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IP / SOC Products News

• Achronix Pushes the Boundaries of Networking with 400 GbE and PCIe Gen 5.0 for SmartNICs (Tuesday Jun. 13, 2023)
  Achronix Semiconductor Corporation, a global leader in high-performance FPGAs and embedded FPGA (eFPGA) IP, is thrilled to announce that the Achronix Network Infrastructure Code (ANIC) includes 400 Gigabit Ethernet (GbE) connectivity.
  
  
• Arasan announces the Industry's First CAN FD Light Bus Controller IP (Thursday Jun. 08, 2023)
  Arasan, a leading provider of semiconductor IP for all things mobile, including automobiles announces the Industry's First CAN FD Light IP Compliant to the CiA 604-1 CAN FD Light specification
  
  
• VeriSilicon Obtained Bluetooth 5.3 Certification for Its Complete Bluetooth Low Energy Solution (Tuesday Jun. 06, 2023)
  VeriSilicon (688521.SH) today announced its complete Bluetooth Low Energy (BLE) solution has passed the Bluetooth 5.3 certification issued by Bluetooth SIG. This complete BLE solution integrates VeriSilicon’s self-developed radio frequency (RF) IP, baseband IP, and software protocol stack, offering a one-stop solution compliant with the Bluetooth Core Specification Version 5.3.
  
  
• Agile Analog launches first complete RISC-V analog IP subsystem at RISC-V Summit Europe (Monday Jun. 05, 2023)
  The initial subsystem includes all the analog IP required for a typical battery powered IoT system, including a power management unit (PMU), a sleep management unit (SMU), and data converters. This unique, process agnostic, customizable and digitally wrapped analog IP subsystem will help solve many of the issues that System on Chip (SoC) designers currently encounter, as it pairs with a RISC-V core to form a complete solution.
  
  
• Semidynamics announces largest, fully customisable Vector Unit in the RISC-V market, delivering up to 2048b of computation per cycle for unprecedented data handling (Thursday Jun. 01, 2023)
  Semidynamics has announced its new, entirely customisable Vector Unit to go with its innovative range of fully customisable 64-bit RISC-V cores. The Vector Unit is totally compliant with the RISC-V Vector Specification 1.0 with many, additional, customisable features to provide enhanced data handling capabilities.
  
  
• Xiphera extends its Transport Layer Security product family (Thursday Jun. 01, 2023)
  Xiphera extends its Transport Layer Security (TLS) product family with new client and server IP cores for FPGA and ASIC circuits, introducing TLS 1.3 server side functionalities and wider feature coverage of TLS 1.3.
  
  
• New Arm Total Compute Solutions enable a mobile future built on Arm (Monday May. 29, 2023)
  Today we are announcing Arm Total Compute Solutions 2023 (TCS23), which will be the platform for mobile computing, offering our best ever premium solution for smartphones. TCS23 delivers a complete package of the latest IP designed and optimized for specific workloads to work seamlessly together as a complete system.
  
  
• Nanusens announces that it can now create ASICs with embedded sensors (Thursday May. 25, 2023)
  Now both sensor and its control circuit can be shrunk simultaneously as IP blocks to required CMOS process node to create ASICs with integrated sensors
  
  
• Blue Cheetah Demonstrates Industry Leading Silicon-Proven Die-to-Die Interconnect Solution for Chiplets (Wednesday May. 24, 2023)
  Blue Cheetah Analog Design, the leader in rapidly customized die-to-die (D2D) interconnect IP solutions for chiplets, announced its latest successful silicon bring-up of its advanced 2-16 Gbps BlueLynx D2D interconnect IP in a 12nm test chip.
  
  
• Imagination launches IMG CXM, the smallest GPU to bring effortless user interfaces into homes (Tuesday May. 23, 2023)
  Imagination Technologies is bringing seamless visual experiences to cost-sensitive consumer devices with the new IMG CXM GPU range which includes the smallest GPU to support HDR user interfaces natively.
  
  
• K-Best MIMO Decoder IP Core Available For Immediate Integration From Global IP Core (Friday May. 19, 2023)
  The MIMO Decoder accepts two independent input streams, and the channel estimation matrix. The inputs to the MIMO Decoder are the estimated channel matrix and the received vector of symbols.
  
  
• SiliconAlly: GigaPHY Testchip is back from Fabrication and Packaging (Thursday May. 18, 2023)
  A long time of waiting ended this week for Siliconally. We got our test chip, called GigaPHY, back from fabrication and packaging.
  
  
• proteanTecs' Die-to Die Interconnect Monitoring IP Passes TSMC9000 Pre-Silicon Assessment (Thursday May. 18, 2023)
  proteanTecs, a global leader of deep data analytics for advanced electronics, announced today that the company’s die-to-die interconnect monitoring agents passed the pre-silicon IP assessment stage in the TSMC9000 quality program.
  
  
• Arasan Announces immediate availability of its SUREBOOT™ Total xSPI PHY IP (Thursday May. 18, 2023)
  Arasan Chip Systems, a leading provider of semiconductor IP for mobile and automobile SoCs, today announced the immediate availability of its SUREBOOT™ Total xSPI IP Solution which now includes the xSPI PHY IP.
  
  
• Arasan announces the immediate availability of its 2nd Generation MIPI D-PHY for GlobalFoundries 22nm SoC Designs (Wednesday May. 17, 2023)
  Arasan Chip Systems announces the immediate availability of its 2nd generation MIPI D-PHY IP products supporting MIPI D-PHY v1.1 at upto 1.5gbps and MIPI D-PHY v1.2 supporting speeds of upto 2.5gbps for GlobalFoundries 22nm SoC designs redesigned for ultra low power consumption and area.
  
  
• Andes Technology Announces The New Product Line, AndesAIRE™, Ultimately Efficient AI/ML Solutions For Edge And End-Point Inference (Monday May. 15, 2023)
  Andes Technology today announced the launch of new product line, AndesAIRE™ or Andes AI Runs Everywhere, ultimately efficient solutions designed for edge and end-point inference, including the first generation of AI/ML hardware accelerator intellectual property (IP), the AndesAIRE™ AnDLA™ I350 (Andes Deep Learning Accelerator), and the neural network software tools and runtimes, the AndesAIRE™ NN SDK.
  
  
• Creonic Introduces 25 Gbit/s LDPC IP Core Solution for ITU G.9804.2 PON Standard (Wednesday May. 10, 2023)
  Creonic GmbH, a leading IP core provider in the field of satellite communications, today introduced its latest LDPC forward error correction solution for passive optical networks (PON).
  
  
• NEO Semiconductor Launches Ground-Breaking 3D X-DRAM Technology, A Game Changer in the Memory Industry (Thursday May. 04, 2023)
  NEO Semiconductor, a leading developer of innovative technologies for 3D NAND flash and DRAM memory, today announced the launch of its ground-breaking technology, 3D X-DRAM™.
  
  
• M31 demonstrates high-speed interface IP development achievements on TSMC's 7nm & 5nm process technologies (Thursday Apr. 27, 2023)
  M31 Technology Corporation (M31), a global professional silicon intellectual property (IP) provider, announced that USB3.2 PHY IP has passed silicon validation on TSMC's 7nm process. In addition, M31's MIPI C/D-PHY Combo IP was already taped out on TSMC's 5nm process.
  
  
• Xiphera adds lightweight cryptography to its stream cipher portfolio (Thursday Apr. 27, 2023)
  Xiphera releases XIP2201B, an IP core which supports the Ascon lightweight cryptographic suite. This IP core is especially useful for small devices used in Industrial IoT.
  
  
• Cadence Collaborates with GUC on AI, HPC and Networking in Advanced Packaging Technologies (Thursday Apr. 27, 2023)
  Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that the Cadence® 112G-LR SerDes is silicon proven on the HBM3/GLink/CoWoS platform from Global Unichip Corp. (GUC).
  
  
• Creonic Introduces FEC IP Core Solution for SDA Free-Space Optical OCT V3.0 Standard (Thursday Apr. 27, 2023)
  Creonic today revealed its latest solution for free-space optical (FSO) communications with immediate availability. The Space Development Agency (SDA) introduced the Optical Communications Terminal (OCT) Standard V3.0 with the intention to enable interoperability between optical communication terminals where at least one endpoint is space-based.
  
  
• Alphawave Semi Showcases 3nm Connectivity Solutions and Chiplet-Enabled Platforms for High Performance Data Center Applications (Wednesday Apr. 26, 2023)
  Alphawave Semi (LSE: AWE), a global leader in high-speed connectivity for the world’s technology infrastructure, today announced the bring-up of its first connectivity silicon platform on TSMC’s most advanced 3nm process with its ZeusCORE Extra-Long-Reach (XLR) 1-112Gbps NRZ/PAM4 serialiser-deserialiser (“SerDes”) IP.
  
  
• Agile Analog launches innovative digitally wrapped analog IP subsystems (Tuesday Apr. 25, 2023)
  Agile Analog, the customizable analog IP company, has launched its first range of analog subsystems, covering power management, PVT sensing, and sleep management. These innovative, digitally wrapped subsystems significantly reduce the effort required to integrate multiple analog IPs into any ASIC by allowing the IP to be dropped straight into a digital design flow and connected via a standard peripheral bus, such as AMBA APB.
  
  
• Attopsemi's Revolutionary I-fuse® OTP Silicon-Proven on FinFET Technology (Tuesday Apr. 25, 2023)
  Attopsemi, a provider of cutting-edge One-Time Programmable (OTP) IP solutions, is excited to announce successful silicon proven of I-fuse® to 12nm FinFET processes using metal as fuse material.
  
  
• Cadence Tapes Out 16G UCIe Advanced Package IP on TSMC's N3E Process Technology (Tuesday Apr. 25, 2023)
  Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced the tapeout of Cadence® 16G UCIe™ 2.5D advanced package IP on TSMC’s 3nm (N3E) process technology.
  
  
• Cadence Accelerates Hyperscale SoC Design with Next-Generation 112G Extended Long-Reach SerDes IP on TSMC's N4P Process (Tuesday Apr. 25, 2023)
  Cadence Design Systems, Inc. (Nasdaq: CDNS) today unveiled its 112G Extended Long-Reach (112G-ELR) SerDes IP on TSMC’s N4P process for hyperscale ASICs, artificial intelligence/machine learning (AI/ML) accelerators, switch fabric system-on-chips (SoCs) and 5G wireless infrastructure.
  
  
• Rapid Silicon Launches Vega eFPGA IP for Programmable Solutions (Tuesday Apr. 25, 2023)
  Rapid Silicon, a provider of AI and intelligent edge-focused FPGAs based on open-source technology, today announced the launch of its Vega eFPGA IP.
  
  
• Flex Logix Announces InferX™ High Performance IP for DSP and AI Inference (Monday Apr. 24, 2023)
  InferX joins EFLX® eFPGA as Flex Logix’s second IP offering. It can be used by device manufacturers and systems companies that want the performance of a DSP-FPGA or a AI-GPU in their SoC, but at a fraction of the cost and power
  
  
• Dilithium core complements Xiphera's xQlave® family of post-quantum cryptography (Monday Apr. 24, 2023)
  Xiphera announces an implementation of CRYSTALS-Dilithium, a new product in the xQlave® family of quantum-secure IP cores. CRYSTALS-Dilithium algorithm was selected as the primary digital signature algorithm for Post-Quantum Cryptography (PQC) by the US National Institute of Standards and Technology (NIST).