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IP / SOC Products News

• CSEM's new Sub-1V Bluetooth Smart RF transceiver IP offers best-in-class per-formance for wearable sensors and IOT (Thursday Aug. 21, 2014)
  CSEM has announced the availability of IcyTRX-65, a 2.4GHz sili-con RF IP optimised for low power Bluetooth Smart (Bluetooth Low Energy) circuits. Consuming only 5mW and directly powered from a 1V battery, IcyTRX-65 sets a new benchmark for low pow-er BLE circuits.
  
  
• eMemory Provides Tailor-Made MTP Solutions in Low-Cost Green Process Platforms, Develops Diverse MCU Product Range (Wednesday Aug. 20, 2014)
  eMemory, an embedded non-volatile memory (eNVM) industry leader, who has strong capabilities to excel in both R&D and application realms and has accumulated great quantity in mass production for its proprietary silicon IP solutions. While focusing on the development of advanced technologies, the company remains attentive to the evolution of consumer products and industrial trends.
  
  
• Analog Bits Launches PLL Products for Chinese Semiconductor Market (Tuesday Aug. 19, 2014)
  Analog Bits today announced availability of a new family of core-based PLL products designed specifically for use by China’s fast growing semiconductor community.
  
  
• Northwest Logic's PCI Express Gen3 Core and S2C's Virtex-7 ASIC Prototyping Platform fully validated together (Monday Aug. 18, 2014)
  Northwest Logic and S2C, Inc. announced today that Northwest Logic’s PCI Express® (PCIe®) 3.0 solution, including the Expresso 3.0 Core (PCI Express 3.0 Controller Core) and family of DMA Cores has been validated on S2C’s ASIC prototyping platforms. These cores are now the latest addition to S2C’s Prototype Ready™ IP suite.
  
  
• Dolphin Integration announce the availability of their Reusable Power Kit Library at TSMC 180 nm eLL (Monday Aug. 18, 2014)
  
  
  
• MagnaChip to Offer Competitive Embedded Multiple Time Programmable (MTP) IP Solutions (Monday Aug. 11, 2014)
  MagnaChip, a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products, today announced that it has signed a joint development agreement with Yield Microelectronics Corporation (YMC) to develop a family of embedded 0.18um standard Multiple Time Programmable (MTP) IP solutions.
  
  
• Dolphin Integration reveal high quality and common-mode noise-resilient audio CODEC targeting automotive infotainment application (Monday Aug. 11, 2014)
  Dolphin Integration offer an audio CODEC targeting automotive infotainment applications, sCODS100-N.11-Xenon, providing optimal voice command and in-cabin phone conversation performances for best-in-class listening sound system.
  
  
• DMP Launches the world's smallest GPU IP core for Wearables and Internet of Things (IoT) (Monday Aug. 11, 2014)
  Digital Media Professionals Inc. (DMP) today announced that it has the world’s smallest GPU IP core “ant” for small display that it is expected to be used in Wearables, IoT and other small footprint products.
  
  
• Vidatronic Announces Buck DC-DC Switching Converter IP with Excellent Power Efficiency for Low Power Applications (Wednesday Aug. 06, 2014)
  Vidatronic announces the VBUCK400T110, a Buck DC-DC switching converter IP core in the TSMC 110nm CMOS process. The VBUCK400T110 is optimized for microprocessor, application specific integrated circuit (ASIC), and system-on-a-chip (SOC) integration. The Buck IP core can be used to implement dynamic voltage and frequency scaling (DVFS) for modern microchips.
  
  
• Squid Systems Video Codec Hardware IP Available for Licensing (Wednesday Aug. 06, 2014)
  Squid Systems today announced availability of its programmable SQ400 multi-core architecture and hardware IP for video coding/decoding applications. The scalable SQ400 provides a coherent approach to IC design for multiple video standards and resolutions, for applications including broadcast equipment, cloud-based video servers, consumer DVRs and media gateways, IP cameras, surveillance servers and automotive driver assistance systems.
  
  
• Moortec Semiconductor Announce Transient Voltage Supply Monitor for Advanced Node SoCs (Monday Aug. 04, 2014)
  Moortec Semiconductor, provider of high accuracy on-chip temperature sensors for advanced-node CMOS technologies, announces its Voltage Transient Monitor (VTM) IP which is a part of its Moortec Embedded Die Sensor (MEDS) family. The VTM is a self-contained IP block specially designed to monitor dynamic supply voltage conditions at a continuous sample rate of 1MHz.
  
  
• IP-Maker to showcase new NVMe reference design at Flash Memory Summit (Monday Aug. 04, 2014)
  IP-Maker is announcing the availability of a new NVMe reference design, featuring the full hardware NVMe IP integrated with PCIe and DDR3 controller interconnections.
  
  
• Dolphin Integration launch an innovative IP portfolio for 28 nm multimedia SoC (Monday Aug. 04, 2014)
  As the time is ripe, Dolphin Integration announce their 28 nm offering at TSMC HPM, with a broad range of products to address the pending challenges of multimedia SoC. Based on 30 years of design experience, Dolphin Integration reveal their intent to support leading Fabless companies to reach their stringent objectives of very low power consumption, small silicon area and low Bill-of-Material.
  
  
• TekStart and Pico Computing Partner to Deliver Hybrid Memory Cube (HMC) Intellectual Property (IP) Solutions for Networking, Computing, and Processing Markets (Thursday Jul. 31, 2014)
  Pico Computing and TekStart today announced the availability of Hybrid Memory Cube (HMC) Controller Intellectual Property (IP). HMC technology brings greatly expanded bandwidth (up to 240GB/s) to image processing, packet processing, video processing, and other high-performance computing applications.
  
  
• Cadence Achieves PCIe 3.0 Compliance for PHY and Controller IP (Tuesday Jul. 29, 2014)
  Cadence today announced that its PHY IP and Controller IP for PCI Express® (PCIe®) 3.0 have passed certification tests from PCI-SIG ®. The solutions were tested to their full potential and complied with the full speed of 8GT/s for PCIe 3.0 technology. The compliance assures designers that their system-on-chip (SoC) designs will operate as expected.
  
  
• eMemory NeoEE SIP Expands Wireless Communication ICs Applications (Tuesday Jul. 29, 2014)
  eMemory’s Multiple Times Programmable (MTP) Silicon Intellectual Property (SIP) NeoEE offers simple structure and small micro size for system on chip (SoC) design. Its ability to replace conventional plug-in EEPROM with embedded EEPROM can reduce IC size for achieving compact IC designs and production cost effectively.
  
  
• Ultra high density standard cell library SESAME uHD-BTF to enrich Dolphin Integration's panoply at TSMC 90 nm eF and uLL (Monday Jul. 28, 2014)
  Dolphin Integration are proud to announce the availability of the ultra high density standard cell library at 90 nm LP eFlash and uLL which comes to complete the panoply offering in this node.
  
  
• Ultra-low power 'Whisper' architecture raises the bar for connectivity IP in IoT, wearables and more (Thursday Jul. 24, 2014)
  Imagination Technologies announces the new Ensigma Series4 ‘Whisper’ low-power radio processing unit (RPU) architecture, designed to drive a new generation of wearables, IoT and other connected devices where ultra-low power consumption and low cost points are key.
  
  
• Innovative Logic Inc. and M31 Technology Introduce a USB-IF Certified Complete SuperSpeed USB 3.0 IP Solution (Thursday Jul. 24, 2014)
  Innovative Logic together with M31 Technology jointly announce certification completion of its USB 3.0 device controller IP. Inno-Logic’s USB3.0 Device controller along with PHY from M31 Technology successfully passed all compliance tests and received certification from USB-IF in June 2014.
  
  
• Sonics Upgrades Flagship On-Chip Network to Improve Memory Subsystem Support and Quality of Service (Tuesday Jul. 22, 2014)
  Sonics today introduced a major upgrade of its SonicsGN™ on-chip network intellectual property (IP) that improves support for memory subsystems and provides higher performance with guaranteed bandwidth allocation across multiple system-on-chip (SoC) flows.
  
  
• OFDM Baseband Processor by Noesis Technologies (Monday Jul. 21, 2014)
  Noesis Technologies announced today the immediate availability of its ntOFDM_BBP custom baseband processor, which implements the physical layer of an OFDM, time division duplexing (TDD) system. The baseband processor includes both transmission and reception bit-level and symbol-level processing chains including a sophisticated synchronization unit.
  
  
• Imagination introduces industry's smallest Android GPU solution (Wednesday Jul. 16, 2014)
  Imagination Technologies (IMG.L) announces a new PowerVR graphics processor IP core that provides the industry’s smallest Android compatible GPU solution. This latest addition to the line-up at an incredibly small 0.55mm2 (250MHz in 28nm) silicon footprint features full OpenGL ES 2.0 capability, ultra-low power consumption, and Imagination’s advanced PVRTC texture compression technology.
  
  
• Dolphin Integration announce the availability of new ROM TITAN and ultra low leakage standard cell library SESAME BIV at TSMC 55 nm LP eFlash (Tuesday Jul. 15, 2014)
  Dolphin Integration are proud to announce the availability of the new ROM TITAN and the ultra low leakage SESAME BIV at 55 nm LP eFlash. These two new products come to enrich the large panoply of Dolphin Integration at 55 nm LP eFlash, which now count: RAM, DpRAM, ROM, foundry sponsored ultra-high-density standard cell library and ultra-low-leakage standard cell library.
  
  
• IP-Maker targets FPGA-based data center storage applications (Tuesday Jul. 15, 2014)
  IP-Maker, the expert in intellectual property (IP) for high performance storage applications, is announcing the availability of its IP portfolio on 7-series Xilinx FPGAs, including NVMe (NVM Express), Universal NandFlash Controller and BCH ECC.
  
  
• VeriSilicon Introduces Hantro H2 HEVC Encoder Semiconductor IP (Tuesday Jul. 15, 2014)
  VeriSilicon today announced its next-generation Hantro H2 HEVC video encoder IP. Hantro H2 builds on the success of VeriSilicon’s Hantro H1 encoder IP, bringing ultra-high definition (UHD) and 4K resolution video encoding capability to the HEVC video format.
  
  
• Synopsys Cuts Area of DesignWare NVM IP for Automotive Grade 0 Applications by 75 Percent (Tuesday Jul. 08, 2014)
  Synopsys today announced the availability of the DesignWare AEON Trim NVM IP for high-voltage processes. The new IP is up to 75 percent smaller than alternative NVM IP solutions, helping to reduce the size and cost of automotive ICs.
  
  
• Silicon Vision Delivers Silicon Proven Bluetooth Smart RF IP on HHGrace's 0.11um Technology Platform (Tuesday Jul. 08, 2014)
  Silicon Vision, a leading provider of high-performance, low power radio frequency IP, and Shanghai Huahong Grace Semiconductor Manufacturing Corporation (“HHGrace”), one of the world-leading 8” pure play foundries, have jointly announced today their partnership to deliver Silicon Vision’s Bluetooth low energy (BLE) radio IP on HHGrace’s 0.11μm mixed-signal/RF technology platform.
  
  
• Audio Converter IP - Dolphin Integration exceed STB audio standards with 106 dB of SNR measured on PWM DAC qualifier (Monday Jul. 07, 2014)
  Integration has published the results of their pure digital Audio DAC based on two sound shapers enabling a high versatility in the choice of the application schematics. It confirms their position as the leading IP partner for Set-Top-Box applications.
  
  
• Crossbar Unveils Major Technical Innovation Behind Terabyte Storage-on-a-Chip (Monday Jun. 30, 2014)
  Crossbar, Inc., a start-up company pioneering 3D Resistive RAM (RRAM) technology, today disclosed further details behind its revolutionary non-volatile RRAM technology. The company announced it has demonstrated pre-production 1MB arrays using its patented “1TnR” (1 Transistor driving n Resistive memory cells) selectivity for read/write operations, representing a critical milestone toward commercializing terabyte scale memory arrays on a postage stamp size chip.
  
  
• Arasan Chip Systems Announces Availability of MIPI M-PHY 3.0 Gear 3 IP in UMC40LP (Thursday Jun. 26, 2014)
  -PHY 3.0 Gear 3 on UMC40LP joins the list of process node options, available from Arasan for customers designing UFS 2.0. The PHY has achieved 5.85Gbps performance, with BER smaller than 1E-10.