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Deals / Success Stories News
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Imagination Technologies extends its multi-year licensing agreement with Apple (Thursday Feb. 06, 2014)
Imagination announces that Apple has extended its multi-year, multi-use license agreement, which gives Apple access to Imagination's wide range of current and future PowerVR graphics and video IP cores.
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Olympus adopts DMP's Hybrid Graphics IP core for OLYMPUS OM-D E-M1 (Thursday Jan. 30, 2014)
DMP announced today that Olympus has selected DMP 2D/3D hybrid graphics IP core “SMAPH-H” for their OLYMPUS OM-D E-M1, the flagship model of a mirrorless system, integrating DSLR.
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Crocus licenses MLU technology to ARM (Wednesday Jan. 29, 2014)
Crocus Technology, a leading developer of magnetically enhanced semiconductor technologies for mobile security, embedded microcontrollers, harsh environment electronics and magnetic sensors, today announces it has licensed its Magnetic Logic Unit technology to ARM.
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Sonics Licenses On-Chip Network Technology To MediaTek (Wednesday Jan. 08, 2014)
Sonics today announced that it has licensed its on-chip interconnect technology to MediaTek Inc. MediaTek will use Sonics' technology in a forthcoming new line of systems-on-chip (SoC).
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Andes Wins Over Large Publicly Traded Company as Newcomer to Japanese Market (Tuesday Jan. 07, 2014)
After steady efforts to promote AndesCore™, Andes scored its first win in Japan last August by licensing N705-S to a vendor of electrical/electronic equipments. The licensee is a large Japanese publicly traded company with annual revenue of over $2 billion.
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Silicon Image Enables First Televisions Featuring MHL 3.0 Connectivity in Samsung's Ultra High Definition (UHD) TVs (Tuesday Jan. 07, 2014)
Silicon Image today announced that its dual-mode MHL® 3.0/HDMI® 2.0 receiver has been designed into Samsung's latest Ultra High Definition (UHD) TVs.
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Imagination's Ensigma IP provides global broadcast TV demodulation in new Qualcomm Snapdragon 802 processor (Tuesday Jan. 07, 2014)
Imagination Technologies announces that its Ensigma radio communications processing (RPU) IP is integrated in the Qualcomm Snapdragon 802 Ultra HD processor designed for smart TVs, set-top-boxes and digital media adapters from Qualcomm Technologies
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Sequans Powers New Kurio 7x 4G LTE Tablet by Techno Source and KD Interactive (Tuesday Jan. 07, 2014)
Sequans Communications S.A. (NYSE: SQNS) has been selected by Techno Source and KD Interactive, makers of the best-selling Kurio™ line of Android tablets for families with kids, to provide the LTE connectivity for the new Kurio 7x 4G LTE tablet unveiled today at 2014 International CES®. The
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3 of top 20 semiconductor companies adopt Arrow Devices' USB3 Validator (Monday Jan. 06, 2014)
Arrow Devices has just announced adoption of its USB 3 Validator Suite by three of the top 20 semiconductor companies in the world. This announcement is specifically important at a time when USB 3.0 adoption is at its peak with almost all VIP companies have a competing solution in their offering.
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Cadence Licenses Fraunhofer AAC Codecs to Further Expand Tensilica HiFi Audio/Voice Software Library (Monday Jan. 06, 2014)
Cadence and Fraunhofer IIS today announced that Cadence has licensed the full suite of MPEG AAC codecs from Fraunhofer IIS for use with the Tensilica® HiFi DSP. Cadence plans to use the products to enhance the library of over 100 audio/voice software packages optimized for the HiFi DSP family.
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Actions Semiconductor Licenses CEVA-TeakLite-4 Audio DSP and CEVA-Bluetooth IP (Monday Jan. 06, 2014)
Actions Semiconductor Co., Ltd., one of China's leading fabless semiconductor companies that provides comprehensive portable multimedia and mobile internet system-on-a-chip (SoC) solutions for portable consumer electronics, and CEVA, Inc., the leading licensor of silicon intellectual property (SIP) platform solutions and DSP cores, today announced that Actions has licensed the CEVA-TeakLite-4 DSP and CEVA-Bluetooth 4.0 Low Energy IP.
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Taiwan TITC Licenses Compression IP to Panasonic System LSI (Monday Jan. 06, 2014)
Taiwan TITC (TITC) today announced that TITC licensed its compression IP to System LSI Business Division of Panasonic Corporation (Panasonic System LSI). TITC solution helps cutting the memory size of the frame buffer, reducing the requirement of I/O bandwidth, and in some cases easing the EMI problem in system design which is caused by higher data rate and enlarged PCB and complex signal routing.
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Samsung Electronics and Cryptography Research Extend Technology Relationship to Improve Device Security (Monday Jan. 06, 2014)
Samsung Electronics and Cryptography Research, Inc. (CRI), a division of Rambus Inc, today announced an extended relationship, enabling further integration of CRI’s DPA countermeasure technologies across a variety of Samsung semiconductor and system devices.
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Sital's Mil-Std-1553 IP core for FPGA still orbiting the moon on board NASA’s Lunar Reconnaissance Orbiter (Thursday Jan. 02, 2014)
Back in 2005 NASA chose Sital's product after a rigorous selection process during which it was thoroughly tested against several other competing products. The IP core was implemented inside a space environment hardened Field Programmable Gate Array (FPGA) to create a general purpose MIL-STD-1553B Remote Terminal, which is now in use by NASA for more than 20 projects since.
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Sequans adopts Imagination's MIPS Aptiv CPUs for next-generation LTE products (Thursday Dec. 19, 2013)
Imagination Technologiesannounces that Sequans Communications is leveraging its MIPS Aptiv CPUs in the creation of next-generation low-power, cost-effective single-mode LTE solutions targeting a broad range of markets including tablets, M2M, Internet of Things (IoT), wearables and other consumer products.
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Frontier Silicon and Imagination extend partnership to deliver integrated, single-chip solution for global digital radio (Monday Dec. 16, 2013)
As part of their long term ongoing partnership, Imagination Technologies and Frontier Silicon announce that Frontier Silicon is using Imagination’s Ensigma global digital radio platform in the fourth generation of its multi-standard programmable radio ICs, Chorus 4.
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Imagination and ST Microelectronics cooperate to deliver innovative digital radio receiver solution for automotive (Monday Dec. 16, 2013)
Imagination Technologies announces that STMicroelectronics has licensed Ensigma communications processor technology from Imagination for use in a multi-standard programmable radio solution targeted at car radios.
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Sckipio G.fast Technology Zooms Ahead with Arteris FlexNoC IP for Ultra-Fast Broadband (Wednesday Dec. 11, 2013)
Arteris today announced that fabless semiconductor company Sckipio of Tel Aviv, Israel has chosen the Arteris FlexNoC fabric IP for their G.fast chipsets.
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Abilis Systems Achieves First-Pass Silicon Success with DesignWare ARC Processors, Interface IP and Synopsys Professional Services (Monday Dec. 09, 2013)
Synopsys today announced that Abilis Systems has achieved first-pass silicon success with its TB100 8-channel broadcast-to-IP secure media processor using a broad set of Synopsys design solutions including DesignWare® ARC® Processors, Interface IP, Embedded Memories with integrated test and repair, Lynx Design System and Professional Services.
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MediaTek Licenses Memoir's Multiport Memories (Wednesday Nov. 20, 2013)
Memoir Systems announced today that MediaTek, the fourth largest fabless semiconductor company in the world, has licensed Memoir's Renaissance multiport memory IP. MediaTek will gain design flexibility and breakthrough memory performance with multiport functionality.
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Amlogic Answers the UHD Challenge with Landmark Implementation of ARM Mali-450 MP6 GPU (Wednesday Nov. 20, 2013)
ARM and Amlogic today announced the launch of a SoC developed to deliver advanced graphics performance and Ultra High Definition resolutions to class-leading consumer electronics.
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NEC Chooses Altera's 28 nm FPGAs to Differentiate in Competitive LTE Marketplace (Thursday Nov. 14, 2013)
Altera today announced that NEC will use Altera’s 28 nm FPGAs to bring new levels of performance to its Long-term Evolution (LTE) base stations and enable wireless service providers to more effectively manage their networks.
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PLDA and Fastor Systems Announce implementation of PLDA's industry leading PCIe IP with DMA into upcoming NVMe Solid State Drive from Fastor Systems (Thursday Nov. 14, 2013)
PLDA and Fastor Systems today announced the incorporation of PLDA’s PCIe IP with advanced built-in DMA into an upcoming Fastor Systems’ NVMe Solid State Drive.
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Eutecus Multi-core Video Analytics Engine enables traffic management solution (Wednesday Nov. 13, 2013)
Dong Shi Yuan (D.S.Y.) Technologies (Beijing, China) have launched a traffic management solution powered by the Multi-core Video Analytics Engine (MVE) IP of Eutecus embedded in an Altera Cyclone IV FPGA chip.
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Schneider Electric Leverages Arteris FlexNoC for Industrial Control Applications (Tuesday Nov. 12, 2013)
Arteris today announced that Schneider Electric has implemented the Arteris® FlexNoC® interconnect IP fabric for use in its latest industrial control products featuring real-time, extremely low latency Ethernet functionality.
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Sidense OTP Helps Novatek Provide Customers with Cost-Effective and Reliable Display Drivers (Tuesday Nov. 12, 2013)
Sidense Corp., a leading developer of Logic Non-Volatile Memory (LNVM) OTP IP cores, today announced that Novatek Microelectronics Corp. has selected Sidense's 1T-Fuse™-based 1T-OTP memory IP for its display driver ICs for flat-panel displays.
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CoinTerra and Open-Silicon Announce Tape Out of GoldStrike1 ASIC (Monday Nov. 11, 2013)
CoinTerra and design partner Open-Silicon today announce the tape out of GoldStrike1™ 28nm ASIC Chip. The ASIC is expected to exceed 500 Gh/s in hash performance, packing around 1.5 GH/s per mm2 while consuming less than 0.6 W per Gh/s.
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STMicroelectronics and Memoir Systems Combine Breakthrough Memory and Semiconductor Process Technologies (Thursday Nov. 07, 2013)
STMicroelectronics announced today its close collaboration with Memoir Systems has made the revolutionary Algorithmic Memory Technology available for embedded memories in application-specific integrated circuits (ASICs) and Systems on Chips (SoCs) manufactured in ST’s fully-depleted silicon-on-insulator (FD-SOI) process technology.
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Spreadtrum Licenses CEVA-TeakLite-4 Audio/Voice DSP (Tuesday Nov. 05, 2013)
CEVA today announced that Spreadtrum Communications, Inc. (NASDAQ: SPRD; "Spreadtrum") has licensed the CEVA-TeakLite-4 DSP to support advanced audio and voice capabilities in its next-generation smartphone platform System-on-Chip (SoCs).
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Rockchip Extends Partnership With ARM by Subscription License of ARM Processor and GPU Technologies (Tuesday Nov. 05, 2013)
ARM and Rockchip announced today that Rockchip has acquired a subscription license of a broad range of ARM advanced technologies. The agreement gives Rockchip access to ARMv8-A and ARMv7 architecture-based processors including the ARM Cortex®-A57, Cortex-A53 and Cortex-A12 processors, the ARM Mali™ GPU family, as well as ARM CoreLink™ interconnect technology.








