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Deals / Success Stories News
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Arteris' FlexNoC Again Chosen by AppliedMicro for X-Gene Server-on-Chip Products (Wednesday Apr. 01, 2015)
Arteris today announced that AppliedMicro, also known as Applied Micro Circuits Corporation, has selected Arteris® FlexNoC® for use in its X-Gene™ Server on a Chip Solutions.
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RDA Selects Chips&Media's HD video technology for Mobile AP and DTV Platforms (Tuesday Mar. 24, 2015)
Chips&Media, Inc. today announces that RDA Microelectronics has integrated the Chips&Media’s HD multi-standard codec core into its new family of SoC designs, which is available on the market.
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Rambus Licenses Patents and Technology Solutions to IBM (Tuesday Mar. 24, 2015)
Rambus today announced it has signed both patent and technology license agreements with IBM. The patent license agreement authorizes IBM to integrate Rambus memory controller and serial link interface technologies. The technology license agreement will have Rambus develop and deliver high-performance memory interface design IP to enhance IBM systems and semiconductor offerings.
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Argon Design licenses Argon Streams VP9 to Chips&Media (Thursday Mar. 19, 2015)
Argon Design has signed licensing and support agreements for Argon Streams VP9 with leading video codec IP provider Chips&Media.
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Valens Selects Silicon Creations' SerDes IP for the Colligo Chipsets (Wednesday Mar. 18, 2015)
Valens, the developer of HDBaseT™ technology, has integrated Silicon Creations’ custom Digital Interface (HDI) SerDes Intellectual Property (IP) into the VS2310 and VS2110 chipsets, part of the Valens’ Colligo family of HDBaseT Spec 2.0-compliant chipsets.
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Hycon Technology Selects Andes N8 CPU Core for Next Generation High-End 24-bit Analog-to-Digital Converter (Wednesday Mar. 18, 2015)
Andes Technology today announced that Hycon Technology, based in Taipei City Taiwan, selected the Andes high performance, low gate count, low power architecture N8 32-bit processor core for Hycon's next generation high-end 24-bit Analog-to-Digital Converter (ADC).
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Rockchip Licenses Arteris FlexNoC Fabric IP for RK Series SoCs (Wednesday Mar. 18, 2015)
Arteris today announced that Rockchip, a leading fabless semiconductor company and mobile system-on-chip (SoC) provider, has chosen Arteris® FlexNoC® fabric IP to be the on-chip communications backbone for its complete RK series of application processor SoCs.
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SystemC-based UVM testing from TVS streamlines IP for Blu Wireless Technology (Thursday Mar. 12, 2015)
TVS today announced the successful completion of SystemC-based UVM software testing for Blu Wireless Technology.
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Lenovo Selects Elliptic Technologies for Embedded Hardware Security Solutions (Wednesday Mar. 11, 2015)
Elliptic Technologies today announced that one of the world's largest and most innovative PC and mobile internet device manufacturers, Lenovo, has selected Elliptic Technologies for high performance security solutions to be deployed into the latest Lenovo internet mobile payment products.
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Nufront Selects Uniquify DDR Subsystem IP to Support Advanced 28nm SoC Project (Tuesday Mar. 10, 2015)
Uniquify today announced an agreement with Nufront of Beijing, China, to provide a high-performance DDR subsystem IP solution that supports DDR4, DDR3, LPDDR3 and LPDDR2 protocols.
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Global Unichip Corporation Utilizes Cadence Analog IP to Implement WiGig-Enabled SoC on 28nm Process (Wednesday Mar. 04, 2015)
Cadence today announced that Global Unichip Corporation (GUC) achieved first-silicon success integrating tri-band analog front-end (AFE) intellectual property (IP) with WiGig (IEEE 802.11ad), enabling integration of digital logic and analog monolithic die in an advanced 28nm complementary metal-oxide semiconductor (CMOS) process.
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Sibridge Technologies announces customer adoption of USB 3.1 Verification IP (Tuesday Mar. 03, 2015)
Sibridge today announced the adoption of its USB 3.1 Verification IP solution by a leading semiconductor company.
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Imagination's MIPS CPUs power Sequans' newest Colibri and Calliope LTE chipset platforms for IoT and M2M (Monday Mar. 02, 2015)
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Arteris FlexNoC Helps Enable Texas Instruments Wireless Connectivity for the Internet of Things (IoT) (Wednesday Feb. 25, 2015)
Arteris today announced that Texas Instruments (TI) has implemented Arteris® FlexNoC® fabric IP in its SimpleLink™ ultra-low power wireless MCU portfolio.
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S3 Group's Video Data Converter IP Selected by GEO Semiconductor (Tuesday Feb. 24, 2015)
S3 Group today announced that Geo Semiconductor Inc. has selected Data Converter IP from its family of Video Digital to Analogue Converters (DAC), to be used in their next generation of video processing IC’s.
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eSilicon Uses Sonics' Flagship On-chip Network in Complex SoC Design (Tuesday Feb. 24, 2015)
Sonics today announced that eSilicon Corporation has completed tape out of a system-on-chip (SoC) design using SonicsGN® as the interconnect fabric. eSilicon selected SonicsGN to support its design requirements for rapid IP integration, high bandwidth with NoC throughput in the range of 500 GByte/sec, and ease of physical implementation and fast timing closure during place and route.
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Mindtree Enables Next Generation Bluetooth Low Energy Chips at Cypress (Wednesday Feb. 18, 2015)
Mindtree today announced that its BlueLitE Bluetooth® intellectual property (IP) has been incorporated into the new PSoC® 4 BLE and PRoC™ BLE system-on-chip products from Cypress Semiconductor Corp., a leading provider of programmable solutions.
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eWBM Selects Elliptic's Secure Root of Trust Technology for Newest IoT Chipset (Wednesday Feb. 18, 2015)
Elliptic Technologies today announced that SoC solution provider eWBM has selected Elliptic's tRoot™ technology, a future-proof secure hardware root of trust enabling unique identification and authentication, for their newest IoT chipsets.
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Two Major Enterprise Solid State Disk (SSD) Vendors License Arteris FlexNoC Interconnect IP (Wednesday Feb. 18, 2015)
Arteris today announced that two of the world’s largest enterprise SSD vendors have licensed Arteris FlexNoC fabric IP for use as the communications backbone within their upcoming SSD controller SoCs.
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Epson Improves GPS Watch Battery Life with Cadence Tensilica Xtensa Processor (Tuesday Feb. 17, 2015)
Cadence today announced that Epson has switched from its previous GPS subsystem to one using the Cadence® Tensilica® Xtensa® processor to extend the battery life of its wrist watch GPS running monitors from 14 hours to up to 30 hours when the GPS function is activated.
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Truechip announces first customer shipment of LPDDR3 and LPDDR4 Comprehensive Verification IPs (Tuesday Feb. 17, 2015)
Truechip Solutions announced that it has shipped early adopter version of its LPDDR3 and LPDDR4 Comprehensive Verification IPs (CVIPs) to its partners in the early adoption program.
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Inside Secure Chosen by Leading French Telecom Operator SFR for Mobile Device Content Protection (Thursday Feb. 12, 2015)
INSIDE Secure today announced that French telecom operator leader SFR has signed a license to use INSIDE Secure’s downloadable DRM Fusion™ Agent software to protect the delivery of premium content for a new over-the-top subscription video on-demand service in France.
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MegaChips Utilizes Cadence Tensilica Xtensa Processor in Ultra-Low Power Internet of Things Sensor Hub IC (Tuesday Feb. 10, 2015)
Cadence today announced that the Cadence® Tensilica® Xtensa® processor has been designed as the core of the MegaChips frizz always-on sensor hub IC. MegaChips selected the Xtensa processor after completing a competitive benchmark that showed the Xtensa processor offered over 90 percent lower power consumption when used for pedestrian dead reckoning algorithms, which require Kalman filters.
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T-Mobile launches a Mobile TV platform with Allegro DVT's transcoding solution (Thursday Feb. 05, 2015)
T-Mobile Czech Republic, the number one operator on the Czech mobile market is launching its Mobile TV platform. It has selected Allegro DVT’s transcoders to build its OTT platform, thus providing its 6 million subscribers the possibility to have access to Mobile TV.
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MStar to Use Cryptography Research DPA Countermeasures to Ward Off Attacks in Set-Top Box Solutions (Thursday Feb. 05, 2015)
Rambus today announced that its Cryptography Research Division and MStar, a leading global semiconductor company for display and digital home solutions, have signed a license agreement for the inclusion of advanced DPA countermeasure technologies developed by Cryptography Research in MStar products.
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M31 Technology Adopts Cadence Verification IP to Achieve 2.5X Faster Verification (Wednesday Feb. 04, 2015)
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Espressif Systems Internet of Things WiFi Chips Employ Cadence Tensilica Xtensa Low-Power Processor for Control and DSP (Wednesday Jan. 28, 2015)
Cadence today announced that Espressif Systems has utilized the Cadence® Tensilica® Xtensa® processor in its ESP8089 and ESP8266 WiFi chips that are optimized for Internet of Things (IoT) applications.
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Tezzaron to Incorporate Rambus ReRAM Memory Technology (Friday Jan. 23, 2015)
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Chips&Media had 6 licensees of HEVC Codec IP - WAVE420 in 2014 (Friday Jan. 23, 2015)
Chips&Media Inc., a leading video codec IP provider, announced today that its HEVC codec hardware IP, WAVE420™ has been licensed to 6 worldwide major SoC makers since its first shipment in the first half of 2014.
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Cypress Licenses 40-Nanometer Embedded Flash IP to UMC, Enabling Next-Generation MCUs, IoT and Wearables Applications (Wednesday Jan. 21, 2015)
Cypress and UMC today announced that UMC licensed Cypress’s SONOS (Silicon Oxide Nitride Oxide Silicon) embedded Flash memory intellectual property (IP) for the 40-nanometer process technology node.








