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Fabless / IDM News

• KALRAY to showcase low power, live Ultra HD (4K) HEVC encoder at CCBN 2014 in collaboration with DivX (Thursday Mar. 20, 2014)
  KALRAY, the designer and provider of the low power, high performance MPPA MANYCORE processor, today announced the demonstration at CCBN 2014 of its unique low power live Ultra HD HEVC (4K) encoder running on the KALRAY MPPA MANYCORE processor.
  
  
• MoSys Demonstrates 15.625G Bandwidth Engine SerDes Interoperability with Xilinx's Kintex UltraScale FPGA at OFC 2014 (Wednesday Mar. 12, 2014)
  MoSys is demonstrating its industry leading Bandwidth Engine® interface, at 15.625G, using Xilinx’s latest Kintex® UltraScale™ FPGA.
  
  
• KnC Announce "Tape out" of the World's first 20nm ASIC for Bitcoin Mining (Wednesday Mar. 05, 2014)
  KnC is announcing they have completed ‘tape out’ of their new ASIC. This is the world’s first Bitcoin Mining Application Specific Integrated Circuit (ASIC) designed using ground breaking 20 nanometer engineering. This important milestone was achieved only 3 months after starting the project, during February 2014.
  
  
• Marvell Extends its 4G LTE Leadership with the Introduction of the 64-bit Single-Chip Mobile Processor with Production-Ready 5-Mode Modem (Wednesday Mar. 05, 2014)
  Marvell today announced the 64-bit mobile System-on-Chip (SoC) with production-ready 5-mode modem, the ARMADA® Mobile PXA1928.
  
  
• Silicon Image Enters Small Cell Wireless Backhaul Market with Industry's First Single-Chip Beam Steering 60GHz RF Tranceivers (Monday Feb. 24, 2014)
  Silicon Image today announced its entry into the small cell wireless backhaul market with the introduction of two high-throughput, single-chip CMOS beam-steering 60GHz RF transceivers designed to address the rapidly growing market for high-capacity wireless backhaul links in urban environments.
  
  
• Silicon Image Announces New MHL® Smartphone Reference Designs with MediaTek (Monday Feb. 24, 2014)
  Silicon Image today announced that MediaTek has partnered with Silicon Image to include the SiI8348 MHL® transmitter in their latest MT6592 and MT6595 octa-core smartphone SoC platforms.
  
  
• Renesas Electronics Develops Industry's First 28nm Embedded Flash Memory Technology for Microcontrollers (Wednesday Feb. 19, 2014)
  Renesas Electronics today announced that it has developed the industry's first 28-nanometer (nm) flash memory intellectual property (IP) for microcontrollers (MCUs) using a 28 nm process technology.
  
  
• INSIDE Secure launches a unique and comprehensive mobile security offer (Wednesday Feb. 19, 2014)
  INSIDE Secure today announces the availability of second-generation VaultSEcure(TM) secure element, the market’s first fully comprehensive mobile security chip.
  
  
• Leti and STMicroelectronics Demonstrate Order-of-Magnitude-Faster FD-SOI Ultra-Wide-Voltage Range DSP (Friday Feb. 14, 2014)
  CEA-Leti and STMicroelectronics have presented the successful demonstration of an ultra-wide-voltage range (UWVR) digital signal processor (DSP), based on 28nm ultra-thin body buried-oxide (UTBB) FD-SOI technology.
  
  
• MediaTek Announces MT6595, World’s First 4G LTE Octa-Core Smartphone SOC with ARM Cortex-A17 and Ultra HD H.265 Codec Support (Tuesday Feb. 11, 2014)
  MediaTek today announces the MT6595, a premium mobile solution with the world’s first 4G LTE octa-core smartphone SOC powered by the latest Cortex-A17™ CPUs from ARM®. The MT6595 employs ARM’s big.LITTLE™ architecture with MediaTek’s CorePilot™ technology to deliver a Heterogeneous Multi-Processing (HMP) platform that unlocks the full power of all eight cores.
  
  
• PLX Achieves Industry-First Compliance of PCI Express 3.0 Switches on Exclusive PCI-SIG Integrators List (Thursday Feb. 06, 2014)
  PLX Technology today announced three PLX® ExpressLane™ PCIe Gen3 switches have passed the rigorous testing procedures of the PCI-SIG® Compliance Workshop and are now listed on the group’s highly respected PCIe 3.0 Integrators List.
  
  
• MoSys Announces New Bandwidth Engine Architecture with over 1.5 Tbps Internal Bandwidth (Wednesday Feb. 05, 2014)
  MoSys today announced the architecture for its third generation Bandwidth Engine® family, featuring the industry's highest serial throughput and memory access rate, optimized efficiency and scheduling for multi-core processing, and expanded multi-cycle embedded macro functions.
  
  
• GigOptix Offers Its Custom Structured ASIC Solutions for Rapid Productization of Cryptocurrency Bit Mining Chip and Application with Partners (Monday Feb. 03, 2014)
  GigOptix today announced that its Custom Structured ASIC applications are establishing GigOptix as one the foremost providers of ASICs for the fast growing cryptocurrency bit mining market.
  
  
• CoinTerra begins shipment of the TerraMiner IV - the world's fastest Bitcoin miner (Friday Jan. 31, 2014)
  CoinTerra™, the high performance and value leader in ASIC Bitcoin mining hardware announced today that they have started delivering their eagerly-anticipated TerraMiner™ IV professional Bitcoin miner – the first to market which breaks the one terahash barrier.
  
  
• ASMedia Technologies Demonstrates Industry's First SuperSpeed USB 10 Gbps (USB 3.1) PHY at USB-IF Annual Members Meeting (Friday Jan. 24, 2014)
  ASMedia Technologies, a fabless semiconductor company that develops and markets high-speed IO solutions, demonstrated SuperSpeed USB 10 Gbps (USB 3.1) data transfer on its hardware development platform at the USB Implementers Forum (USB-IF) annual members meeting in Honolulu.
  
  
• eASIC and EnSilica Announce 16-bit and 32-bit Soft Processors for eASIC Nextreme Devices (Tuesday Jan. 14, 2014)
  eASIC® and EnSilica today announced the immediate availability of 16-bit (eSi-1600) and 32-bit (eSi-3200) soft processor cores. The eSi-1600 and the eSi-3200 are based on an EnSilica’s eSi-RISC highly versatile microprocessor architecture that can be optimized by application through extensive configuration options and custom instructions.
  
  
• Silicon Image First to Introduce 4K Ultra HD 60GHz Wireless Adapter Solution (Wednesday Jan. 08, 2014)
  Silicon Image today announced a wireless video connectivity solution capable of supporting 4K Ultra HD resolution. Based on Silicon Image's 60GHz WirelessHD® technology, this reference design includes both transmitter and receiver devices capable of sending full, bit accurate video at data rates up to 8Gbps.
  
  
• Atmel Introduces New SAM G Family of ARM Cortex-M4-based Ultra-low Power MCUs In Small Form Factors for Smart, Connected Devices (Wednesday Jan. 08, 2014)
  Atmel today announced the Atmel SAM G family of ARM® Cortex-M4-based MCUs that integrate high performance and ultra-low power in a small form factor. The complete solution is ideal for sensor hub and battery-operated consumer applications including sensor hubs for smartphones, tablets and Ultrabooks as well as wearables, healthcare, gateways, bridges and audio devices.
  
  
• Entropic Completes Integration of Cryptography Research CryptoFirewall Security Cores (Wednesday Jan. 08, 2014)
  Entropic and Cryptography Research today announced Entropic has completed the integration of the Cryptography Research CryptoFirewall™ security core technology into its advanced line of multimedia set-top box (STB) system-on-a-chip (SoC) products.
  
  
• GEO Expands Product Line with Compact Geometric Image Processing Solutions for Automotive Ultra-Wide Angle Camera and Head-Up Display Applications (Tuesday Jan. 07, 2014)
  GEO Semiconductor announced today the introduction of the GW3100, GW3200 and the GW3210 programmable geometric image processors designed for automotive camera and head-up display applications.
  
  
• Groundbreaking Architecture from STMicroelectronics Leads Industry Transition to 64-bit Computing for the Digital Home (Tuesday Jan. 07, 2014)
  STMicroelectronics has released details of its innovative STi8K™ architecture addressing future Systems-on-Chips (SoCs) for the Digital Home.
  
  
• NVIDIA Unveils Tegra K1, a 192-Core Super Chip That Brings DNA of World's Fastest GPU to Mobile (Monday Jan. 06, 2014)
  NVIDIA today unveiled the revolutionary Tegra® K1 mobile processor, a 192-core super chip featuring the same NVIDIA® Kepler™ architecture that powers the fastest GPU on the planet, the NVIDIA GeForce® GTX™ 780 Ti. For the first time, next-generation PC gaming will now be available on mobile platforms.
  
  
• Quantenna Powers World's Fastest 802.11ac Dual-Band Wave 2 ASUS RT-AC87U Router (Monday Jan. 06, 2014)
  Quantenna and ASUS today at CES announced that Quantenna’s award-winning QSR1000 4x4 Multi-User Multiple Input Multiple Output (MU-MIMO) chipset will power the ASUS RT-AC87U, the world’s fastest 802.11ac home router.
  
  
• GEO Introduces Single Chip Solution for Ultra-Wide Angle Cameras (Friday Jan. 03, 2014)
  The GC6500 integrates GEO’s patented eWARP™ core, MIPI D-PHY Input, Audiophile quality stereo recording path, low latency highly flexible H.264 Codec, Tensilica XTENSA HIFI CPU and USB2.0 interfaces. Integrated DCDC converters and LDOs provide all system voltages for unprecedented integration.
  
  
• Fortemedia Launches Highly Integrated Voice Processor For Automotive Applications (Thursday Dec. 19, 2013)
  Today Fortemedia Inc. announced the availability of the industry’s most advanced and highly integrated voice processor, the FM1388, supporting advanced voice processing for automotive applications while supporting ease of system design
  
  
• New digital radio chip targets smart devices and global markets (Tuesday Dec. 17, 2013)
  Frontier Silicon announces details of Chorus 4, its next generation digital radio chip. Chorus 4 is a single-chip solution, which integrates four previously separate chips to deliver significant cost and energy consumption savings.
  
  
• Fujitsu Semiconductor Successfully Embeds Flash Memory onto DDC Technology (Monday Dec. 16, 2013)
  Fujitsu Semiconductor announced that it has developed the world's first technology to produce chips with embedded flash memory on logic circuits fabricated using deeply depleted channel (DDCTM) technology, with the 55nm process at the company's Mie Plant.
  
  
• Silicon Image Introduces Industry's First MHL 3.0 4K Ultra HD Solution for Mobile Devices (Monday Dec. 16, 2013)
  Silicon Image today announced the industry's first 4K Ultra HD MHL® 3.0 solution comprising mobile transmitter, bridge, and multimedia switch integrated circuits (ICs). MHL is the leading HD and 4K Ultra HD connectivity standard for connecting a mobile device to large screen displays, while simultaneously charging the device.
  
  
• Qualcomm Technologies Introduces Snapdragon 410 Chipset with Integrated 4G LTE World Mode for High-Volume Smartphones (Tuesday Dec. 10, 2013)
  Qualcomm today announced that its wholly-owned subsidiary, Qualcomm Technologies, Inc., has introduced the Qualcomm® Snapdragon™ 410 chipset with integrated 4G LTE World Mode.
  
  
• Broadcom Announces Bluetooth Smart SoC with Wireless Charging Support for Growing Wearable Market (Thursday Dec. 05, 2013)
  Broadcom today introduced a new Bluetooth® Smart system-on-a-chip (SoC) into its Wireless Internet Connectivity for Embedded Devices (WICED) family to address the rapidly growing opportunities in different market segments for wearables and the Internet of Things.