Foundries News

• Silicon foundry market in flux as market stalls (Wednesday Aug. 18, 2004)
  Silicon foundry market in flux as market stalls
  
  
• UMC First Foundry to Introduce 0.18um 32 Volt High Voltage Process (Wednesday Aug. 18, 2004)
  UMC First Foundry to Introduce 0.18um 32 Volt High Voltage Process
  
  
• LogicVision Provides UMC Customers with Enhanced Wafer Yield Solution (Monday Aug. 16, 2004)
  LogicVision Provides UMC Customers with Enhanced Wafer Yield Solution
  
  
• Top Ten 2004 Pure-Play Foundry Ranking Released; "Big 3" become "Big 4" as China-based SMIC joins ranks (Tuesday Aug. 10, 2004)
  Top Ten 2004 Pure-Play Foundry Ranking Released; "Big 3" become "Big 4" as China-based SMIC joins ranks
  
  
• TSMC July Sales Set Record High (Monday Aug. 09, 2004)
  TSMC July Sales Set Record High
  
  
• UMC Introduces Enhanced Prototyping Program for its Most Advanced Production Technologies (Monday Aug. 02, 2004)
  UMC Introduces Enhanced Prototyping Program for its Most Advanced Production Technologies
  
  
• IBM introduces chip morphing technology (Friday Jul. 30, 2004)
  IBM introduces chip morphing technology
  
  
• TSMC 2004 Second Quarter Report - 25% Increase in Sequential EPS (Thursday Jul. 29, 2004)
  TSMC 2004 Second Quarter Report 25% Increase in Sequential EPS
  
  
• 1st Silicon Begins Ramping 0.25um Embedded Flash Technology (Wednesday Jul. 28, 2004)
  1st Silicon Begins Ramping 0.25um Embedded Flash Technology
  
  
• Xilinx Announces Investment In He Jian Technology Co. (Tuesday Jul. 27, 2004)
  Xilinx Announces Investment In He Jian Technology Co.
  
  
• austriamicrosystems is the first to fully comply with Mixed-Signal/RF Process Design KIT guidelines from FSA (Friday Jul. 23, 2004)
  austriamicrosystems is the first to fully comply with Mixed-Signal/RF Process Design KIT guidelines from FSA
  
  
• Tower Semiconductor Selects Artisan's Digital and Mixed-Signal IP Platform for 0.13-Micron Process (Wednesday Jul. 21, 2004)
  Tower Semiconductor Selects Artisan's Digital and Mixed-Signal IP Platform for 0.13-Micron Process
  
  
• Tower Semiconductor selects Virage Logic's Semiconductor IP for 0.13-micron offering (Tuesday Jul. 20, 2004)
  Tower Semiconductor selects Virage Logic's Semiconductor IP for 0.13-micron offering
  
  
• VeriSilicon and Magma Team to Deliver "Magma-Ready" Libraries for China-Based Wafer Foundries (Monday Jul. 19, 2004)
  VeriSilicon and Magma Team to Deliver "Magma-Ready" Libraries for China-Based Wafer Foundries
  
  
• Chartered and China's IC Design Incubation and Services Centers Collaborate to Nurture Startups' Growth (Thursday Jul. 15, 2004)
  Chartered and China's IC Design Incubation and Services Centers Collaborate to Nurture Startups' Growth
  
  
• Tower Semiconductor Moves Forward On 0.13-micron Technology with Toolset Purchase (Tuesday Jul. 13, 2004)
  Tower Semiconductor Moves Forward On 0.13-micron Technology with Toolset Purchase
  
  
• TSMC June Sales Set Record High (Thursday Jul. 08, 2004)
  TSMC June Sales Set Record High
  
  
• Mentor Graphics Offers Technology Design Kit and Design Flow for SMIC 0.18-micron Mixed-Signal Process (Wednesday Jul. 07, 2004)
  Mentor Graphics Offers Technology Design Kit and Design Flow for SMIC 0.18-micron Mixed-Signal Process
  
  
• NEC merges process, SoC units (Friday Jul. 02, 2004)
  NEC merges process, SoC units
  
  
• Development of Multi-Level-Interconnect Technologies for High-Speed/Low-Power Consumption 2nd Generation 65nm Node VLSIs (Friday Jun. 18, 2004)
  Development of Multi-Level-Interconnect Technologies for High-Speed/Low-Power Consumption 2nd Generation 65nm Node VLSIs
  
  
• Tower Semiconductor Ltd. sponsors the Foundry Corner on D&R Web portal to enhance their IP portfolio accessibility (Wednesday Jun. 16, 2004)
  Tower Semiconductor Ltd. sponsors the Foundry Corner on D&R Web portal to enhance their IP portfolio accessibility
  
  
• Crolles alliance rolls 65-nm process (Tuesday Jun. 15, 2004)
  Crolles alliance rolls 65-nm process
  
  
• SOI mobility harmed by scattering, Toshiba researchers report (Monday Jun. 14, 2004)
  SOI mobility harmed by scattering, Toshiba researchers report
  
  
• XILINX and UMC Develop Industry's First FPGAs to Utilize Triple-Oxide 90nm Technology (Monday Jun. 14, 2004)
  XILINX and UMC Develop Industry's First FPGAs to Utilize Triple-Oxide 90nm Technology
  
  
• TSMC's Fab 6 Production Exceeds 70,000 8-inch Wafers per Month (Friday Jun. 11, 2004)
  TSMC's Fab 6 Production Exceeds 70,000 8-inch Wafers per Month
  
  
• TSMC May Sales Set Record High (Wednesday Jun. 09, 2004)
  TSMC May Sales Set Record High
  
  
• IBM introduces advanced design methodology to increase performance and reduce power consumption in custom chips (Wednesday Jun. 09, 2004)
  IBM introduces advanced design methodology to increase performance and reduce power consumption in custom chips
  
  
• SMIC receives 300-mm wafer equipment for Fab 4 (Wednesday Jun. 02, 2004)
  SMIC receives 300-mm wafer equipment for Fab 4
  
  
• UMC Shareholders Approve NT$0.8 Stock Dividend for Fiscal Year 2003 (Tuesday Jun. 01, 2004)
  UMC Shareholders Approve NT$0.8 Stock Dividend for Fiscal Year 2003
  
  
• UMC Announces a Device Technique that Enhances Silicon-on-Insulator (SOI) Transistor Performance (Wednesday May. 26, 2004)
  UMC Announces a Device Technique that Enhances Silicon-on-Insulator (SOI) Transistor Performance