Foundries News

• Tower Semiconductor Ltd. Pre-Announces Fourth Quarter and 2005 Revenues (Wednesday Jan. 04, 2006)
  Revenues for the fourth quarter of 2005 are expected to be approximately $31 million, which represents an increase of approximately 50% over revenues for the third quarter of 2005. Revenues for the year ended December 31, 2005 are expected to be approxima
  
  
• Tower Semiconductor Begins Production of Zoran's Demodulator Chip for Digital Broadcast Televisions and Set-Top Boxes (Tuesday Jan. 03, 2006)
  Tightly Coupled Design and Manufacturing Achieve Superior Performance
  
  
• Hitachi, Toshiba and Renesas Start Joint Study on Semiconductor Foundry Business (Wednesday Dec. 28, 2005)
  Hitachi, Ltd., Toshiba Corporation and Renesas Technology Corp. today announced that they have initiated a joint study on the feasibility of an independent semiconductor foundry business offering advanced fabrication processes to which each of the compani
  
  
• Philips announces internal transfer of TSMC shares (Wednesday Dec. 28, 2005)
  Royal Philips Electronics (NYSE: PHG, AEX: PHI) announced today that it has acquired from its fully owned subsidiary Philips Electronics Industries (Taiwan) Ltd (PEI) approximately 1,928 million shares of Taiwan Semiconductor Manufacturing Company Ltd (TS
  
  
• SMIC Announces LDO Linear Voltage Regulator IP Series (Wednesday Dec. 21, 2005)
  For 0.13um to 0.35um Logic/Mixed-Signal, and 0.18um & 0.35um EEPROM CMOS process technologies
  
  
• Grace Semiconductor Expands Access to 0.18- and 0.13-Micron Processes With Adoption of ARM Physical IP (Tuesday Dec. 20, 2005)
  Agreement Gives ARM Users Worldwide Access to Grace Technology-Based Physical IP Via the ARM Website at No Charge
  
  
• SMIC Obtains Euro 85 Million Long Term Credit Facility (Wednesday Dec. 14, 2005)
  The proceeds from the facility are to be used to purchase lithography equipment to support the expansion of its manufacturing facilities
  
  
• TSMC November 2005 Sales Set Record High (Thursday Dec. 08, 2005)
  TSMC (TAIEX: 2330, NYSE: TSM) today announced that net sales for November 2005 reached a record high of NT$27,518 million, and that revenues for January through November 2005 were NT$237,172 million
  
  
• UMC Develops Ultimate Spacer Process to Enhance MOSFET Device Performance for 65nm and Beyond (Wednesday Dec. 07, 2005)
  UMC Develops Ultimate Spacer Process to Enhance MOSFET Device Performance for 65nm and Beyond
  
  
• SMIC starts volume production of 0.18 um Color-VGA CMOS Image Sensor (CIS) wafers (Wednesday Dec. 07, 2005)
  SMIC starts volume production of 0.18 um Color-VGA CMOS Image Sensor (CIS) wafers
  
  
• SMIC Announces Availability of 0.18um EEPROM Process Technology and EEPROM IP Design Platform (Friday Dec. 02, 2005)
  To provide a total package solution, SMIC further announced that its internal Design Service Division has developed an embedded EEPROM IP design platform based on this process technology
  
  
• Synopsys and UMC Partner on Low Power 90-nm Reference Design Flow to Deliver Faster Time to SoC Success (Monday Nov. 21, 2005)
  Reference Design Flow Features Low Power Management and Design-for-Manufacturing Automation Capabilities
  
  
• Infineon and Chartered Expand Development Collaboration with 65nm Manufacturing Agreement (Thursday Nov. 17, 2005)
  Infineon will have Chartered manufacture low-power mobile-phone products, with initial prototypes expected in the first quarter of 2006 and production scheduled to begin in the fourth quarter of 2006
  
  
• SMIC starts volume production of LCOS backplane wafers for 1080P Rear Projection HDTV market (Friday Nov. 11, 2005)
  In a strategic, continuous move to expand its Silicon foundry business into the booming rear projection HDTV market, Semiconductor Manufacturing International Corporation (NYSE:SMI) today announced volume production and shipment of 1080P LCOS backplane wa
  
  
• UMC Brings Comprehensive Reference Design Flow to 90nm SoC Designers (Wednesday Nov. 09, 2005)
  RTL-to-GDSII flow addresses signal and power integrity while incorporating DFM solutions to help customers streamline their path to silicon
  
  
• TSMC October 2005 Sales Set Record High (Wednesday Nov. 09, 2005)
  TSMC today announced that net sales for October 2005 reached a record high of NT$26,227 million, and that revenues for January through October 2005 were NT$209,654 million
  
  
• Atmel Announces 0.18um RF CMOS Foundry Process for Low Volume Applications (Wednesday Nov. 09, 2005)
  With Optional EEPROM, On-Chip Aluminum Inductors, 5 or 6 Metal Layers
  
  
• Winbond Electronics Corporation Announces Monthly Revenue Results for October 2005 (Monday Nov. 07, 2005)
  Revenue for the month was NT$2.592 billion, a decrease of 3.97 percent, when compared to NT$2.699 billion in the previous month.
  
  
• Tower Semiconductor Begins Production of Biomorphic's 2.0 and 1.3-Megapixel CMOS Image Sensors for Cell Phones (Tuesday Nov. 01, 2005)
  Tower Technologies Result in Superior Sensor Capabilities for Camera-Enabled Devices
  
  
• SMIC reports 2005 third quarter results (Friday Oct. 28, 2005)
  Net loss decreased to $26.1 million in the third quarter of 2005 compared to a net loss of $40.4 million in the second quarter of 2005
  
  
• TSMC Reports 18% Sequential Increase in Third Quarter Revenue with EPS of NT$0.99 (Thursday Oct. 27, 2005)
  Third quarter revenue reached NT$69.26 billion while net income and fully diluted earnings per share came to NT$24.49 billion and NT$0.99 per share (US$0.15 per ADS unit), respectively
  
  
• UMC Reports 2005 Third Quarter Results: Rebound in ASP, Wafer Shipments Expected to Drive Operating Profit in 4Q05 (Wednesday Oct. 26, 2005)
  Wafer shipments increased 17.6% sequentially to 741 thousand 8-inch equivalent wafers
  
  
• Winbond Electronics Corporation Signed a NT$ 15 Billion Syndicated Loan Agreement with Bank of Taiwan and Other 21 Financial Institutions (Monday Oct. 24, 2005)
  To meet the mid- and long- term capital demands for its 12-inch fab expansion plan in the Central Taiwan Science Park, Winbond Electronics Corporation today announced that it has signed a NT$ 15 billion five-year syndicated loan agreement
  
  
• SMIC and CYIT Successfully Manufacture 0.13um 3G Handset Chips (Wednesday Oct. 12, 2005)
  While most domestic design companies are developing 3G handsets based on 0.18um manufacturing, the 0.13um process is the most advanced technology currently being used in China to manufacture handset chips
  
  
• TSMC September 2005 Sales Set Record High (Friday Oct. 07, 2005)
  On a year-over-year basis, net sales for September 2005 increased 8.9 percent
  
  
• Jazz Semiconductor Delivers Next-Generation 0.13 Micron Process Platform Focused on Advanced Analog and RF Systems on Chip (Wednesday Oct. 05, 2005)
  Jazz Process Combines Perfect Balance of Cost and Performance with 0.13 Micron Front-End and Aluminum-Based Back-End
  
  
• TSMC Launches Foundry Industry's First 65nm Prototype Run (Wednesday Oct. 05, 2005)
  CyberShuttle(SM) Features Range of Power and Performance Options
  
  
• UMC's Hu envisions new model for foundry business (Tuesday Oct. 04, 2005)
  United Microelectronics Corp. CEO Jackson Hu offered an entirely different vision for future foundry companies.
  
  
• TSMC Announces Production-Ready 90nm X Architecture (Tuesday Oct. 04, 2005)
  Cadence X Architecture Design Solution Targets Nexsys(SM) Process
  
  
• Tower Semiconductor Supplies Security Device for SanDisk's TrustedFlash SD-Based Memory Cards (Tuesday Sep. 27, 2005)
  Features on Controller Provide Security for Content Loading, Commerce and Other Applications