breakthrough Next Generation OCTEON II Multi-Core MIPS64 Internet Application Processor Family With 1 to 32 Cores (Tuesday Apr. 14, 2009)
  Cavium Networks today announced the OCTEON II Internet Application Processor (IAP) family of multi-core MIPS64® processors. The OCTEON II IAP offers up to 4x performance over the existing and widely deployed OCTEON Plus processor family, with more than twice the performance/watt and performance/dollar.
  
  
• ON Semiconductor Expands Application Specific IC Offering with Investment in 110 nm Technology and Intellectual Property (Monday Apr. 13, 2009)
  ON Semiconductor today announced the further expansion of its application specific integrated circuit (ASIC) offering through an agreement with LSI Corporation. The agreement gives ON Semiconductor customers access to an established and cost-effective 110 nanometer (nm) process technology and associated silicon-proven intellectual property (IP) via ON Semiconductor's wafer fabrication facility in Gresham, Oregon.
  
  
• RMI Announces Next Generation Multi-Core Processor Architecture and Product Family Developed on 40nm Process with Frequencies Greater than 2.0 GHz (Thursday Apr. 09, 2009)
  RMI’s next generation architecture will offer much greater processor performance than that available from any other embedded processor in the market today. The combination of the improved design, along with frequencies greater than 2.0 GHz enabled by the 40nm process node, will result in significant performance per watt advantages for RMI’s customers.
  
  
• Pericom Reaches New Signal Integrity Benchmarks for PCI Express and Serial ATA Protocols (Thursday Apr. 09, 2009)
  New Serial ATA ReDriver(TM) Optimizes Signals with Better Configuration and Capability, and PCI-SIG(R) Awards First PCIe(R) 2.0 Certification for Signal Integrity to Pericom's ReDriver(TM)
  
  
• Freescale accelerates multicore 45-nm products to market for next-generation communications systems (Thursday Apr. 02, 2009)
  Freescale Semiconductor is accelerating availability of key communications products based on 45-nm process technology in response to strong demand from wireless infrastructure equipment manufacturers targeting advanced 3G and 4G systems.
  
  
• Infineon, SkyTerra and TerreStar Announce Agreement to Develop the World’s First Satellite-Cellular Mobile Platform Based on SDR Technology (Thursday Apr. 02, 2009)
  Infineon Technologies, SkyTerra, and TerreStar Networks today jointly announced the world’s first multi-standard mobile platform based on Infineon’s innovative software-defined-radio (SDR) technology. SDR-enabled satellite-terrestrial handsets will operate with multiple cellular and satellite-based communications technologies including GSM, GPRS, EDGE, WCDMA, HSDPA, HSUPA and GMR1-2G/3G.
  
  
• Accent Licenses ARM Cortex-M3 Processor For Wireless Platform Solutions (Monday Mar. 30, 2009)
  ARM and Accent today announced that Accent has chosen the ARM® CortexTM-M3 processor for its next generation BASEsoc RF (Radio Frequency) Platform offerings. Accent’s BASEsoc RF Platform for ARM enables pre-optimized, field-proven single chip wireless systems by serving as near-finished solutions for a number of applications.