M31 high density and low power IP solutions on TSMC 55nm embedded flash technology

Hsinchu, Taiwan – April 10^th, 2014-- The boutique Intellectual Property (IP) provider M31 Technology announced its IP development completion on TSMC 55nm embedded flash technology. These IP address high-speed data processing, graphics computing, power IC management, and portable telecommunication designs. They have passed TSMC9000 physical review and pre-silicon stage, and are ready for design integration.

In a variety of the rapidly growing applications such as “Touch Sensor,” “Micro Controller,” and “Smart Card,” embedded flash is widely used for code storage, reducing design cycles and lowering manufacturing costs.

Today M31 IP products on TSMC 55nm embedded flash technology include “High Density Standard Cell Library,” “One Port Register File SRAM Compiler,” “Single Port SRAM Compiler,” “Dual Port SRAM Compiler,” “Via ROM compiler,” and “USB2.0 OTG.” M31 will continue to develop and introduce more functional IP on this process later. With its reliable quality, these IP will help customers design competitive products with low power-consumption and lower manufacturing cost.

Being optimistic about the growth of global touch panel capacity, the increased shipments of microprocessors, as well as the market potential for 10 billion smart card chips, the IP on 55nm embedded flash process will enhance customer competitiveness and expand their diverse business opportunities.

“Because of its many technical advantages, this series of IP has been applied on a touch controller component by a well-known international IC maker,” said H.P. Lin, Chairman of M31 Technology.

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