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Fabless / IDM News

• STMicroelectronics and Freescale Joint-Design Efforts Deliver on Promise of 'First Silicon' (Tuesday Feb. 26, 2008)
  Companies sample first 90-nm embedded flash microcontrollers to key automotive customers
  
  
• Renesas Technology Releases 50 New MCU Products Comprising 11 Groups, Each Built Around the R32C/100 CPU Core and Integrating High-Speed On-Chip Flash Memory (Thursday Feb. 14, 2008)
  Extensive lineup of MCU solutions with peripheral functions for automotive applications, such as a FlexRay controller and CAN, and al variety of on-chip flash memory capacity,for an excellent balance of cost to performance
  
  
• STMicroelectronics Announces Complete Fully Integrated NFC (Near Field Communication) System-on-Chip (Wednesday Feb. 13, 2008)
  New flexible secure IC from ST offers fast and easy NFC technology implementation in mobile phones and consumer products, enabling short-range wireless services such as payment and transport applications
  
  
• Qualcomm Makes Next-generation Mobile Internet Accessible with New Single-chip Solution (Monday Feb. 11, 2008)
  With support for downloads of up to 10.2 Mbps, uploads of up to 5.76 Mbps, compelling multimedia content and integrated Bluetooth/FM/GPS, the QSC6295 is helping drive the migration of popular Internet community and media sharing services to the mobile space.
  
  
• Samsung's Single-Chip Mobile TV Channel Decoder RF SoC Supports Global TV Standards for Cell Phones (Monday Feb. 11, 2008)
  Samsung Electronics unveiled today the S3C4F60, a 65nanometer (nm) single-chip mobile TV System-on-Chip (SoC) which combines a channel decoder with an RF chip.
  
  
• RMI Corporation Launches Industry's First Quad-Core Multi-Threaded Processor With Integrated Serial RapidIO Interface and IEEE1588 Controller for Wireless Base-Station Markets (Monday Feb. 11, 2008)
  The XLS Processor™ is a feature-rich general purpose processor with application specific autonomous hardware accelerators and multiple on-chip interconnect options providing an ideal combination of high level programmability, performance scalability, and intelligent packet management.
  
  
• SIDSA launches the World's first demodulator plus application processor Silicon for Portable and Mobile TV (Friday Feb. 01, 2008)
  This new chipset complements the current offering of Intellectual Property for DVB-H demodulator. The Enter e1 demodulator chipset provides best-in-class performance, specially in high speed conditions or high spectrum operation.
  
  
• Ambarella Introduces New Chip for Simultaneous Capturing High Resolution Stills and HD Video for Hybrid Cameras (Monday Jan. 28, 2008)
  Working at a data capture rate as fast as 480Mpixels-per-second, the A390's speed exceeds 60 frames-per-second at 8Mpixels. The A390 SoC is the third member in the A3 SoC platform series targeted at hybrid cameras and supports the emerging H.264 AVC video standard.
  
  
• AMCC Enhances Relationship with IBM Microelectronics, Expands the Reach of its Leading PowerPC 4xx Product Portfolio (Friday Jan. 25, 2008)
  AMCC today announced a significant expansion of its relationship with IBM. IBM will incorporate the entire AMCC PowerPC(R) 4xx embedded processor product portfolio into its Semiconductor Solutions offering, effective immediately.
  
  
• STMicroelectronics Unveils its Next-Generation Integrated Bluetooth and FM-Radio Transceiver System on Chip in 65nm Process Technology (Thursday Jan. 24, 2008)
  ST's STLC2690 single-chip Bluetooth v2.1+EDR with fully integrated FM RDS radio receiver and short-range FM RDS transmitter enables new generation of media-rich mobile phones, smart phones and other battery-driven portable devices
  
  
• VIA Unveils Next-Generation Isaiah x86 Processor Architecture (Thursday Jan. 24, 2008)
  The first processors implementing the VIA Isaiah Architecture will use proven 65 nanometer technology for greater power efficiency.
  
  
• Nanochip Raises $14 Million to Complete Development of Ultra-High-Capacity Removable Data Storage Chips (Thursday Jan. 24, 2008)
  Series C2 Funding to Support Prototype Development, Design Verification and Sampling of Removable Chips for Computer, Server and Consumer Electronics Markets
  
  
• Silicon Line's World-Record: 2.5 Gb/s Optical Link Consuming Less Than 10 mW (Wednesday Jan. 23, 2008)
  Silicon Line GmbH, a German fabless analog IC company, today announced the release of a 2.5 Gigabit per second (Gbps) chipset comprising a transimpedance amplifier (TIA) with integrated limiting amplifier and a Vertical Cavity Surface Emitting Laser (VCSEL) driver.
  
  
• Mindspeed Introduces Next-Generation Family of System-on-Chip Carrier Access VoIP Processors (Wednesday Jan. 23, 2008)
  The Comcerto 300 Series device architecture incorporates two separate ARM11 processor cores and a DSP array coupled through a shared memory subsystem to simultaneously provide real-time, low-latency media processing, as well as call control and call setup functions.
  
  
• eSilicon Acquires SwitchCore's Product Lines (Monday Jan. 14, 2008)
  Through this acquisition, eSilicon has extended its production services business model to not only include managing the production of devices for companies who don’t want or are unable to deal with the complexities of the semiconductor value chain, but also to the customers of companies that have made a decision to exit all or part of their existing businesses.
  
  
• Toshiba licenses ARM Cortex-M3 32-bit RISC processor for ASIC and ASSP applications (Monday Jan. 14, 2008)
  Toshiba Electronics Europe (TEE) is now offering the synthesisable ARM Cortex™-M3 32-bit RISC processor for use across the company’s full range of ASIC technologies. Based on the license agreement with Toshiba Corporation, TEE can deploy the ARM Cortex–M3 core in high-performance, low power consumption, minimum pin count ASICs, ASSPs and other system on chip (SoC) solutions.
  
  
• Freescale establishes advanced 200-mm MEMS production line (Monday Jan. 14, 2008)
  Freescale Semiconductor has established an advanced microelectromechanical systems (MEMS) 200-mm (8-inch) production line to address growing sensors market demand. The newly added line at Freescale's Oak Hill Fab in Austin, Texas, complements the company's existing 150-mm (6-inch) MEMS capacity in Sendai, Japan.
  
  
• Ambarella Introduces Third-Generation SoC for HD Camcorders With Progressive Video (Monday Jan. 07, 2008)
  The A3 is targeted at high-definition (HD) camcorders using H.264/AVC compression technology. The SoC comes in two versions: the A350 supporting the 1080i 60 interlaced HD standard; and the A380 supporting the emerging 1080p60 progressive video format.
  
  
• Magnum Semiconductor Launches New Multimedia-Rich Application Processor (Monday Jan. 07, 2008)
  The ZV1050 combines an ARM9 CPU with an advanced 3D graphics engine to deliver photo-realistic graphical images and game-quality effects on portable LCD or external TV displays.
  
  
• BridgeCo Unveils Third-Generation Networked Audio Platform (Monday Jan. 07, 2008)
  BridgeCo’s latest ARM9-based triple-core processor with integrated Wi-Fi® support, the industry’s first Linux-based SDK and middleware stack, and a ready-to-manufacture hardware reference design with a component bill-of-materials (BOM) cost that is 20% below previous implementations.
  
  
• DivX Certifies Blu-Ray Capable ''UniPhier'' Chip Platform from Panasonic (Monday Jan. 07, 2008)
  The “UniPhier” is an integrated multimedia chip platform that enables high-quality video solutions such as DivX playback in a number of product categories, including Blu-ray DVD players and recorders, as well as digital televisions, mobile phones and in-car devices.
  
  
• Zoran Corp. Announces VaddisHD High-Definition Multimedia Processor platform for Blu-Ray Disc and HD-DVD Players (Friday Jan. 04, 2008)
  The VaddisHD™ multimedia processor ICs integrate a state-of-the art High Definition (HD) video pipeline and enable multi-standard decoding including support for HD H.264, VC1, MPEG2, MPEG4, and AVS. With an integrated dual processor and dual Audio DSP, it enables the most advanced HD applications, including Java and HDi support for the Blu-Ray and HD-DVD standards, respectively.
  
  
• STMicroelectronics Introduces Full High-Definition Integrated Digital TV Platform Supporting Worldwide Standards (Friday Jan. 04, 2008)
  The DTV150 provides demodulation, MPEG-2 high-definition (HD) and standard-definition (SD) decoding, full HD video processing, high quality audio, and the video switching functions, for integrated digital TV (iDTV) sets worldwide.
  
  
• Infineon Broadens Availability of Embedded Flash Process (Thursday Dec. 20, 2007)
  Infineon today announced an agreement with IBM to broaden the availability of Infineon's proven, high-volume Embedded Flash process. Infineon's 130nm Embedded Flash technology will be licensed to IBM and will be available for new chip designs manufactured by IBM in North America.
  
  
• ChipX and Recognetics Partner to Deliver Pattern Recognition ASIC for Security, Data Mining and Imaging Applications (Monday Dec. 17, 2007)
  ChipX today announced the successful implementation of a complex, 10 million gate design for pattern recognition using Recognetics' neural network technology.
  
  
• STMicroelectronics Samples 65nm Hard Disk Drive Iterative Decoding Channel (Wednesday Dec. 12, 2007)
  STMicroelectronics is sampling its first 65nm iterative read channel for the low-power mobile segment of Hard Disk Drives (HDD). This Mobile IP is the first offering from ST’s Tiziano family of read channel macros, which will also include channels customized for the desktop and enterprise market segments.
  
  
• STMicroelectronics Migrates Chips to Advanced 45nm CMOS RF TechnologySTMicroelectronics Migrates Chips to Advanced 45nm CMOS RF Technology (Monday Dec. 10, 2007)
  STMicroelectronics has announced that it has successfully manufactured the first functional devices to be built using the CMOS 45nm Radio Frequency (RF) technology.
  
  
• TI Delivers First Single-Chip, Real-Time HD Video Transcoding Solution with DaVinci(TM) Technology (Thursday Dec. 06, 2007)
  Integrating an ARM926EJ-S core and 600 MHz C64x+(TM) DSP core along with a high-definition video co-processor, conversion engine and targeted video port interfaces, the system solution delivers a 10x performance improvement over previous generation processors to perform simultaneous, multi-format HD encode, decode and transcoding up to H.264 HP@L4 (1080p 30fps, 1080i 60fps, 720p 60fps).
  
  
• XMOS unveils first Software Defined Silicon (Monday Dec. 03, 2007)
  XMOS Semiconductor, the creator of Software Defined Silicon (SDS), a new class of programmable semiconductor, today announced it has working silicon and beta design tools in the lab. Test chips were produced by TSMC on its 90nm G process.
  
  
• eSilicon Ramps 65Nm Design Engagements With Multiple Customers (Tuesday Nov. 27, 2007)
  eSilicon first demonstrated its 65nm design expertise with its pre-hardened ARM926EJ™ processor core. The company used its design methodology to optimize an ARM926EJ-S™ core with 8K of instruction and 8K data cache in the TSMC 65GP process, achieving performance of 750MHz and an area of 0.84 sq. mm with six layers of metal.