Foundries News

• Tower Semiconductor Joins ARM Foundry Program (Wednesday Nov. 13, 2002)
  Tower Semiconductor Joins ARM Foundry Program
  
  
• eSilicon Licenses ARM Technology Through ARM Foundry Program (Tuesday Nov. 12, 2002)
  eSilicon Licenses ARM Technology Through ARM Foundry Program
  
  
• NEC Electronics Launches System LSI Platform for 90-Nanometer System LSI Process Technology (Monday Nov. 11, 2002)
  NEC Electronics Launches System LSI Platform for 90-Nanometer System LSI Process Technology
  
  
• 1st Silicon Secures US$614 Million in Equity, Credit (Thursday Oct. 03, 2002)
  1st Silicon Secures US$614 Million in Equity, Credit
  
  
• ARM and SMIC Collaborate To Develop ARM Core-based Test Chip For China (Wednesday Sep. 25, 2002)
  ARM and SMIC Collaborate To Develop ARM Core-based Test Chip For China
  
  
• Barcelona Design to Offer Analog IP for 90 nm Technology Node (Tuesday Sep. 24, 2002)
  Barcelona Design to Offer Analog IP for 90 nm Technology Node
  
  
• 'Smart Power' SOC Solutions up to 80V Enabled by AMI Semiconductor's I3T Technology (Monday Sep. 23, 2002)
  'Smart Power' SOC Solutions up to 80V Enabled by AMI Semiconductor's I3T Technology
  
  
• Tower Semiconductor Licenses 0.13-micron CMOS Technology from Motorola (Monday Sep. 23, 2002)
  Tower Semiconductor Licenses 0.13-micron CMOS Technology from Motorola
  
  
• TSMC First Foundry to Offer Manufacturing of SuperH, Inc.'s SH-5 Core (Monday Sep. 16, 2002)
  TSMC First Foundry to Offer Manufacturing of SuperH, Inc.'s SH-5 Core
  
  
• TSMC Monthly Sales Report – August 2002 (Monday Sep. 09, 2002)
  TSMC Monthly Sales Report – August 2002
  
  
• Oki Electric and UMC/UMCJ Broaden Semiconductor Business Partnership (Wednesday Sep. 04, 2002)
  Oki Electric and UMC / UMCJ Broaden Semiconductor Business Partnership
  
  
• Chartered reiterates earnings guidance for third quarter 2002 (Monday Sep. 02, 2002)
  Chartered reiterates earnings guidance for third quarter 2002
  
  
• TI reportedly to forge foundry deal with China's SMIC (Thursday Aug. 29, 2002)
  TI reportedly to forge foundry deal with China's SMIC
  
  
• TSMC signs letter of intent for China fab (Thursday Aug. 29, 2002)
  TSMC signs letter of intent for China fab
  
  
• Chartered will need funds within nine months, say analysts (Wednesday Aug. 28, 2002)
  Chartered will need funds within nine months, say analysts
  
  
• China's SMIC adds IP for 0.18-micron foundry push (Wednesday Aug. 07, 2002)
  China's SMIC adds IP for 0.18-micron foundry push
  
  
• Chartered battles to stay in foundry race (Friday Aug. 02, 2002)
  Chartered battles to stay in foundry race
  
  
• 1st Silicon places $100 million tool order in 0.13-micron push (Thursday Jul. 18, 2002)
  1st Silicon places $100 million tool order in 0.13-micron push
  
  
• Chartered expects slower second half growth (Thursday Jul. 18, 2002)
  Chartered expects slower second half growth
  
  
• Chartered aims to ride ARM license to SoC (Wednesday Jul. 17, 2002)
  Chartered aims to ride ARM license to SoC
  
  
• STMicro, UMC forge technology alliance (Wednesday Jul. 17, 2002)
  STMicro, UMC forge technology alliance
  
  
• Motorola makes TSMC its foremost foundry (Wednesday Jun. 26, 2002)
  Motorola makes TSMC its foremost foundry
  
  
• Chartered names new chief executive (Tuesday Jun. 25, 2002)
  Chartered names new chief executive
  
  
• Chartered Joins ARM Foundry Program For Multi-core Manufacturing (Monday Jun. 24, 2002)
  Chartered Joins ARM Foundry Program For Multi-core Manufacturing
  
  
• TSMC 0.13-Micron Copper Process Delivers Altera's Stratix Devices In Record Time (Monday Jun. 17, 2002)
  TSMC 0.13-Micron Copper Process Delivers Altera's Stratix Devices In Record Time
  
  
• austriamicrosystems launches new 0.35um Mixed Signal Design Kits for Foundry Customers (Tuesday Jun. 11, 2002)
  austriamicrosystems launches new 0.35um Mixed Signal Design Kits for Foundry Customers
  
  
• IBM sets new standard for custom chip designs (Monday Jun. 10, 2002)
  IBM sets new standard for custom chip designs
  
  
• Wafer Stacking Technology Promises Faster, Denser System-On-a-Chip (SOC) (Monday Jun. 10, 2002)
  Wafer Stacking Technology Promises Faster, Denser System-On-a-Chip (SOC)
  
  
• Chartered signs deal with analog IP house Unive for SoC designs (Monday Jun. 10, 2002)
  Chartered signs deal with analog IP house Unive for SoC designs
  
  
• UMC rolls out 90-nm process, says pilot production due in 1Q 2003 (Friday Jun. 07, 2002)
  UMC rolls out 90-nm process, says pilot production due in 1Q 2003