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Fabless / IDM News

• GigOptix Announces Low Risk Component Obsolescence Replacement Program (Thursday May. 06, 2010)
  GigOptix today announced its Sunset Rescue Program, a service that provides replacements for obsolete ASICs and FPGAs utilizing a proven methodology owned by GigOptix through its acquisition of ChipX in November 2009.
  
  
• MagnaChip to Offer Cost Competitive 0.18um Embedded EEPROM Technology (Tuesday May. 04, 2010)
  MagnaChip Semiconductor today announced that it now offers 0.18um embedded EEPROM technology to meet the specialized application needs of foundry customers.
  
  
• Accent Announces Company Strategic Focus to Speed Adoption of Smart Grid Devices (Tuesday May. 04, 2010)
  Accent launches ASMgrid, the industry first Clean Tech System-on-Chip (SoC) platform. ASMgrid incorporates unprecedented wireless and communications technology breadth for single chip solutions.
  
  
• NetLogic Microsystems and TSMC Collaborate on 28nm Process Technology (Thursday Apr. 29, 2010)
  NetLogic Microsystems and TSMC today announced an extension of their long-standing collaboration to include TSMC’s NEXSYS™ 28HP (28nm high performance) semiconductor process node for NetLogic Microsystems’ next-generation knowledge-based processors, multi-core processors and 10/40/100Gigabit PHY.
  
  
• Toshiba Launches 32-Bit Microcontroller For Analog Circuit Control In Industrial and Appliance Applications (Tuesday Apr. 27, 2010)
  Toshiba America Electronic Components today announced availability of a new 32-bit microcontroller (MCU), the TMPM380. Powered by a 40 MHz ARM® Cortex™-M3 processor core, Toshiba's TMPM380 provides higher performance than the 8- and 16-bit MCUs typically used in industrial or appliance applications, yet at price points similar to the lower-performing alternatives.
  
  
• NXP Announces LPC1100 ARM Cortex-M0 CAN Microcontrollers (Monday Apr. 26, 2010)
  NXP today introduced the first two devices, LPC11C12 and LPC11C14, in the LPC11C00 series featuring a Controller Area Network (CAN) 2.0B-compliant controller for industrial and embedded networking applications. CAN has long been considered one of the best choices for robust real-time communication, but price-prohibitive for low-cost embedded applications.
  
  
• Dust Networks Announces ARM Cortex-M3 Processor Based IEEE 802.15.4 SOC (Monday Apr. 26, 2010)
  Dust Networks®, the leading supplier of wireless sensor networks (WSN), today announced that its new IEEE 802.15.4 products will include the powerful, low power ARM®Cortex™-M3 processor.
  
  
• NXP Shows World's Smallest 32-bit ARM Microcontroller (Wednesday Apr. 21, 2010)
  NXP Semiconductors today announced sampling of the world’s smallest general-market 32-bit microcontroller, the LPC1102, based on the Cortex-M0 processor. Unleashing unprecedented computing power in 5mm2 of PCB area, this device is targeted at very high volume applications requiring an ultra-miniature board footprint.
  
  
• STMicroelectronics Unveils STM32L Ultra-Low-Power ARM Cortex-M3 based Microcontrollers for 'Energy-Lite' Applications (Tuesday Apr. 20, 2010)
  STMicroelectronics today announced sampling to lead customers of the STM32L series: the industry’s first ultra-low-power ARM® Cortex™-M3 microcontrollers available from a top-10 silicon supplier.
  
  
• Samsung Producing Industry's First Higher-performing 20nm-class NAND Flash Memory (Monday Apr. 19, 2010)
  Samsung Electronics today announced the industry’s first production of 20 nanometer (nm) class NAND chips for use in Secure Digital (SD) memory cards and embedded memory solutions. Based on this cutting-edge technology, the introduction of 32 gigabit (Gb) MLC NAND will expand the company’s memory card solutions for smart phones, high-end IT applications and high-performance memory cards.
  
  
• Intel Plans New Intel Atom Processor-based System-on-Chip (Thursday Apr. 15, 2010)
  Two Intel executives today outlined the latest Intel SoC products for embedded applications and described new research to allow homes and small businesses to better use and manage energy. The forthcoming SoC product features an Intel® Atom™ processor core that, for the first time, will let other companies create PCI Express*-compliant devices that directly connect to the chip, which offers new flexibility for embedded applications.
  
  
• Genesys Logic Receives USB-IF Certification for SuperSpeed USB Product (Tuesday Apr. 06, 2010)
  Genesys Logic today announced its GL3310, a USB 3.0 to SATA 3Gb/s bridge chip, has passed USB compliance workshop tests and was certified and listed in the integrators list by the USB Implementers Forum (USB-IF) for SuperSpeed USB peripheral silicon.
  
  
• SiTune unveils Innovative mobile DVB-T CMOS SOC exceeding MBRAI specification (Thursday Apr. 01, 2010)
  SiTune announced a state of the art and revolutionary mobile DVB-T receiver SOC. STN-10R3000 is a highly integrated mobile DVB-T demodulator plus multi-band RF tuner in a single die with small foot print that deliver best signal reception and mobility performance in all modes of the DVB-T standard especially in 64 QAM modulation.
  
  
• eASIC Announces Immediate Availability of Aeroflex Gaisler's Leon4 Processor (Thursday Mar. 04, 2010)
  eASIC today announced the immediate availability of Aeroflex Gaisler’s next generation LEON processor, the LEON4, as part of its eZ-IP Alliance Core Library. The power and size optimized LEON4 is fully software compatible with previous LEON processors, yet with a performance increase of up to 50% at the same clock frequency.
  
  
• Tabula Introduces Breakthrough Spacetime Programmable Logic Architecture (Monday Mar. 01, 2010)
  Tabula, Inc., a privately held fabless semiconductor company developing 3-D Programmable Logic Devices (3PLD), today introduced Spacetime, a groundbreaking programmable logic architecture that uses time as a third dimension to deliver unmatched capability and affordability.
  
  
• New Freescale Processor Helps Lower Costs and Foster Innovation for Next-Generation eReaders (Monday Mar. 01, 2010)
  Freescale Semiconductor is helping drive down the cost of next-generation eReaders with its i.MX508 applications processor, the first system-on-chip (SoC) to integrate advanced ARM Cortex™-A8 technology together with the newest hardware-based display controller from E Ink. Freescale’s highly integrated i.MX508 processor is designed to deliver the performance, energy efficiency and system cost savings necessary to help OEMs evolve and grow the dynamic eReader product category.
  
  
• STMicroelectronics Introduces SPEAr Microprocessors for Embedded-Control Applications (Thursday Feb. 25, 2010)
  STMicroelectronics unveiled four new members in the SPEAr microprocessor family, targeting embedded-control applications. Based on the latest ARM® core technology, ST’s SPEAr microprocessors enable equipment manufacturers to develop complex yet flexible digital engines at a fraction of the time and cost of competing solutions.
  
  
• Samsung Expands Green Line-up with Industry's First Volume 40nm-class 4Gigabit DDR3 (Wednesday Feb. 24, 2010)
  Samsung Electronics announced today that it has begun mass producing the industry’s first low-power (green) four gigabit (Gb) DDR3 devices using 40 nanometer (nm) class process technology.
  
  
• STMicroelectronics Announces World's First 55 Nanometer Embedded Flash Process Technology for Automotive Microcontrollers (Monday Feb. 22, 2010)
  STMicroelectronics today announced its 55 nanometer (nm) embedded Flash (eFlash) process technology, which will be implemented in its next-generation automotive microcontroller (MCU) chips. ST is extending its production of eFlash technology to this advanced process node at its world-class 300mm manufacturing facility at Crolles, France.
  
  
• PLX to Demonstrate World's First PCI Express Gen 3 Switch (Wednesday Feb. 17, 2010)
  
  
  
• Comsys Mobile Announces Baseband Development Platform for LTE UE SoC (Tuesday Feb. 16, 2010)
  Comsys Mobile today announced availability of a new platform, the ComMAX . LT8000DP is a pre-silicon development platform for integration of Comsys Mobile’s ComMAX LTE technology with ecosystem partners’ IP, for a comprehensive LTE solution in shorter time to market. It supports eUTRA FDD and TDD as well as LTE CAT4 with sustained data throughput up to 150Mbps.
  
  
• Triad Semiconductor Announces First Mixed-signal ARM Cortex-M0 Processor with 16-bit ADC and 12-bit DAC (Tuesday Feb. 16, 2010)
  Triad Semiconductor today announced another first: the first ARM® Cortex™-M0 processor combined with high-resolution, high-precision analog resources: 16-bit ADC and 12-bit DAC and uncommitted op-amps.
  
  
• Broadcom Introduces 65nm 3G HSPA Chipset Solution to Enable High-Speed, Low Cost Smartphone Devices (Monday Feb. 08, 2010)
  Broadcom today announced a new single-chip HSPA (high-speed packet access) baseband processor and a radio frequency (RF) transceiver solution that integrates all of the key 3G (third generation) cellular and mobile technologies for powering the 3G smartphone and smart feature phone product segments. The advanced baseband processor is the first to provide extremely high-speed cellular connectivity with advanced, built-in graphics capabilities, for HSUPA (high speed upstream packet access) applications.
  
  
• NetLogic Microsystems Enables Significantly Richer LTE and IPTV Network Services with the World's First Knowledge-based Processor with High-Speed Serial Interface (Monday Feb. 01, 2010)
  High-speed serial interface delivers 340% higher I/O bandwidth-per-pin for next-generation network core, metro, edge, enterprise and data center applications
  
  
• Samsung Develops Most Advanced Green DDR3 DRAM, Using 30nm-class Technology (Monday Feb. 01, 2010)
  Samsung Electronics Co., Ltd., the world leader in advanced semiconductor technology solutions, today announced that the industry’s first 30-nanometer-class DRAM has just successfully completed customer evaluations, in two gigabit (Gb) densities.
  
  
• Mindspeed 3G/4G/LTE Baseband Basestation Solution Uses Latest ARM Cortex A9 MPCore in Advanced 40-Nanometer Process Technology (Monday Jan. 25, 2010)
  Mindspeed Builds on Long-Time Collaboration with ARM, Uses Mulitple ARM Cortex Processors to Enable New Class of Scalable Basestation Designs with Best-in-Class Processing Performance
  
  
• ChipWrights' Hardware Development Kit Speeds the Design of Video Processing Applications (Friday Jan. 22, 2010)
  ChipWrights' Hardware Development Kit provides a comprehensive design environment that includes the hardware and software necessary to develop premium audio and video processing applications, including video I/O, networking, multiple media storage interfaces, and support hardware.
  
  
• eASIC Slashes Power with Low Voltage Devices (Friday Jan. 22, 2010)
  eASIC today announced the immediate availability of two new lower power device options for its eASIC Nextreme Family. The NX750LP and NX750 Nextreme devices are now available with operating voltage down to 1.0V thereby enabling designers to achieve up to 40% lower power consumption.
  
  
• Qualcomm and AMD Lead List of Top 25 Fabless IC Suppliers (Thursday Jan. 21, 2010)
  Cellular phone chip supplier Qualcomm remained the number one fabless IC supplier, registering $6.6 billion in sales in 2009, a 2% increase. The most impressive gain by a large (i.e., greater than $1.0B in sales) fabless IC suppler in 2009 was MediaTek, which registered a strong 22% increase in sales to $3.5 billion.
  
  
• LSI Expands Custom IP Portfolio for Enterprise Networking and Storage Applications (Wednesday Jan. 20, 2010)
  LSI today announced the addition of the multicore-capable PowerPC 476 microprocessor core and high-speed, embedded DRAM memory blocks to its industry-leading portfolio of custom silicon intellectual property (IP).