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IP / SOC Products News

• Fujitsu/Fujitsu VLSI adopts Legend Design Technology's CharFlo-Memory! Toolset for Memory Characterization (Monday Dec. 08, 2003)
  Fujitsu/Fujitsu VLSI adopts Legend Design Technology's CharFlo-Memory! Toolset for Memory Characterization
  
  
• DCM Technologies announces availability of IEEE802.11 Mulitmode MAC on the Accelerated Technology Nucleus Plus Kernel (Thursday Dec. 04, 2003)
  DCM Technologies announces availability of IEEE802.11 Mulitmode MAC on the Accelerated Technology Nucleus Plus Kernel
  
  
• NewLogic Releases its Embeddable Wireless LAN 802.11g Modem IP Core (Wednesday Dec. 03, 2003)
  NewLogic Releases its Embeddable Wireless LAN 802.11g Modem IP Core
  
  
• New ARM9E Family Core Provides Unrivalled Low-Power Performance (Wednesday Dec. 03, 2003)
  New ARM9E Family Core Provides Unrivalled Low-Power Performance
  
  
• TTPCom delivers 802.11 Wireless Multimedia Extensions (Tuesday Dec. 02, 2003)
  TTPCom delivers 802.11 Wireless Multimedia Extensions
  
  
• ARC International Introduces the ARC 600 Development Tool Suite (Monday Dec. 01, 2003)
  ARC International Introduces the ARC 600 Development Tool Suite
  
  
• ARC International Introduces the ARC 600 Digital Audio Platform, Optimized for System Area and Power (Monday Dec. 01, 2003)
  ARC International Introduces the ARC 600 Digital Audio Platform, Optimized for System Area and Power
  
  
• New IPs From ChipIdea Achieve Mass Production Status (Wednesday Nov. 26, 2003)
  New IPs From ChipIdea Achieve Mass Production Status
  
  
• Wipro Technologies launches its IEEE 802.11g IP solution for wireless connectivity (Tuesday Nov. 25, 2003)
  Wipro Technologies launches its IEEE 802.11g IP solution for wireless connectivity
  
  
• MoSys Ports 1T-SRAM-Q Technology to NEC Electronics' 90-Nanometer Logic Process; Initial Silicon Verification Achieved for 1T-SRAM-R, in Fabrication for 1T-SRAM-Q (Monday Nov. 24, 2003)
  MoSys Ports 1T-SRAM-Q Technology to NEC Electronics' 90-Nanometer Logic Process; Initial Silicon Verification Achieved for 1T-SRAM-R, in Fabrication for 1T-SRAM-Q
  
  
• ARC International Receives Second Full-Speed OTG Certification from the USB-IF (Monday Nov. 24, 2003)
  ARC International Receives Second Full-Speed OTG Certification from the USB-IF
  
  
• Ceva preps new DSP architecture, drops Parthus name (Monday Nov. 24, 2003)
  Ceva preps new DSP architecture, drops Parthus name
  
  
• VOCAL Provides Its AES-128 for DTCP Using Industry-Standard Microprocessors (Wednesday Nov. 19, 2003)
  VOCAL Provides Its AES-128 for DTCP Using Industry-Standard Microprocessors
  
  
• New IndigoVision's IV8102 chip provides high resolution MPEG-4 Codec on a chip (Tuesday Nov. 18, 2003)
  New IndigoVision's IV8102 chip provides high resolution MPEG-4 Codec on a chip
  
  
• ARM Expands Its Smart Card Product Portfolio with ARM SecurJC Technology (Tuesday Nov. 18, 2003)
  ARM Expands Its Smart Card Product Portfolio with ARM SecurJC Technology
  
  
• Eureka Technology Unveils PCI Express Bus Controller IP Cores (Monday Nov. 17, 2003)
  Eureka Technology Unveils PCI Express Bus Controller IP Cores
  
  
• VOCAL Introduces Optimal CTR-AES, CBC-MAC-AES, and CCMP-AES Encryption Cores for 802.11i (Monday Nov. 17, 2003)
  VOCAL Introduces Optimal CTR-AES, CBC-MAC-AES, and CCMP-AES Encryption Cores for 802.11i
  
  
• Lattice Semiconductor Introduces Low Power Field-Programmable System-on-a-Chip for SPI4.2 Solutions (Monday Nov. 17, 2003)
  Lattice Semiconductor Introduces Low Power Field-Programmable System-on-a-Chip for SPI4.2 Solutions
  
  
• VOCAL Adds AES Functionality to MIPS Technologies' New 32-Bit Pro Series Cores (Wednesday Nov. 12, 2003)
  VOCAL Adds AES Functionality to MIPS Technologies' New 32-Bit Pro Series Cores
  
  
• Nuvation Introduces GEOS 2+2 IP Core (Wednesday Nov. 12, 2003)
  Nuvation Introduces GEOS 2+2 IP Core
  
  
• Synopsys DesignWare USB Host and PHY IP Are First To Attain Hi-Speed USB 2.0 Logo Certification (Tuesday Nov. 11, 2003)
  Synopsys DesignWare USB Host and PHY IP Are First To Attain Hi-Speed USB 2.0 Logo Certification
  
  
• Xignal Technologies Releases Groundbreaking VCSEL-Driver Design for Single-Package Hybrids (Monday Nov. 10, 2003)
  Xignal Technologies Releases Groundbreaking VCSEL-Driver Design for Single-Package Hybrids
  
  
• Altera and Innocor Announce SerialLite, Industry’s First Open Lightweight High-Speed Serial Protocol (Monday Nov. 10, 2003)
  Altera and Innocor Announce SerialLite, Industry’s First Open Lightweight High-Speed Serial Protocol
  
  
• TriCN introduces DDR FCRAM II Interface Technology (Monday Nov. 10, 2003)
  TriCN introduces DDR FCRAM II Interface Technology
  
  
• QuickCores announces FREE microcontroller CPU netlist library (Sunday Nov. 09, 2003)
  QuickCores announces FREE microcontroller CPU netlist library
  
  
• eASIC Was Awarded an Additional Patent for its Configurable Structured ASIC Technology (Thursday Nov. 06, 2003)
  eASIC Was Awarded an Additional Patent for its Configurable Structured ASIC Technology
  
  
• Ericsson has qualified the first product based on the newly released Bluetooth 1.2 Specification (Thursday Nov. 06, 2003)
  Ericsson has qualified the first product based on the newly released Bluetooth 1.2 Specification
  
  
• MoSys' 1T-SRAM-Q technology to be offered on Chartered's 013-micron logic process (Monday Nov. 03, 2003)
  MoSys' 1T-SRAM-Q technology to be offered on Chartered's 013-micron logic process
  
  
• Virtual Silicon Introduces Industry-Leading Signal Integrity Views For 130 nm Standard Cells (Monday Nov. 03, 2003)
  Virtual Silicon Introduces Industry-Leading Signal Integrity Views For 130 nm Standard Cells
  
  
• Genesys Testware develops design and test flow for increasing IC yield using Artisan Flex-Repair memories with ArraytestMaker repair (Thursday Oct. 09, 2003)
  Genesys Testware develops design and test flow for increasing IC yield using Artisan Flex-Repair memories with ArraytestMaker repair