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IP / SOC Products News

• Dolphin Design announces the successful launch of its first silicon tape out in 12nm FinFet (Thursday Feb. 08, 2024)
  Dolphin Design has reached a significant milestone with the successful tape-out of its first 12 nm FinFet test-chip containing its state-of-the-art audio IPs.
  
  
• VeriSilicon and Innobase jointly launch a 5G RedCap/4G LTE dual-mode modem solution (Wednesday Feb. 07, 2024)
  VeriSilicon (688521.SH) today announced that it has collaborated with Innobase, a wireless communication technology and chip provider, to jointly launch a 5G RedCap/4G LTE dual-mode modem solution.
  
  
• Trilinear Technologies Accelerates Innovation in Automotive Display Connectivity with DisplayPort Automotive Extensions Standard (DP AE) (Tuesday Feb. 06, 2024)
  Trilinear Technologies, a leading provider of cutting-edge technologies for display connectivity and semiconductor solutions, is proud to announce its strategic collaboration with key industry partners to support the integration of VESA’s DisplayPort Automotive Extensions (DP AE) into automotive systems.
  
  
• Arasan's 2nd Gen CAN IP achieves ISO26262 ASIL-C Certification (Tuesday Feb. 06, 2024)
  Arasan announces the ISO26262 ASIL-C functional certification of its 2nd generation CAN Trio supporting CAN 2.0, CAN FD and CAN XL with CANsec IP for secure CAN Bus transactions.
  
  
• Faraday Announces Plans to Develop Arm-based 64-core SoC on Intel 18A Technology (Monday Feb. 05, 2024)
  Faraday Technology Corporation (TWSE: 3035), a leader in ASIC design services and IP solutions, announces its collaboration with Arm and Intel in spearheading the development of a 64-core System-on-Chip (SoC) utilizing Intel 18A technology.
  
  
• AccelerComm Launches PUSCH Channel Simulator for 5G L1 Performance Evaluation (Monday Feb. 05, 2024)
  AccelerComm®, the Layer 1 5G IP specialists, today announced the general availability of its PUSCH Channel End-to-End Simulator, a configurable tool which allows telecoms equipment vendors to evaluate the company’s IP components.
  
  
• Eliyan Sets New Standard for Chiplet Interconnect Performance with Latest PHY Delivering Data Rate of 64Gbps on 3nm Process Using Standard Packaging (Monday Feb. 05, 2024)
  Tape out confirms most efficient and flexible UCIe-, BoW-, and UMI™-compatible multi-die solution for standard or advanced packaging implementations
  
  
• SignatureIP launches its new iNoCulator NoC configuration tool with a free trial offer (Friday Feb. 02, 2024)
  SignatureIP, the pioneer of next generation NoC tools, has launched its new iNoCulator™ NoC configuration tool with a free trial period of two weeks for customers. The NoC (Network on Chip) is the backbone of a chip that provides the interconnect infrastructure between the key processing elements.
  
  
• Nubis Communications and Alphawave Semi Showcase First Demonstration of Optical PCI Express 6.0 Technology (Wednesday Jan. 31, 2024)
  Nubis Communications, Inc., provider of low-latency high-density optical inter-connect (HDI/O), and Alphawave Semi (LN: AWE), a global leader in high-speed connectivity and compute silicon for the world’s technology infrastructure, today announced their upcoming demonstration of PCI Express 6.0 technology driving over an optical link at 64GT/s per lane.
  
  
• Xylon's logicBRICKS HDR ISP IP Suite Gets an RGB-IR Image Processing Upgrade (Thursday Jan. 25, 2024)
  Xylon just upgraded company’s logicBRICKS High Dynamic Range (HDR) Image Signal Processing (ISP) IP Suite with the new RGB-IR image processing module.
  
  
• Logic Fruit Technologies Launches FlexRay RTL IP CORE (Thursday Jan. 25, 2024)
  The FlexRay RTL IP Core boasts a blazing data rate of up to 10 Mbps, making it a standout in the automotive connectivity landscape. As vehicles become more advanced, the demand for synchronization among sensors, actuators, and control units becomes crucial.
  
  
• eMemory's Security-Enhanced OTP Qualifies on TSMC N4P Process, Pushing Forward in High-Performance Leading Technology (Thursday Jan. 25, 2024)
  eMemory announced that its security-enhanced version of One-Time Programmable (OTP), NeoFuse, has achieved qualification on the TSMC N4P process. As a performance-focused enhancement of TSMC’s 5nm family, N4P was optimized to provide a further enhanced advanced technology platform for both HPC and mobile applications.
  
  
• EnSilica adds Post Quantum Cryptography support to eSi-Crypto IP library (Monday Jan. 15, 2024)
  EnSilica, a leading chip maker of mixed-signal ASICs, has added a range of Post-Quantum Cryptography (PQC) accelerators to its eSi-Crypto range of hardware accelerator IP.
  
  
• Digital Blocks AMBA Multi-Channel DMA Controller IP Core Family Extends Leadership with releases for core DMA Engines in RISC-V® & ARM® Systems and Peripherals to Memory Applications (Monday Jan. 15, 2024)
  Digital Blocks offers DMA Controller Verilog IP Core offerings targeting the following system requirements: RISC-V® & ARM® Systems requiring a core scatter-gather DMA Engine for AXI4 Memory to/from Memory data transfers; Systems with streaming data requiring transfer to/from AXI4 Memory and Network Interfaces with AXI4-Stream Interface.
  
  
• Digital Core Design Presents D68000-CPU32+ for well-known 68k family (Thursday Jan. 11, 2024)
  DCD’s latest IP Core is a modern incarnation of CPU32+ based on M68020, which are no longer available, yet still in use in millions of projects. What differs D68000-CPU32+ from other similar solutions is automatic byte alignment feature that is not available in CPU32.
  
  
• Packetcraft and Synopsys Collaborate to Deliver Turnkey Bluetooth Qualified 5.4 PAwR and LE Audio Solutions (Wednesday Jan. 10, 2024)
  Packetcraft unites their commercially shipping Bluetooth Qualified 5.4 Host software with Synopsys’ world-class Bluetooth LE radio and link layer controller IP to enable a broader market with a full turnkey offering from RF-to-application.
  
  
• GUC Taped Out UCIe 32G IP using TSMC's 3nm and CoWoS Technology (Tuesday Jan. 09, 2024)
  Global Unichip Corp. (GUC), the Advanced ASIC Leader, announced today that it has successfully taped out Universal Chiplet Interconnect Express™ (UCIe™) PHY IP with 32Gbps per lane, the highest UCIe speed, for AI/HPC/xPU/Networking applications.
  
  
• VeriSilicon's 2nd generation automotive ISP series IP passed ISO 26262 ASIL B and ASIL D certifications (Tuesday Jan. 09, 2024)
  VeriSilicon today announced its Image Signal Processor (ISP) IP ISP8200-FS and ISP8200L-FS, designed for high-performance automotive applications, have been certified compliant with the ISO 26262 automotive functional safety standard, achieving ASIL B certification for random failures and ASIL D certification for systematic failures, respectively.
  
  
• VeriSilicon unveils the new VC9800 IP for next generation data centers (Monday Jan. 08, 2024)
  VeriSilicon today unveiled its latest VC9800 series Video Processor Unit (VPU) IP with enhanced video processing performance to strengthen its presence in the data center applications.
  
  
• Comcores JESD204D IP core conforming to the Revision D of the JESD204 standard released in Dec'2023 now available (Monday Jan. 08, 2024)
  Now with the release of D revision to the JESD204 Standard in Dec’2023, we are pleased to share that our JESD024D IP is fully compliant with the revised standard, which is characterized with support for Data interface speeds of up to 116 Gbps with PAM4 encoding as well as three types of channels, Extra Short Reach, (XSR), Medium Reach, (MR), & Long Reach, (LR) and the RS-FEC link layer, is now available for commercial purchase.
  
  
• Omni Design Technologies Unveils Next-Gen LiDAR Solutions with Swift™ Data Converters (Friday Jan. 05, 2024)
  Omni Design Technologies today announced their expanded silicon IP solutions, on advanced FinFET nodes, for next generation LiDAR (Light Detection and Ranging) applications.
  
  
• Andes Announces General Availability of the New RISC-V Out-Of-Order Superscalar Multicore Processor, the AndesCore™ AX65 (Friday Jan. 05, 2024)
  Equipped with 13-stage pipeline, 4-wide decode, 8-wide out-of-order execution, AX65 targets the Linux application processor sockets of computing, networking, and high-end controllers.
  
  
• Ceva Extends its Connect IP Portfolio with Wi-Fi 7 Platform for High-End Consumer and Industrial IoT (Wednesday Jan. 03, 2024)
  RivieraWaves Wi-Fi 7 IP platform for next generation of Wi-Fi Access Point and Station/Client products, offers full-featured, cost- and power-optimized solutions for integrating high-performance Wi-Fi 7 connectivity into SoCs
  
  
• M31 Successfully Validates 12nm USB4 PHY IP Empowering Next-Generation High-Speed Data Transmission (Wednesday Jan. 03, 2024)
  M31 Technology Corporation (M31), a leading global supplier of silicon intellectual property (IP), announced that the USB4 IP has completed 12nm silicon validation and has been tape-out in 5nm process, and is also actively pursuing development projects for 7nm and 3nm processes.
  
  
• Reed Solomon Encoder and Decoder FEC IP Core From Global IP Core (Wednesday Dec. 20, 2023)
  The Reed Solomon Encoder is fed with an input message of K information symbols, the Encoder appends 2T parity symbols to the input message in order to form the encoded codeword.
  
  
• Alphawave Semi Partners with Keysight to Deliver Industry Leading Expertise and Interoperability for a Complete PCIe 6.0 Subsystem Solution (Friday Dec. 15, 2023)
  Alphawave Semi today announced successful collaboration with Keysight Technologies, a market-leading design, emulation, and test solutions provider, demonstrating interoperability between Alphawave Semi’s PCIe 6.0 64 GT/s Subsystem (PHY and Controller) Device and Keysight PCIe 6.0 64 GT/s Protocol Exerciser, negotiating a link to the maximum PCIe 6.0 data rate.
  
  
• Creonic GmbH Introduces Advanced 5G LDPC Encoder IP core for Enhanced Mobile Broadband Connectivity (Thursday Dec. 14, 2023)
  Creonic GmbH, the leading provider of cutting-edge communications IP cores, proudly introduces the 5G LDPC Encoder IP core, a valuable addition to the diverse product portfolio, including field-proven 5G LDPC Decoders.
  
  
• Alchip Unveils AI 3DIC Design and IP Platform (Wednesday Dec. 13, 2023)
  Alchip Technologies today revealed that the company presented a paper at the TSMC 2023 Taiwan Open Innovation Platform® Ecosystem Forum showcasing its ground-breaking collaborative advanced artificial intelligence (AI) 3DIC chiplet design and integrated IP methodology.
  
  
• Logic Fruit Technologies Launches CAN Controller IP Core (Tuesday Dec. 12, 2023)
  CAN Controller IP Core is uniquely created to deliver advanced communication, offering high-speed versatility for automotive, medical, and industrial connectivity, redefining industry standards.
  
  
• Digital Core Design Presents DAES XTS Cryptographic CPU for Unparalleled Security (Tuesday Dec. 12, 2023)
  DAES XTS IP Core from Digital Core Design is a compact cryptographic co-processor designed for seamless implementation of the Rijndael encryption algorithm in compliance with FIPS 197 Advanced Encryption Standard, specifically in XTS mode (in accordance with IEEE Std 1619-2007 standards.