Foundries News

• Texas Instruments 45-nm Chip Manufacturing Process Doubles Output per Wafer, Lowers Power and Boosts Performance (Monday Jun. 12, 2006)
  Consumers to Have Better User Experience and Longer Battery Life in Portable Devices, More Applications Running Concurrently
  
  
• TSMC May 2006 Sales Report (Friday Jun. 09, 2006)
  TSMC today announced its net sales for May 2006: on an unconsolidated basis, sales were NT$26,770 million, a decrease of 1.4 percent from April 2006 and an increase of 37.2 percent over May 2005; revenues for January through May 2006 totaled NT$131,226 mi
  
  
• NEC Electronics America Announces New 55-Nanometer Standard CMOS Process (Friday Jun. 09, 2006)
  NEC Electronics America, Inc. today announced to the Americas' markets the industry's first 55-nanometer (nm) standard CMOS process technology, UX7LS, that will be used to produce next-generation systems on chips (SoCs) with ultra-low power consumption.
  
  
• SMIC Shanghai Closed a US$600 Million Syndicated Term Loan (Thursday Jun. 08, 2006)
  SMIC has successfully closed the 5-year US$600 million secured term loan facility with a consortium of international and PRC banks
  
  
• Tower Semiconductor Files Draft Preliminary Prospectus With Israel Securities Authority for Possible Public Offering in Israel (Monday Jun. 05, 2006)
  Tower Semiconductor Ltd. (NASDAQ: TSEM; TASE: TSEM), a pure-play independent specialty foundry, announced today that it is contemplating a public offering of securities in Israel and that it has filed a draft preliminary prospectus with the Israel Securit
  
  
• Jazz Semiconductor Announces Advanced Modeling Tool for Analog and RF Foundry Customers (Thursday Jun. 01, 2006)
  Jazz Semiconductor's PCMT allows designers to close the loop between simulated results from their silicon models and actual results for their product designs at the lot, wafer, or die level. The PCMT efficiently allows designers to correlate wafer measure
  
  
• X-FAB Partners With Akustica to Deliver World's First CMOS MEMS Single-Chip Microphones (Wednesday May. 31, 2006)
  Akustica, Inc., a pioneer in acoustic system-on-chip solutions, and X-FAB Semiconductor Foundries AG, one of the world's leading analog mixed-signal semiconductor foundries, today announced a strategic supplier partnership to focus on wafer processing of
  
  
• SMIC Tianjin Secures Financing for Expansion (Wednesday May. 31, 2006)
  The proceeds of the Loan will help to expand the capacity at SMIC's 200-mm fab located in Tianjin. SMIC will guarantee SMIC Tianjin's obligations under the Loan
  
  
• UMC Announces Readiness for 65-nanometer X Architecture Designs (Thursday May. 25, 2006)
  Cadence and UMC Collaborate to Validate X Architecture Design Rules for 65nm Process Technologies
  
  
• TSMC Production-Ready for 65-nm X Architecture Designs (Thursday May. 25, 2006)
  Taiwan Semiconductor Manufacturing Company and Cadence Design Systems, Inc. today announced that the Cadence® X Architecture has been validated for TSMC's 65-nm Nexsys(SM) process
  
  
• X-FAB Reduces Die Size with New Trench-Isolated SOI CMOS Technology (Wednesday May. 24, 2006)
  X-FAB Semiconductor Foundries AG, one of the world's leading
  
  
• Tower Semiconductor Begins Production of Metro Wi-Fi Baseband Controller for Wavion (Wednesday May. 24, 2006)
  Tower Semiconductor Ltd., a pure-play independent specialty wafer foundry (NASDAQ: TSEM; TASE: TSEM) today announced production start of the IC00100 Metro Wi-Fi Baseband controller for Wavion, Ltd., a developer and supplier of a new generation of metro Wi
  
  
• Key ASIC and Silterra Partner to Deliver Design-to-Manufacture Services Targeted for Mobile and Consumer Electronics Markets (Tuesday May. 23, 2006)
  Key ASIC and Silterra today announced a partnership to offer streamlined design-to-manufacture services for ASICs in the mobile and consumer electronics markets
  
  
• Tower Announces Plan to Ramp Up Capacity of Fab 2 by Approximately 50% (Thursday May. 18, 2006)
  Tower Semiconductor Ltd., a pure-play independent specialty foundry, announced today that the Company's board of directors approved the Company's plan to accelerate the ramp up of Fab 2 by approximately 50%
  
  
• TSMC 65-Nanometer Process Moves to Volume Production (Wednesday May. 17, 2006)
  Taiwan Semiconductor Manufacturing Company today told a packed audience at its 2006 Technology Symposium that the company has fully qualified its 65-nanometer (nm) low power process technology
  
  
• Grace Semiconductor Joins ARM Foundry Program; Grace Licenses ARM7TDMI and ARM926EJ Processors (Tuesday May. 16, 2006)
  Grace Semiconductor Manufacturing Corporation, a leading foundry in integrated circuit (IC) fabrication, and ARM today announced that Grace has joined the ARM® Foundry Program by licensing the ARM7TDMI® and ARM926EJ(tm) processors, as well as the associat
  
  
• Chipnuts and SMIC to Jointly Offer C626 Multimedia Chip For Mobile Phones (Tuesday May. 16, 2006)
  Chipnuts Technology and SMIC jointly announced today that Chipnuts' C626 chip, a multimedia chip for mobile phones, has successfully entered commercial production at SMIC
  
  
• TSMC Unveils First 65-Nanometer Data-Driven DFM Design Ecosystem (Monday May. 15, 2006)
  Taiwan Semiconductor Manufacturing Company today unveils an extensive 65nm DFM Compliance Design Support Ecosystem that's driven by a manufacturing-based unified data format to channel design-for-manufacturing (DFM) capabilities through selected electroni
  
  
• Tower Semiconductor plans capacity investment (Thursday May. 11, 2006)
  Foundry chip maker Tower Semiconductor Ltd. is looking to raise money to invest in equipment for Fab 2, its 200-mm wafer fab and is considering its strategy for 90-nm production.
  
  
• TSMC April 2006 Sales Report (Wednesday May. 10, 2006)
  On the unconsolidated basis, April 2006 net sales increased 0.2 percent over March 2006 and grew 43.7 percent year-over-year
  
  
• Infineon to expand foundry services (Tuesday May. 09, 2006)
  After spinning off its memory unit, Germany’s Infineon Technologies AG said that it plans to expand its silicon foundry services
  
  
• Mosis offers IBM 90-nm process on MPW (Tuesday May. 09, 2006)
  The Mosis integrated circuit fabrication service has begun offering multi-project wafer (MPW) runs on 90-nanometer process technologies from IBM, according to Paul Double, managing director of EDA Solutions Ltd.
  
  
• SMIC and Aurora Systems in Volume Production of Digital LCOS Panel Chips (Monday May. 08, 2006)
  SMIC and Aurora Systems, Inc. announced that Aurora's digital LCOS panel chips have successfully entered into volume commercial production at SMIC.
  
  
• SMIC reports 2006 first quarter results (Friday Apr. 28, 2006)
  SMIC today announced its consolidated results of operations for the three months ended March 31, 2006. Sales increased 5.4% in the first quarter of 2006 to $351.1 million from $333.1 million in the prior quarter.
  
  
• TSMC Reports First Quarter EPS of NT$1.32 (Thursday Apr. 27, 2006)
  TSMC today announced, on an unconsolidated basis, revenue of NT$77.29 billion, net income of NT$32.61 billion, and fully diluted earnings per share of NT$1.32 (US$0.20 per ADS unit) for the first quarter ended March 31, 2006
  
  
• Chartered and Microsoft Sign 65-Nanometer Manufacturing Agreement for Xbox 360 CPU (Friday Apr. 21, 2006)
  Chartered Semiconductor has signed an agreement with Microsoft for the manufacturing of CPU products -- using 65-nanometer (nm) Silicon-on-Insulator (SOI) semiconductor technology -- for Microsoft's Xbox 360 game consoles
  
  
• Chinese startup foundry licenses Toshiba technology (Friday Apr. 21, 2006)
  Startup IC Spectrum Co. Ltd. has inked a deal with Toshiba Corp. for the transfer of 0.35-micron manufacturing process technology, so that it can begin foundry work. The process will be used in the company’s 200-mm wafer fab currently under construction i
  
  
• Chartered Expands Foundry Market Access to IBM's 90nm SOI Technology (Thursday Apr. 20, 2006)
  Chartered Semiconductor Manufacturing (Nasdaq: CHRT and SGX-ST: Chartered), one of the world's top dedicated semiconductor foundries, announced today that it has licensed the 90-nanometer (nm) Silicon-on-Insulator* (SOI) technology from IBM
  
  
• UMC Delivers New SONOS Memory to Solid State System Co. (Wednesday Apr. 19, 2006)
  UMC, a leading global semiconductor foundry, today announced the delivery of a new SONOS memory to Solid State System Co. This new memory adopts advanced SONOS dielectric storage technology, effectively enhancing program speed as compared to conventional
  
  
• Kevin Bligh Joins Silterra as Vice President of Worldwide Sales and Marketing; Industry Veteran to Focus on Growing Silterra's Customer Base (Monday Apr. 17, 2006)
  Kevin Bligh Joins Silterra as Vice President of Worldwide Sales and Marketing; Industry Veteran to Focus on Growing Silterra's Customer Base